Safe, stable and high-performance wire enamel and preparation method thereof
An enameled wire varnish, safe and stable technology, used in cable/conductor manufacturing, coating, electrical components, etc., can solve the problems of the heating and cooling rate not being effectively controlled, bulging, affecting the performance of enameled wires, etc., to achieve excellent insulation performance, reduce Effect of friction, high bond strength
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2017-10-24
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention relates to the technical field of enameled wire materials, in particular to a safe, stable and high-performance enameled wire varnish and a preparation method thereof. Background technique
[0002] Enameled wire is the most representative product among electronic wires. Enameled wire is a main variety of winding wire, including the core wire and the paint layer coated on the outside of the core wire. After the bare wire is annealed and softened, it is painted and baked many times. It has four major properties: mechanical properties, chemical properties, electrical properties, and thermal properties. Copper-clad aluminum enameled wire and copper-clad aluminum-magnesium enameled wire are new electromagnetic wires that use copper-clad aluminum or copper-clad aluminum-magnesium material as the inner conductor. Its characteristics are between copper and aluminum, combining the excellent conductivity of copper and the light weight of aluminum. ...
Examples
Embodiment 1
[0043] A safe and stable high-performance wire enamel of the present embodiment comprises the following raw materials in parts by weight:
[0044] 25 parts of mixed polymer compound, 15 parts of composite resin, 8 parts of insulating filler, 7 parts of flame retardant additive, 5 parts of nano-additive, 4 parts of processing aid, 30 parts of compound solvent, 3 parts of coupling agent, 1 part of phenol, 1 part of epoxy acrylate, 1 part of triethyl citrate, 1 part of propyl gallate, 4 parts of glycerin, 2 parts of paraffin.
[0045] The mixed polymer compound in this embodiment includes the following raw materials in parts by weight: 2 parts of polyamideimide, 1 part of polyurethane acrylate, 3 parts of tetrakis (2-hydroxyethyl) adipamide, 1 part of tetrabromodiphenylmethane share.
[0046] The composite resin in this embodiment includes the following raw materials in parts by weight: 3 parts of amino resin, 1 part of polyvinyl acetal resin, 2 parts of bisphenol A epoxy resin,...
Embodiment 2
[0062] A safe and stable high-performance wire enamel of the present embodiment comprises the following raw materials in parts by weight:
[0063] 35 parts of mixed polymer compound, 25 parts of composite resin, 14 parts of insulating filler, 11 parts of flame retardant additive, 7 parts of nano-additive, 6 parts of processing aid, 40 parts of compound solvent, 5 parts of coupling agent, 2 parts of phenol, 3 parts of epoxy acrylate, 2 parts of triethyl citrate, 2 parts of propyl gallate, 6 parts of glycerin, 4 parts of paraffin.
[0064] The mixed polymer compound in this embodiment includes the following raw materials in parts by weight: 4 parts of polyamideimide, 3 parts of polyurethane acrylate, 5 parts of tetrakis (2-hydroxyethyl) adipamide, 3 parts of tetrabromodiphenylmethane share.
[0065] The composite resin in this embodiment includes the following raw materials in parts by weight: 5 parts of amino resin, 3 parts of polyvinyl acetal resin, 4 parts of bisphenol A epo...
Embodiment 3
[0081] A safe and stable high-performance wire enamel of the present embodiment comprises the following raw materials in parts by weight:
[0082] 30 parts of mixed polymer compound, 20 parts of composite resin, 11 parts of insulating filler, 9 parts of flame retardant additive, 6 parts of nanometer additive, 5 parts of processing aid, 35 parts of compound solvent, 4 parts of coupling agent, 1.5 parts of phenol, 2 parts of epoxy acrylate, 1.5 parts of triethyl citrate, 1.5 parts of propyl gallate, 5 parts of glycerin, and 3 parts of paraffin.
[0083] The mixed polymer compound in this embodiment includes the following raw materials in parts by weight: 3 parts of polyamideimide, 2 parts of polyurethane acrylate, 4 parts of tetrakis (2-hydroxyethyl) adipamide, 2 parts of tetrabromodiphenylmethane share.
[0084] The composite resin in this embodiment includes the following raw materials in parts by weight: 4 parts of amino resin, 2 parts of polyvinyl acetal resin, 3 parts of b...