A kind of oled protective glue and preparation method thereof
A technology of protective glue and main resin, applied in the direction of adhesives, polyether adhesives, non-polymer adhesive additives, etc., can solve the problems of high cost, complicated process, high shrinkage rate, etc., achieve small impact, simple process, easy-to-handle effects
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[0082] The present invention also provides a method for preparing the OLED protective glue described in the above technical solution, comprising the following steps:
[0083] a) mixing the main resin, photocurable monomer, photoinitiator and antioxidant to obtain a reaction mixture;
[0084] b) coating and curing the reaction mixture obtained in step a) to obtain an OLED protective glue.
[0085] In the invention, firstly, the main resin, photocurable monomer, photoinitiator and antioxidant are mixed to obtain a reaction mixture. In the present invention, the main resin, photocurable monomer, photoinitiator and antioxidant are the same as those described in the above technical solution, and will not be repeated here.
[0086]In the present invention, the mixing method is preferably airtight dispersion stirring; the present invention has no special limitation on the airtight dispersion stirring device, and a closed reactor with stirring well known to those skilled in the art c...
Embodiment 1
[0093] (1) The reactor was purged twice with nitrogen, and 100g Kraso was added TM LBH-10000 (molecular weight 10000) and 1g of catalyst KOH, at 130°C and a pressure of 0.25MPa, feed 0.83g of ethylene oxide (EO), react for 4 hours, cool to 60°C, add 3.5g of 20% phosphoric acid After the treatment, viscous liquid A-1 (98g) of hydroxyl-terminated diethoxy polybutadiene was obtained;
[0094] (2) Weigh 90g of A-1, with 1.46g of acrylic acid (AA), 100g of solvent (toluene and cyclohexane with a mass ratio of 1:1), 1.5g of catalyst p-toluenesulfonic acid, 0.01g of polymerization inhibitor Agent hydroquinone methyl ether (MEHQ), 0.1g antioxidant 2,6-di-tert-butyl-4-methylphenol (BHT) mixed, under the condition of 110 ℃, reacted for 7h, and then washed with alkali, water, Distillation under reduced pressure gave photocurable resin A1 (82.1 g).
[0095] The structural formula of the photocurable resin A1 obtained in Example 1 of the present invention is:
[0096]
[0097] The h...
Embodiment 2
[0099] Weigh 90g of A-1 obtained in step (1) of Example 1, add 7.53g of isophorone diisocyanate (IPDI), 0.1g of organic bismuth catalyst into the reaction kettle, pass through the nitrogen protection, at 85 ℃ ~ 90 ℃ conditions , reacted for 4 hours, and then added 1.76g of hydroxyethyl acrylate, and the final product was photocurable resin B1 (97g).
[0100] The structural formula of the photocurable resin B1 obtained in Example 2 of the present invention is:
[0101]
[0102] For the hydrogen nuclear magnetic resonance spectrum of the photocurable resin B1 provided in Example 2 of the present invention, see figure 2 shown.
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Abstract
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