A preparation method of high thermal conductivity and low expansion w-cu packaging material

Abstract

The invention provides a chemical co-precipitation preparation method of nano-W-Cu composite powder suitable for large-scale production, small in particle size, concentrated in distribution and weak in agglomeration. The method utilizes freeze-drying, and has the advantages of simple process, greatly reducing powder agglomeration, low requirements for roasting and reduction time, stable product performance, and large allowable range of stirring speed.

Description

technical field [0001] The invention belongs to the technical field of nano-powder preparation and application, and specifically relates to a preparation method of a W-Cu nano-encapsulation material with high thermal conductivity and low expansion, more precisely, it is prepared by chemical co-precipitation. Background technique [0002] With the continuous improvement of packaging density and high power of integrated circuits, the requirements for electronic packaging materials are becoming more and more stringent. Traditional electronic packaging materials such as Invar, Kovar, W, Mo, etc. can no longer meet the growing needs of the packaging industry due to their single performance, which makes new electronic packaging with low expansion, low density, high thermal conductivity, suitable strength and production cost The development of materials has become very urgent. Generally speaking, due to its adjustable properties, composite materials can make full use of the advanta...

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Problems solved by technology

Therefore, in recent years, many studies have been carried out on the preparation of ultrafine W-Cu composite powders at home and abroad, and remarkable results have been achieved, such as oxide co-reduction method, mechanical alloying method, mechanical thermochemical method, etc., successfully Ultrafine W-Cu powder with good sintering performance has been prepared, but the above-mentioned process also has certain shortcomings, such as the oxide co-reduction method is slightly poor in the uniformity of raw material mixing, while the mechanical alloying method and mechanothermochemical The method often introduces impurities into the powder during the mechanical mixing process, thereby reducing the physical properties of W-Cu composites

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