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Manufacturing method of ceramic PCB and manufactured PCB

A manufacturing method and technology of ceramics, which are applied in the manufacture of printed circuits, coatings, electrical components, etc., can solve the problems of limited types of ceramic materials, high processing temperature, complicated procedures, etc. simple effect

Inactive Publication Date: 2018-03-30
WUHAN HGLASER ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this process has many advantages, it can only generate Cu(AlO 2 ) 2 and Cu(AlO 2 ) and other composite oxide eutectic phases, so as to complete the direct bonding of copper foil on the ceramic surface, the process is complicated and the cost is high
[0009] In summary, there is a difficulty in ceramic surface metallization, which is a key process for preparing high-performance ceramic PCBs: either the processing temperature is too high, or the types of ceramic materials are limited

Method used

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  • Manufacturing method of ceramic PCB and manufactured PCB

Examples

Experimental program
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Effect test

Embodiment 1

[0029] The process flow of a kind of alumina ceramic PCB provided by this embodiment is as follows: figure 1 As shown, it includes the following steps:

[0030] S1. Put the 0.4mm thick alumina ceramic substrate into an ultrasonic cleaning machine for rinsing, cleaning and drying to complete the degreasing process of the ceramic substrate;

[0031] S2. Send the dried ceramic substrate into a common atmosphere heating furnace and heat it to 350°C, and keep it warm for 10-15 minutes to ensure that the overall temperature of the alumina ceramic substrate tends to be consistent, so as to improve the activation performance of the surface of the ceramic substrate. Among them, the atmosphere heating The furnace is a mixed atmosphere of carbon monoxide 80% + 20% nitrogen (use one or more mixed gases such as hydrogen, carbon monoxide, nitrogen, argon to provide a reducing atmosphere), and the atmosphere heating furnace can be an ordinary industrial electric furnace;

[0032] S3. Use an...

Embodiment 2

[0037] This embodiment takes the method of manufacturing a silicon nitride ceramic PCB with good insulation as an example, which includes the following steps:

[0038] S1. Put the 0.1mm thick silicon nitride ceramic substrate into an ultrasonic cleaning machine for rinsing, cleaning and drying to complete the cleaning process of the silicon nitride ceramic substrate;

[0039] S2. Send the dried high-stability silicon nitride ceramics into an ordinary industrial electric furnace and heat it to 360° C., and keep it warm for 5-8 minutes. Among them, the atmosphere heating furnace is a mixed atmosphere of argon 20%+80% nitrogen (volume ratio );

[0040] S3. Use an industrial conveyor belt to send the silicon nitride ceramic substrate to the position of the next process, and use an infrared thermometer to test the surface temperature of the silicon nitride ceramic substrate. When the temperature of the silicon nitride ceramic surface is above 340°C, enter the spraying process If i...

Embodiment 3

[0045] This embodiment takes the method of preparing an aluminum nitride ceramic PCB with good thermal conductivity as an example to illustrate, which includes the following steps:

[0046] S1. Put the 0.2mm aluminum nitride ceramic substrate into an ultrasonic cleaning machine for rinsing, cleaning and drying to complete the stain cleaning process of aluminum nitride ceramics;

[0047] S2. Send the dried aluminum nitride substrate with good thermal conductivity into an ordinary industrial electric furnace and heat it to 395°C, and keep it warm for 7-10 minutes. );

[0048] S3. Use an industrial conveyor belt to send the aluminum nitride ceramic substrate to the position of the spraying process, and use an infrared thermometer to measure the surface temperature of the aluminum nitride ceramic substrate online. When the surface temperature of the aluminum nitride ceramic substrate is above 345°C, enter the spraying process If it is lower than 345°C, it will return to the ordin...

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PUM

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Abstract

The invention discloses a manufacturing method of a ceramic PCB and a manufactured PCB. The method comprises the following steps of cleaning and drying a ceramic substrate; sending the dried ceramic substrate to an atmosphere heating furnace, heating 350 degree-400 degree, and carrying out heat preservation for set time; adopting an electric arc spraying mode to successively spray a bottom layer metal coating and a copper coating on a ceramic substrate surface whose surface temperature is higher than 300 degree; flattening the copper coating of the ceramic substrate; and carrying out a laser etching step. The manufacturing method of the invention possesses simple processes, a processing temperature is low, bonding strength of the ceramic and metal is high, ceramic material types are not limited, production cost is further reduced and production efficiency is increased. The manufactured PCB possesses characteristics of a high resolution, a current density, overload power and the like.

Description

technical field [0001] The invention relates to the technical field of ceramic PCB board processing, in particular to a method for manufacturing a ceramic PCB and the manufactured PCB. Background technique [0002] With the rapid development of power electronic circuits in the direction of integration and modularization, various new power electronic devices continue to emerge, and the demand for power electronic devices continues to increase, resulting in an increasing demand for high-performance PCBs. At the same time, with the development of electronic and communication equipment in the direction of small size, light weight, high reliability and high speed, especially in order to meet the needs of surface mount technology (SMT), the preparation of high-performance PCB tends to be miniaturized, chip-based, The development of multi-layer, thin-film, and high-reliability requires PCB to have the characteristics of high stability, high thermal conductivity, high temperature re...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K3/00C23C4/131
CPCC23C4/131H05K1/0306H05K3/0011H05K3/0029H05K2203/1333
Inventor 王建刚王雪辉李朋程英
Owner WUHAN HGLASER ENG CO LTD
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