A kind of preparation method of metal mesh conductive film
A transparent conductive film and mesh technology, which is applied in the direction of cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of difficult dispersion, difficult transfer, poor conductivity, etc., achieve strong film adhesion, shorten production cycle, The effect of improving productivity
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Embodiment 1
[0035] The invention provides a method for preparing a metal mesh conductive film, the preparation process of which is as follows: figure 1 As shown, a flexible substrate 1 is taken, and the flexible substrate 1 is made of PET transparent material, and nanospheres 2 are prepared on the flexible substrate 1 by dipping and pulling method, and the nanospheres 2 are made of polystyrene Nano balls, the diameter of the nano balls 2 is 100nm, and the nano balls 2 are etched using an atmospheric pressure plasma etching machine to open the distance between the nano balls 2. The distance between the nanospheres 2 is 30nm, and then the metal layer 3 is prepared by a thermal evaporation process. The material of the metal layer 3 is gold, and the thickness of the metal layer 3 is 50nm. , acetone and deionized water in an ultrasonic cleaning tank to remove the nanoballs 2 on the flexible substrate 1 and the metal layer on the nanoballs, and use a magnetron sputtering process to prepare a tr...
Embodiment 2
[0038] The invention provides a method for preparing a metal mesh conductive film. Take a flexible substrate, use hydrogen peroxide to clean the surface of the flexible substrate, use an air knife to dry the flexible substrate, and then use a plasma cleaning machine to clean the flexible substrate. A flexible substrate, the flexible substrate is made of PI material, and Langmuir-Blodgett (LB) technology is used to prepare nanospheres on the flexible substrate, the nanospheres are silicon dioxide nanospheres, and the nanometer The diameter of the balls is 2000nm, and the atmospheric pressure plasma etching machine is used to etch to open the distance between the nano balls. The distance between the opened nano balls is 300nm, and then the magnetron The metal layer is prepared by a sputtering process, the material of the metal layer is nickel-chromium alloy, the thickness of the metal layer is 1000nm, and the flexible lining is removed successively through an ultrasonic cleaning ...
Embodiment 3
[0041] The invention provides a method for preparing a metal mesh conductive film. Take a flexible substrate, use alcohol to clean the surface of the flexible substrate, use an air dryer to dry the flexible substrate, and then use a plasma cleaning machine to clean the flexible substrate. A flexible substrate, the flexible substrate is made of PI material, and nano-balls are prepared on the flexible substrate by a drop film process. The nano-balls are silicon dioxide nano-balls, and the diameter of the nano-balls is 1000nm, use a heating evaporator to heat and dry the flexible substrate to remove the solvent on the surface of the nanospheres. The panel material of the heating evaporator used is preferably stainless steel, which has excellent corrosion resistance and can be used at high temperatures. No warping and deformation, and then use an atmospheric pressure plasma etching machine to etch to open the distance between the nano-balls. The distance between the nano-balls afte...
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