High-heat-conduction and insulating adhesive composition and preparation method thereof

A technology of adhesives and compositions, applied in the directions of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of poor compatibility, reduced adhesive performance and insulation performance of adhesives, low thermal conductivity, etc. The effect of improving dispersibility, improving thermal conductivity, and efficient heat conduction path

Active Publication Date: 2018-05-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

Heat conduction is achieved by adding inorganic thermally conductive fillers to form a thermal conduction path in contact with each other in the polymer system, which has a wide range of applications. However, ordinary inorganic thermally conductive fillers have low thermal conductivity and poor compatibility with polymer systems. The high thermal conductivity can only be achieved at the addition of 90% by weight, which often leads to the reduction of the bonding performance and insulation performance of the adhesive

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  • High-heat-conduction and insulating adhesive composition and preparation method thereof
  • High-heat-conduction and insulating adhesive composition and preparation method thereof

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preparation example Construction

[0042] The preparation of the thermally conductive filler modified by the silane coupling agent is carried out in a solvent, for example, in absolute ethanol solution. The inventors of the present invention found that adjusting the reaction environment to be weakly alkaline is beneficial to the preparation of modified thermally conductive fillers with good performance. For example, the pH of the reaction solution can be adjusted to 8-9. The pH can be adjusted with an alkaline solution, for example, a 10% aqueous NaOH solution.

[0043] When preparing thermally conductive fillers modified by silane coupling agents, in some cases, the surface modification reaction can be accelerated by heating. For example at temperatures around 80° C., sufficient surface modification can be achieved after 30 minutes.

[0044] After the reaction, the reaction solution can be dried to obtain a dry silane coupling agent-modified thermally conductive filler.

[0045] The preparation of isocyanat...

Embodiment 1

[0058] Through the following steps, a high thermal conductivity insulating adhesive composition is prepared, which comprises 50 parts of epoxy adhesive, 330 parts of alumina MZS-330 parts, 20 parts of boron nitride JYBN-001020 parts, 8 parts of graphene oxide, and isophorone in parts by weight. 14 parts of diisocyanate, 1714 parts of coupling agent KH, 10100.6 parts of antioxidant.

[0059] (1) Surface modification of thermally conductive filler: in parts by weight, 4 parts of silane coupling agent KH171 are dissolved in absolute ethanol, and the pH value is adjusted to 8 with 10% aqueous sodium hydroxide solution, and then 30 parts of aluminum oxide and 20 parts of boron nitride were stirred and reacted at 80° C. for 30 minutes, and vacuum-dried to obtain a coupling agent-modified thermally conductive filler.

[0060] (2) Functional modification of graphene oxide: in parts by weight, 8 parts of graphene oxide were added to anhydrous DMF, ultrasonically dispersed for 25 min, 1...

Embodiment 2

[0064] Through the following steps, a high thermal conductivity insulating adhesive composition is prepared, which comprises 60 parts of polyurethane adhesive, 30 parts of aluminum nitride TFZ-N01P, 4 parts of graphene oxide, 13 parts of toluene diisocyanate, and silane coupling agent KH5705 in parts by weight. parts, antioxidant 6260.7 parts.

[0065] (1) Surface modification of thermally conductive filler: in parts by weight, dissolve 5 parts of silane coupling agent KH570 in absolute ethanol, adjust the pH value to 8 with 10% aqueous sodium hydroxide solution, and then add 30 parts of aluminum nitride , stirred and reacted at 80° C. for 30 minutes, and vacuum-dried to obtain a coupling agent-modified thermally conductive filler.

[0066] (2) Functional modification of graphene oxide: in parts by weight, 4 parts of graphene oxide were added to anhydrous DMF, ultrasonically dispersed for 25 min, 13 parts of diphenylmethane diisocyanate were added, and ultrasonically reacted f...

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Abstract

The invention discloses high-heat-conduction and insulating adhesive composition and a preparation method thereof. The high-heat-conduction and insulating adhesive composition is characterized by being prepared from 50 to 90 weight parts of adhesive, 10 to 50 weight parts of heat-conduction filler, 0.1 to 5 weight parts of silane coupling agent, 0.1 to 10 weight parts of oxidized graphene, 0.5 to15 weight parts of isocyanate and 0.1 to 0.8 weight part of antioxidant. The high-heat-conduction and insulating adhesive composition has the advantages of high heat conduction, good insulation, adhesion and water vapor barrier property.

Description

technical field [0001] The invention relates to the field of thermally conductive materials, in particular to a high thermally conductive insulating adhesive composition and a preparation method thereof. Background technique [0002] The rapid growth of people's demand for electronic information products has directly and effectively promoted the development of the electronic information industry. At the same time, the electronic component manufacturing industry, which is the basis of the electronic information industry, is also developing in full swing. On the other hand, with the advancement of science and technology, integration technology and micro-encapsulation technology are also constantly improving in the field of electronics and electrical. Electronic components and electronic equipment are developing towards miniaturization and miniaturization, which also leads to more heat generated in a limited volume. If the heat dissipation is not timely, the excessive accumula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C09J167/00C09J133/04C09J11/04
CPCC08K3/04C08K9/06C08K2003/2227C08K2003/282C08K2003/385C09J11/04C09J133/04C09J163/00C09J167/00C09J175/04
Inventor 左陈曾庆锦茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH
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