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Liquid metal thermal interface material with anti-fusing characteristic and preparation method of liquid metal thermal interface material

A thermal interface material, liquid metal technology, applied in the direction of semiconductor/solid-state device parts, circuits, electric solid-state devices, etc., can solve the problems of electronic chip short circuit, lateral leakage, etc., to eliminate short circuit, low production cost, excellent thermal conductivity Effects on performance and chemical stability

Active Publication Date: 2017-06-23
NINGBO SYRNMA METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, when traditional liquid metal is used as a thermal interface material at a temperature near its melting point, it is prone to lateral leakage, which will cause short circuits in electronic chips

Method used

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  • Liquid metal thermal interface material with anti-fusing characteristic and preparation method of liquid metal thermal interface material
  • Liquid metal thermal interface material with anti-fusing characteristic and preparation method of liquid metal thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Example 1: Preparation of the liquid metal thermal interface material 1 of the present invention.

[0033] Alloy raw materials were prepared in the following weight percentages: 22wt% indium, 1.4wt% bismuth, 0.3wt% antimony, 1.6wt% zinc, 0.05wt% silver, 0.02wt% nickel, 0.02wt% cerium, 0.01wt% europium, Sn was margin.

[0034] The above-mentioned proportioned alloy is melted by induction in a graphite crucible, and argon or nitrogen is used as a protective atmosphere. The temperature was kept at 420° C., and electromagnetic stirring was used for 10 minutes for sufficient homogenization. Then pour the melted alloy liquid into the graphite mold for casting. After the alloy is solidified, the alloy ingot is heat treated at 40°C for 3 hours to ensure that the second phase in the alloy is completely precipitated and the alloy has excellent mechanical properties. Then carry out cold rolling at room temperature, and roll to a thickness of 0.05 mm after several rollings, and ...

Embodiment 2

[0036] Example 2: Preparation of the liquid metal thermal interface material 2 of the present invention.

[0037] Alloy raw materials were prepared in the following weight percentages: 28wt% indium, 1.9wt% bismuth, 0.4wt% antimony, 1.8wt% zinc, 0.03wt% silver, 0.01wt% nickel, 0.01wt% cerium, 0.02wt% europium, Sn was margin.

[0038] The above-mentioned proportioned alloy is melted by induction in a graphite crucible, and argon or nitrogen is used as a protective atmosphere. The temperature was kept at 420° C., and electromagnetic stirring was used for 10 minutes for sufficient homogenization. Then pour the melted alloy liquid into the graphite mold for casting. After the alloy is solidified, the alloy ingot is heat treated at 80°C for 3 hours to ensure that the second phase in the alloy is completely precipitated and the alloy has excellent mechanical properties. Then carry out cold rolling at room temperature, and roll to a thickness of 0.05 mm after several rollings, and ...

Embodiment 3

[0040] Embodiment 3: Preparation of the liquid metal thermal interface material 3 of the present invention.

[0041] Alloy raw materials were prepared in the following weight percentages: 32wt% indium, 2.1wt% bismuth, 0.6wt% antimony, 2.9wt% zinc, 0.02wt% silver, 0.03wt% nickel, 0.02wt% cerium, 0.01wt% europium, Sn was margin.

[0042] The above-mentioned proportioned alloy is melted by induction in a graphite crucible, and argon or nitrogen is used as a protective atmosphere. The temperature was kept at 420° C., and electromagnetic stirring was used for 10 minutes for sufficient homogenization. Then pour the melted alloy liquid into the graphite mold for casting. After the alloy is solidified, the alloy ingot is heat treated at 100°C for 3 hours to ensure that the second phase in the alloy is completely precipitated and the alloy has excellent mechanical properties. Then carry out cold rolling at room temperature, and roll to a thickness of 0.05 mm after several rollings, ...

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Abstract

The invention discloses a liquid metal thermal interface material with an anti-fusing characteristic and a preparation method of the liquid metal thermal interface material. The liquid metal thermal interface material with the anti-fusing characteristic is characterized by containing the components in percentage by weight: 20-40wt% of indium, 0-6wt% of bismuth, 0-2wt% of stibium, 0-3wt% of zinc, 0-0.6wt% of silver, 0-0.3wt% of nickel, 0-0.8wt% of cerium, 0-0.6wt% of europium and the balance of tin. The liquid metal thermal interface material with the anti-fusing characteristic has favorable heat conducting property and chemical stability under a working environment of an insulated gate bipolar transistor (IGBT) and is very suitable for IGBT devices in large-scale industrial production and actual application.

Description

technical field [0001] The invention relates to a liquid metal thermal interface material with anti-melting properties and a preparation method thereof, in particular to a liquid metal thermal interface material used in an insulated gate bipolar transistor (IGBT) system and a preparation method thereof. Background technique [0002] As we all know, IGBT devices have become the mainstream devices in the development of power semiconductor devices today due to their high input resistance, fast switching speed, low on-state voltage, high blocking voltage, and large current. They are widely used in various AC motors, In the power electronic circuit of frequency converter, switching power supply, lighting circuit, traction drive and other fields. [0003] But when the IGBT device is working, the heat generated will cause the chip temperature to rise rapidly beyond the maximum allowable IGBT junction temperature. As a result, the performance of the IGBT will be greatly reduced, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00C22C30/06C22C1/02C22F1/16H01L23/373
CPCC22C1/02C22C13/00C22C30/04C22C30/06C22F1/16H01L23/3736C22F1/02C21C1/02
Inventor 刘亚军曹贺全曹帅郭强吴智鑫
Owner NINGBO SYRNMA METAL MATERIALS CO LTD
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