Inorganic heat insulation board and preparation method thereof

Abstract

The invention discloses an inorganic heat insulation board and a preparation method thereof. The inorganic heat insulation board is prepared from, by weight, 20-40 parts of pitchstone glass bead, 1.3-1.7 parts of industrial aluminum sulfate, 13-15 parts of zirconium carbide, 13-15 parts of cement, 2.4-4.5 parts of gypsum, 3-4 parts of attapulgite, 6-7 parts of nanometer waterborne binding agent, 2-2.5 parts of high-strength steel wire imitated fiber, 1-1.2 parts of sodium alkyl benzene sulfonate, 0.2-0.3 part of sulfoaluminate clinker, 5-7 parts of nano-crystalline cellulose, 0.2-0.3 part of 2-ao-3-nitrotoluene, 20-30 parts of lauryl sodium sulfate, 0.7-1.3 parts of ash calcium powder, 3-5 parts of fluorine-containing additive, 5-8 parts of 3-cyan-5-flourine-borophenylic acid, and 0.3-0.9 part of nanometer fumed silica. The heat insulation board is featured by excellent compactness, compressive strength, fireproof property, and high intensity.

Description

technical field [0001] The invention relates to the field of building materials, in particular to an inorganic thermal insulation board and a preparation method thereof. Background technique [0002] At present, commonly used thermal insulation materials at home and abroad include polystyrene foam (EPS, XPS), polyurethane rigid foam (PU), etc., which have the advantages of light weight and good thermal insulation, but these organic foam materials are prone to aging and cannot be compatible with buildings. Things have the same life span. During the service life of the building, the insulation layer needs to be replaced many times, which consumes a lot of manpower, material resources and financial resources. What is more serious is its poor fire safety performance. Fire accidents caused by the ignition of organic thermal insulation materials have occurred repeatedly in various places. During the fire, the smoke is large and the toxicity is high, causing huge economic losses an...

AI Technical Summary

Problems solved by technology

[0002] At present, commonly used thermal insulation materials at home and abroad include polystyrene foam (EPS, XPS), polyurethane rigid foam (PU), etc., which have the advantages of light weight and good thermal insulation, but these organic foam materials are prone to aging and cannot be compatible with buildings. Things have the same lifespan. During the service life of the building, the insulation layer needs to be replaced many times, which consumes a lot of manpower, material resources and financial resources.

What is more serious is its poor fire safety performance. Fire accidents caused by the ignition of organic thermal insulation m