A kind of method utilizing electrodeposition method to prepare graphene/copper composite powder

Abstract

A method for preparing graphene / copper composite powder through an electrolytic deposition method is characterized by comprising the following steps that an electrolytic copper sheet serves as an anode, copper foil serves as a cathode, a mixed solution of soluble copper salt, soluble nickel salt and oxidized graphene serves as an electrolyte, direct current electricity is conducted for electrolytic deposition, a certain current density is kept for a period of time, a product obtained through deposition on the cathode is washed through absolute ethyl alcohol, residual impurities are removed, then the cathode is placed in a vacuum drying box to be dried and ground, and the graphene / copper composite powder is obtained. The method solves the problem that difficulty of uniform scattering of the graphene in a copper base body is large, and the graphene is evenly distributed on the copper base body; and the appearance of the prepared graphene / copper composite powder is in a uniform ball shape, and the graphene is evenly scattered in copper powder in a single-layer or few-layer manner. The technology is simple, operation is easy, cost is low, and no special equipment requirement exists in the sample preparing and electrolytic deposition processes.

Description

technical field [0001] The invention belongs to the technical field of metal powder preparation and relates to the preparation of metal functional materials. Background technique [0002] Graphene has extremely high strength and excellent electrical and thermal conductivity (strength is 130 GPa, carrier mobility is 15000 cm 2 / V·s, the thermal conductivity is 5300 W / m·K) and is considered to be the best strengthening phase for high-strength and high-conductivity copper-based composites, but it is difficult to uniformly disperse graphene in the copper matrix and the interface between graphene and copper Poor bonding properties are two major problems in the preparation of graphene-reinforced copper matrix composites. [0003] The most commonly used method for graphene-reinforced copper matrix composites is the ball milling method, but the ball milling method cannot solve the above two problems. Kim et al. Kim W J, Lee T J, Han S H. Multi-layer graphene / copper composites: Pre...

AI Technical Summary

Problems solved by technology

Although the bonding performance of Ni and graphene is higher than that of Cu and graphene, Ni and graphene cannot form primary valent bonds (metallic bonds, ionic bonds or covalent bonds) after sintering. Xu Z P, Buehler M J. Interface structure and mechanics between graphene and metal substrates: a first-principles study, Journal of Physics: Condensed Matter, 22, pp485301, 2010, so even the mixture of Ni-modified graphene and copper powder cannot fundamentally solve the problem

Li Bin. Preparation and performance research of graphene / copper matrix composites[D]. Harbin: Harbin Institute of Technology, 2012. and Li Ruiyu. Preparation, characterization and performance research of graphene / copper composites by improved molecular level mixing method[D] . Wuhan: Wuhan University of Technology, 2014. Using the molecular level mixing method and its improved molecular level mixing method (after drying the mixed solution of graphene oxide and copper ions in H 2 Medium reduction), the graphene / copper composite powder with graphene uniformly distributed in the copper powder was obtained, but the alloy density after sintering was low, and the alloy strength and electrical conductivity were not very ideal

It can be seen that although the molecular level mixing method can solve the problem of difficulty in uniformly dispersing graphene in the copper matrix, it cannot solve the problem of poor interfacial bonding between graphene and copper.

[0004] It can be seen that although there are many preparation methods for graphene / copper composite powder, there is still no practical method that can simultaneously solve the difficulty of uniformly dispersing graphene in the copper matrix and the poor interfacial bonding between graphene and copper. The development of a new preparation method to solve these two major problems of graphene / copper composite powder with better performance has positive practical significance and good application prospects

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