Copper brazing paste for brazing

A copper solder paste and brazing technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as excessive corrosion and damage, and achieve full solder joint shape, improved spreading rate, and wettability. Good results

Inactive Publication Date: 2017-08-18
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The content of flux in this kind of copper solder paste is as high as 10%. Because fluoroborate is highly corrosive at high temperature, it will cause excessive corrosion and damage to the parts to be welded and t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A copper solder paste for brazing, which is composed of 62% copper-based powder solder, 4% zinc fluoride, 26% compound solvent, 0.6% benzotriazole, 1.4% hydrogenated castor oil and Alkyne diol 6% made by mixing.

[0020] The compound solvent consists of tetrahydrosugar alcohol, triethylene glycol, and diethylene glycol butyl ether in a volume ratio of 40:20:40.

Embodiment 2

[0022] A copper solder paste for brazing, which is composed of 60% copper-based powder solder, 2% copper fluoride, 26.5% compound solvent, 0.5% vitamin C, 3% stearic acid and 8% silicone oil according to the weight percentage Mix made.

[0023] The compound solvent consists of tetrahydrosugar alcohol, triethylene glycol, and diethylene glycol butyl ether in a volume ratio of 45:15:40.

Embodiment 3

[0025] A copper solder paste for brazing, which is composed of 70% copper-based powder solder, 6% tin fluoride, 18% compound solvent, 1% triethylamine, 1% modified castor oil and Alkyne diol 4% made by mixing.

[0026] The compound solvent consists of tetrahydrosugar alcohol, triethylene glycol, and diethylene glycol butyl ether in a volume ratio of 47:13:40.

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Abstract

The invention provides copper brazing paste for brazing. The copper brazing paste for brazing is prepared from the mixed materials comprising, by weight, 60%-70% of copper-based powder brazing filler metal, 2%-6% of brazing flux, 10%-30% of compound solvent, 0.5%-1% of corrosion inhibitor, 1%-3% of thixotropic agent and 4%-8% of activating agent. The brazing flux is zinc fluoride and stannous fluoride or copper fluoride. The compound solvent is composed of tetrahydrofurfuryl alcohol, triethylene glycol and diethylene glycol monobutyl ether, wherein the volume ratio of the tetrahydrofurfuryl alcohol, the triethylene glycol and the diethylene glycol monobutyl ether is 40-50:10-20:30-50. The copper brazing paste for brazing reduces the dosage of a corrosive brazing flux and even eliminates the corrosive brazing flux and has excellent spreading rate and welding performance.

Description

technical field [0001] The invention belongs to the technical field of paste welding materials, and in particular relates to a copper solder paste for brazing. Background technique [0002] With the rapid development of the modern electronics industry, solder paste is an important production link for the welding of electronic products. Traditional solder paste is gradually replaced because it contains a lot of lead and generates a lot of smoke and dust. The use of low-silver solder alloys is an important way to improve lead-free electronic assembly. The development trend of cost performance. In the existing market, there are solder pastes based on SAC305, but its disadvantage is that the cost is relatively high. Therefore, it is urgent to reduce the Ag content in the solder alloy to improve the cost performance of the assembly process. [0003] At present, paste solder has become the key material for microelectronic SMT in industries such as computers, radar and audio equipm...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/363
CPCB23K35/302B23K35/025B23K35/3605B23K35/362
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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