A core-shell structure nano-metal interconnection process

Abstract

The invention provides a nano-metal interconnection process with a core-shell structure, comprising: A) printing a nano-particle interconnection material with a core-shell structure on a substrate; the nano-particle interconnection material with a core-shell structure includes a metal shell layer Covered nano copper particles; the metal is selected from one or more of gold, silver, tin, platinum and palladium; B) the chip is covered on the surface of the nano particle interconnection material to obtain a whole device; C) the The monolithic device is sintered to obtain an interconnected device. In the metal-shell-coated nano-copper particles of the present invention, the shell metal has a dense shape, uniform and controllable size, and is easy to undergo atomic diffusion at a relatively low temperature, and is connected with the core-layer nano-copper particles to form a three-dimensional interconnection system. , not only improves the oxidation resistance and stability of nano-copper, but also greatly reduces the interconnection temperature and interconnection conditions. This process can interconnect chips and substrates under low temperature and pressure-free conditions to complete the connection and packaging of electronic devices.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a core-shell structure nano-metal interconnection process. Background technique [0002] Electronic packaging technology is an extension of electronic manufacturing technology. The speed of its development and the technical level and production scale it has achieved directly affect the development of complete machine products or electronic systems. The development power of electronic packaging technology comes from the upgrading of electronic products. One generation of products creates a new generation of technology. With the development trend of light, thin, short and small electronic products and the continuous updating of microelectronics technology, electronic packaging technology is The characteristics of high performance are gradually entering a period of ultra-high-speed development, which also puts forward higher requirements for the interconnection process:...

AI Technical Summary

Problems solved by technology

On the one hand, the high interconnection temperature will pose severe challenges to the heat resistance of interconnection equipment, electronic components and substrate materials. For some electronic devices with poor heat resistance, it is easy to cause device damage at high interconnection temperatures; and, for Some special electronic products such as solar film, LED, LCD, temperature control components, etc. must be interconnected at low temperature; on the other hand, high interconnection temperature is not conducive to energy saving and emission reduction, and the interconnection and packaging of electronic components is the main industry, high-temperature interconnection is bound to cause considerable problems to the energy environment

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