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Method for preparing multilayer thin film and evaluating binding performance thereof

A multi-layer thin film and bonding layer technology, applied in the field of membrane materials, can solve the problems that the binary coating cannot fully meet the needs of use and market demand, achieve optimized performance, improve high temperature resistance and friction resistance, and the principle is simple Effect

Inactive Publication Date: 2017-06-13
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the complexity of working conditions, these binary coatings cannot fully meet the needs of use
The ternary, quaternary and other multi-component hard coatings in the prior art increase the coating performance by adding some metal elements (such as Al, W, Zr, V, Mo, etc.) to the nitride coating, but Still can not meet the market demand

Method used

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  • Method for preparing multilayer thin film and evaluating binding performance thereof
  • Method for preparing multilayer thin film and evaluating binding performance thereof
  • Method for preparing multilayer thin film and evaluating binding performance thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Step (1) Turn on the Teer-UDP650 / 4 type closed-field unbalanced sputtering ion plating equipment to preheat, cool and pass water, turn on the mechanical pump and molecular pump successively, and evacuate to 1.0×10 -4 Pa;

[0035] Step (2) Introduce argon gas, adjust the gas cylinder valve and flow meter, adjust the gas in the vacuum chamber, and make the magnetron target discharge glow;

[0036] Step (3) Plasma cleaning of the substrate surface: adjust the bias voltage of the substrate to -450V, bombard the substrate surface with Ar ions, remove impurities on the substrate surface, and clean for 20 minutes;

[0037] Step (4) Adjust the substrate bias to -100V, turn on two Cr targets at the same time, set the target current to 4A, deposit a layer of pure metal Cr as a base layer, and deposit for 360s.

[0038] Step (5) Adjust the bias voltage of the substrate to -75V, pass in nitrogen gas, deposit the CrN transition layer, control the flow of nitrogen gas through the OE...

Embodiment 2

[0044] Step (1) Turn on the Teer-UDP650 / 4 type closed-field unbalanced sputtering ion plating equipment to preheat, cool and pass water, turn on the mechanical pump and molecular pump successively, and evacuate to 1.0×10 -4 Pa;

[0045] Step (2) Introduce argon gas, adjust the gas cylinder valve and flow meter, adjust the gas in the vacuum chamber, and make the magnetron target discharge glow;

[0046] Step (3) Plasma cleaning of the substrate surface: adjust the bias voltage of the substrate to -450V, bombard the substrate surface with Ar ions, remove impurities on the substrate surface, and clean for 20 minutes;

[0047] Step (4) Adjust the substrate bias to -100V, turn on two Cr targets at the same time, set the target current to 4A, deposit a layer of pure metal Cr as a base layer, and deposit for 360s.

[0048]Step (5) Adjust the bias voltage of the substrate to -75V, pass in nitrogen gas, deposit the CrN transition layer, control the flow of nitrogen gas through the OEM...

Embodiment 3

[0053] Step (1) Turn on the Teer-UDP650 / 4 type closed-field unbalanced sputtering ion plating equipment to preheat, cool and pass water, turn on the mechanical pump and molecular pump successively, and evacuate to 1.0×10 -4 Pa;

[0054] Step (2) Introduce argon gas, adjust the gas cylinder valve and flow meter, adjust the gas in the vacuum chamber, and make the magnetron target discharge glow;

[0055] Step (3) Plasma cleaning of the substrate surface: adjust the bias voltage of the substrate to -450V, bombard the substrate surface with Ar ions, remove impurities on the substrate surface, and clean for 20 minutes;

[0056] Step (4) Adjust the substrate bias to -100V, turn on two Cr targets at the same time, set the target current to 4A, deposit a layer of pure metal Cr as a base layer, and deposit for 360s.

[0057] Step (5) Adjust the bias voltage of the substrate to -75V, pass in nitrogen gas, deposit the CrN transition layer, control the flow of nitrogen gas through the OE...

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Abstract

The invention discloses a method for preparing a multilayer thin film and evaluating binding performance thereof. The method includes: respectively depositing a Cr binding layer, a CrN transition layer and a CrMoAlN functional layer on an H13 matrix through an unbalanced ion sputtering coating process to obtain a Cr-CrN0CrMoAlN multilayer thin film; setting Cr target current to 4A, Al target current to 6A, Mo target current to 0-6A and bias voltage to -75V, and depositing the Cr binding layer for 360s, the CrN transition layer for 600s and the CrMoAlN functional layer for 3600s; conducting a scratch test through a multifunctional scratch tester; acquiring scratch shape on the surface of the thin film through an optical confocal scanning microscope to evaluate the binding performance of the thin film. The multilayer thin film prepared by the method is of a gradient structure, and the binding performance of the thin film is improved by using the Cr layer for bottoming; CrN serving as the transition layer enhances bearing capacity of the thin film; CrMoAlN serving as the functional layer can improve high-temperature resistance and friction resistance of the thin film. A scratch method is adopted to represent difference in the binding performance of the thin film due to Mo content difference.

Description

technical field [0001] The invention belongs to the field of membrane materials, and in particular relates to a method for preparing a Cr-CrN-CrMoAlN multilayer thin film and evaluating its bonding performance. Background technique [0002] Molds are widely used in mass production of plastic parts, die-cast parts, sheet metal parts, formed parts and forged products. Mold processing technology occupies an important position in modern industrial production. Among them, H13 steel, as a hot work die steel, is widely used in hot die forging, hot extrusion die and non-ferrous metal die-casting die. However, due to harsh working conditions, H13 steel is prone to failure at the surface. In order to improve the life and quality of the mold and reduce the cost, a variety of surface modification technologies have been developed at home and abroad to comprehensively improve the hardness, wear resistance, strength, toughness and corrosion resistance of the surface. Among them, PVD coa...

Claims

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Application Information

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IPC IPC(8): C23C28/00C23C14/34C23C14/16C23C14/54C23C16/34C23C16/455C23C16/02
CPCC23C28/34C23C14/0641C23C14/16C23C14/3464C23C14/46C23C14/548C23C16/029C23C16/34C23C16/455
Inventor 楼白杨潘健
Owner ZHEJIANG UNIV OF TECH
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