A kind of polyimide nano-foam and preparation method thereof

Abstract

The invention provides a polyimide nano foam and a preparation method thereof. The preparation method comprises the following steps: a) reacting a diamine compound, a dianhydride compound and a thermally unstable substance in a solvent to obtain a polyimide nano foam imide film; the diamine compound includes diamine and polysiloxane diamine containing adamantane groups; b) thermally decomposing the polyimide film obtained in step a) to obtain polyimide nano Foam. The present invention adopts the diamine compound including diamine containing adamantane group and polysiloxane diamine as raw material to prepare polyimide nano foam, innovatively introduces polysiloxane structure into polyimide containing adamantane group In the imide molecular chain, the introduced polysiloxane soft segment and the polyimide rigid segment containing adamantane group produce microphase separation, thereby increasing the free volume of the molecule, reducing the polarizability of the molecule, and effectively reducing The dielectric constant and water absorption of the product; increasing the surface tension of the system is conducive to the formation of cells.

Description

technical field [0001] The invention relates to the technical field of polyimide, and more specifically, relates to a polyimide nano-foam and a preparation method thereof. Background technique [0002] At present, with the rapid development of integrated circuits in the field of microelectronics, especially VLSI, microelectronic devices are becoming smaller and smaller, and the number of transistors integrated on a chip is increasing. Therefore, the density of interconnection wiring on the chip is increasing, and the interconnection resistance, inter-line capacitance, and line power consumption increase, resulting in signal transmission delays and even signal distortions such as crosstalk. According to the formula (1) (R is the wire resistance, C is the intralayer and interlayer capacitance, L is the wire length, P is the metal spacing, T is the metal thickness, ρ is the metal resistivity, and k is the dielectric constant of the insulating layer; Dielectric films for advanc...

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Problems solved by technology

However, the former uses highly corrosive HF, and the process is difficult; while the latter replaces highly corrosive HF with dilute hydrochloric acid, although its operability is increased, but most of the pores of the porous polyimide film are obtained by etching. Unicom, and the material prepared by this method has more defects, resulting in a larger water absorption

The Chinese patent application number 201220023402.X obtains different composite polyimide resin solutions by adding porogens of different particle sizes to polyimide resins respectively, and then composites them into multi-layer films. Wash off the porogen with acid to obtain a multi-layer structure porous polyimide film; however, the distribution of pores in the product obtained by this method is disordered and difficult to control, so the various properties are unstable

In addition, the Chinese patent application number 201310428860.0 discloses a porous polyimide nanocomposite film and its preparation method. First, a polyimide / inorganic nanoparticle composite film is prepared, and then the composite film is placed in an inert gas such as carbon dioxide. In an autoclave, the gas is dissolved into the polyimide composite film, wherein the inorganic nanoparticles act as a nucleating agent to make the distribution of the pores more uniform; The amine matrix produces a plasticizing effect, resulting in a lower glass transition temperature of the material

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