Special heat-resistant and anti-corrosion polyurethane composite material for circuit board
A composite material and corrosion-resistant technology, applied in the field of circuit board materials, can solve the problems of poor corrosion resistance, unsatisfactory heat resistance, and limit the application of polyurethane materials, achieve excellent corrosion resistance and thermal stability, and improve heat resistance. properties, excellent heat resistance and strength
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Embodiment 1
[0015] The invention proposes a special heat-resistant and corrosion-resistant polyurethane composite material for circuit boards. The raw materials include: 50 parts of polytetrahydrofuran ether glycol, 10 parts of isophorone diisocyanate, 27 parts of orthobornane diisocyanate, poly 10 parts of phenylene ether, 4.8 parts of poly-p-phenylene, 3 parts of pentylene glycol, 9 parts of dimethylol butyric acid, 2 parts of isophorone diamine, 10 parts of modified attapulgite, 1 part of zirconia, nano 5 parts of calcium carbonate, 0.01 parts of catalyst, 1.5 parts of 3-isocyanatopropyltriethoxysilane, 0.5 parts of soybean protein, 2.8 parts of silk fibroin, 0.3 parts of silica sol, 2 parts of β-cyclodextrin, hydroxyl-terminated poly Butadiene-styrene 2 parts.
Embodiment 2
[0017] A heat-resistant and corrosion-resistant polyurethane composite material for circuit boards proposed by the present invention, its raw materials include by weight: 30 parts of polytetrahydrofuran ether glycol, 25 parts of isophorone diisocyanate, 10 parts of orthobornane diisocyanate, poly 18 parts of phenylene ether, 1 part of poly-p-phenylene, 10 parts of pentylene glycol, 2 parts of dimethylol butyric acid, 10 parts of isophorone diamine, 3 parts of modified attapulgite, 4 parts of zirconia, nano 1 part of calcium carbonate, 0.1 part of catalyst, 0.5 part of 3-isocyanatopropyltriethoxysilane, 2.5 parts of soybean protein, 0.5 part of silk fibroin, 2 parts of silica sol, 0.5 part of β-cyclodextrin, hydroxyl-terminated poly 5 parts of butadiene-styrene.
Embodiment 3
[0019] A special heat-resistant and corrosion-resistant polyurethane composite material for circuit boards proposed by the present invention, its raw materials include by weight: 43 parts of polytetrahydrofuran ether glycol, 15 parts of isophorone diisocyanate, 25 parts of orthobornane diisocyanate, poly 13 parts of phenylene ether, 4.2 parts of poly-p-phenylene, 5 parts of pentylene glycol, 8.2 parts of dimethylol butyric acid, 4 parts of isophorone diamine, 9 parts of modified attapulgite, 1.3 parts of zirconia, nano 4.2 parts of calcium carbonate, 0.03 parts of catalyst, 1.2 parts of 3-isocyanatopropyl triethoxysilane, 0.9 parts of soybean protein, 2.7 parts of silk fibroin, 0.6 parts of silica sol, 1.6 parts of β-cyclodextrin, hydroxyl-terminated poly 2.3 parts of butadiene-styrene;
[0020] Wherein, the modified attapulgite is prepared according to the following process: adding N,N-dimethylacrylamine into absolute ethanol, stirring evenly, adding formaldehyde solution wit...
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Abstract
Description
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