Preparation method of high-temperature interconnection welding spots based on foamy copper

Abstract

The invention provides a preparation method of high-temperature-resistant interconnection welding spots based on foamy copper. An interconnection method is thermal compression welding, specifically, the foamy copper is obtained by corroding a copper-aluminum alloy sheet, and no-solder welding is achieved in the whole process. By conducting welding through the high-temperature-resistant interconnection welding spots containing the foamy copper, low-temperature (260 DEG C) can be achieved, the obtained welding spots can stand high-temperature service, the welding spot reliability and weld joint stability are greatly improved, and the preparation method can be widely applied to various high-temperature welding fields.

Description

technical field [0001] The invention belongs to the interdisciplinary technical field of material physics and material processing, and relates to a method for preparing high-temperature-resistant interconnection solder joints based on foamed copper. Background technique [0002] Due to the generally low parameters such as bandgap width and critical breakdown strength of traditional silicon materials, the development of traditional silicon materials is currently limited. Compared with silicon materials, materials with wider band gaps such as silicon carbide (SiC) and gallium nitride (GaN) have better physical properties, and the power devices made of them have better performance in terms of breakdown voltage, power loss, switching loss, etc. It has great advantages in terms of, and can withstand very high temperature, and can be applied in high power, high frequency and high temperature environment. The chip mounting of the device plays a vital role in the normal operation o...

AI Technical Summary

Problems solved by technology

The advantage of this welding method is that the source of raw materials is wide, the cost is low, and it has high processing compatibility with the current enterprise production line; When the temperature is increased and the growth rate of the intermetallic compound is different, the roughness of the IMC interface increases, and voids are easy to form

[0008] There are many methods for preparing foamed copper materials in the prior art, such as CN105671617A and CN103103513A, etc., but it is still less suitable for high-temperature-resistant interconnection solder joints, and the foamed copper prepared according to the method is difficult to meet the high-temperature service requirements of solder joints

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