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Preparation method of low-expansibility high-thermal-conductivity carbon composite material

A carbon composite material and high thermal conductivity technology, which is applied in heat exchange materials, chemical instruments and methods, textiles and papermaking, etc., can solve problems such as expansion and volume stability changes, and achieve the effect of reducing expansion performance and improving mechanical properties

Inactive Publication Date: 2018-07-06
胡果青
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for preparing a carbon composite material with low expansion and high thermal conductivity, aiming at the problem that the heat-conducting material is prone to expansion and volume stability changes due to long-term heat-conducting treatment during use.

Method used

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  • Preparation method of low-expansibility high-thermal-conductivity carbon composite material

Examples

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Effect test

example 1

[0019] According to the mass ratio of 1:5, polyimide resin was added to N,N-dimethylacetamide to obtain a mixed solution, which was stirred and mixed at 45°C for 25 minutes, and then N,N-dimethylacetamide was added dropwise. Amide until the solid content of the mixed liquid is 45%, to obtain a dilution; by weight parts, weigh 45 parts of deionized water, 10 parts of aluminum chloride, 3 parts of 200 mesh metal aluminum powder and 1 part of yttrium oxide in a beaker , stirred and mixed and heated in a water bath at 75°C for 25 minutes, left to cool to room temperature and collected the gel solution, and the gel solution was rotary evaporated at 55°C to 1 / 5 of the volume of the gel solution, and then concentrated Gel solution, according to the volume ratio of 1:1, the concentrated gel solution and the diluent are stirred and mixed and placed in an electrospinning device, the positive and negative electrode voltages are controlled to 30kV, the receiving distance is 15cm, and the n...

example 2

[0021] According to the mass ratio of 1:5, polyimide resin was added to N,N-dimethylacetamide to obtain a mixed solution, which was stirred and mixed at 47°C for 27 minutes, and then N,N-dimethylacetamide was added dropwise. Amide until the solid content of the mixed liquid is 45%, to obtain a dilution; by weight parts, weigh 47 parts of deionized water, 12 parts of aluminum chloride, 4 parts of 200 mesh metal aluminum powder and 2 parts of yttrium oxide in a beaker , stirred and mixed and heated in a water bath at 77°C for 27 minutes, left to cool to room temperature and collected the gel liquid, and the gel liquid was rotary evaporated at 60°C to 1 / 5 of the volume of the gel liquid, and then concentrated Gel solution, according to the volume ratio of 1:1, the concentrated gel solution and the diluent are stirred and mixed and placed in an electrospinning device, the positive and negative electrode voltages are controlled to 30kV, the receiving distance is 17cm, and the nozzle...

example 3

[0023] According to the mass ratio of 1:5, polyimide resin was added to N,N-dimethylacetamide to obtain a mixed solution, which was stirred and mixed at 50°C for 30 minutes, and then N,N-dimethylacetamide was added dropwise. Amide until the solid content of the mixed liquid is 45%, to obtain a diluent; in parts by weight, weigh 50 parts of deionized water, 15 parts of aluminum chloride, 5 parts of 200 mesh metal aluminum powder and 2 parts of yttrium oxide in a beaker , stirred and mixed, heated in a water bath at 80°C for 30 minutes, allowed to stand and cooled to room temperature and collected the gel solution, and the gel solution was rotary evaporated at 65°C to 1 / 5 of the volume of the gel solution, and then concentrated Gel solution, according to the volume ratio of 1:1, the concentrated gel solution and the diluent are stirred and mixed and placed in an electrospinning device, the positive and negative electrode voltages are controlled to 30kV, the receiving distance is ...

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Abstract

The invention relates to a preparation method of a low-expansibility high-thermal-conductivity carbon composite material, and belongs to the technical field of carbon fiber materials. Crystalline aluminum chloride, aluminum powder, yttrium oxide and acetic acid are used as raw materials; a modified coating layer is prepared by adopting a sol-gel method; after the surface of a polyimide material iscoated with the modified coating layer, the modified coating layer is calcined, so that polyimide inside the modified coating layer is carbonized to form a carbon fiber material, and the outer coating material forms a yttrium aluminium garnet coating layer covering the surface of carbon fiber through high-temperature calcining; as yttrium aluminium garnet can effectively inhibit a cracking phenomenon occurred during forming of the carbon fiber material under a high-temperature environment, particularly as a uniform and compact microstructure is formed on the surface of the carbon fiber material, cracking caused by volume expansion of the carbon fiber material is obstructed to a certain extent in a high-temperature sintering process, and meanwhile, a protective film is formed on the surface of the carbon fiber material, so that the volume expansion of the carbon fiber material is prevented, and the carbon fiber material effectively forms a compact structure to reduce the expansibilityof the material.

Description

technical field [0001] The invention relates to a preparation method of a carbon composite material with low expansion and high thermal conductivity, belonging to the technical field of carbon fiber materials. Background technique [0002] With the development of science and technology, thermal conductive materials have begun to be used in various industries, and the importance of thermal conductive materials has been paid more and more attention. With the advent of the information age and the development of electronic components, people's requirements for thermally conductive materials are becoming more and more stringent. Thermally conductive materials such as metals have poor processing performance, poor corrosion resistance, and can not meet the insulation requirements, so it is necessary to find new thermally conductive materials to replace them. Polymer materials have been gradually studied in the field of thermal conductivity due to their excellent comprehensive prop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/12C08K9/10C08K7/06D01F9/24C09K5/14
CPCC08K7/06C08K9/10C09K5/14D01F9/24C08L23/12
Inventor 龙国华蒋益
Owner 胡果青
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