Method for preparing crystalline silicon by using diamond wire cutting wastes of crystalline silicon
A diamond wire cutting and crystalline silicon technology, applied in crystal growth, polycrystalline material growth, chemical instruments and methods, etc., can solve the problem of less research on the utilization of diamond wire cutting waste, and achieve easy industrial production, short process, Easy to operate effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0031] Example 1
[0032] A method for preparing crystalline silicon from diamond wire cutting waste of crystalline silicon is carried out in the following steps:
[0033] (1) The cutting waste is pickled to remove impurities, and the slurry obtained from the pickling is filtered, washed with water, and dried to obtain purified diamond wire cutting waste powder of crystalline silicon. The acid used for pickling and impurity removal is hydrochloric acid (HCl), and the pickling conditions are: acid concentration 5%, pickling temperature 90°C, pickling time 60min, solid-liquid ratio 1:10. During the pickling process, mechanical stirring is used to improve the pickling effect.
[0034] (2) Under the condition of not adding water and binder, the powder after pickling and purification is pressed into blocks by cold isostatic pressing. The pressure used for forming is 300MP, and the holding time is 200s. After forming of blocks.
[0035] (3) The above block is directly cast into a...
Example Embodiment
[0037] Example 2
[0038] A method for preparing crystalline silicon from diamond wire cutting waste of crystalline silicon is carried out in the following steps:
[0039] (1) The cutting waste is pickled to remove impurities, and the slurry obtained from the pickling is filtered, washed with water, and dried to obtain purified diamond wire cutting waste powder of crystalline silicon. The acid used for pickling and impurity removal is sulfuric acid (H 2 SO 4 ), the pickling conditions are: acid concentration 40%, pickling temperature 20°C, pickling time 30min, solid-liquid ratio 1:5. During the pickling process, mechanical stirring is used to improve the pickling effect.
[0040] (2) Mix 20% of water and 5% of binder into the powder after pickling and purification, mix evenly in the mixer, and then use cold isostatic pressing to form the material The briquette is formed under the conditions, the pressure used for forming is 200MP, and the holding time is 5s, and the formed...
Example Embodiment
[0043] Example 3
[0044] A method for preparing crystalline silicon from diamond wire cutting waste of crystalline silicon is carried out in the following steps:
[0045] (1) The cutting waste is pickled to remove impurities, and the slurry obtained from the pickling is filtered, washed with water, and dried to obtain purified diamond wire cutting waste powder of crystalline silicon. The acid used for pickling and impurity removal is hydrofluoric acid (HF), and the pickling conditions are: acid concentration 25%, pickling temperature 50°C, pickling time 300min, solid-to-liquid ratio 1:2. During the pickling process, mechanical stirring is used to improve the pickling effect.
[0046] (2) Mix 40% of water and 10% of binder into the powder after pickling and purification, mix evenly in the mixer, and then press the material under the conditions by molding Block forming, the pressure used for forming is 5MP, and the holding time is 300s to obtain the formed block.
[0047] (3) ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap