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Preparation method of liquid metal fluid with high heat transfer performance

A liquid metal, high heat transfer technology, applied in the field of thermally conductive materials, can solve the problems of large surface tension, non-increasing thermal conductivity, large amount of liquid metal, etc., to reduce contact thermal resistance, high thermal conductivity, and improve utilization. Effect

Inactive Publication Date: 2018-07-24
YUNAN JINGCHUANG LIQUID METAL THERMAL CONTROL TECH RES & DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since there are not many types of low-melting liquid metals to choose from, and they are rare metals, the price is relatively high. At the same time, these devices generate a lot of heat, and relatively speaking, the amount of liquid metal required is relatively large. Add particles with high thermal conductivity to the metal to increase the thermal conductivity of liquid metal, thereby reducing the amount of liquid metal
[0003] At present, the commonly used method is mechanical stirring plus ultrasonic dispersion to add particles, but this method has many limitations
First, liquid metal has a larger surface tension than water and other liquids, which affects the mixing of particles into liquid metal, especially bismuth-based alloys with a higher melting point are difficult to incorporate
Second, in the process of mechanical stirring and ultrasonic dispersion, due to continuous stirring and high speed, the oxidation of liquid metal and doped particles is accelerated, so that the thermal conductivity is not significantly improved
Especially when doping particles with low content, it is easy to make the thermal conductivity not increase but decrease

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Stock solution configuration: Dissolve 3.5g of silver nitrate in 60mL of deionized water, stir the silver solution continuously, slowly add ammonia water until a precipitate is formed, then add ammonia water until the precipitate is completely dissolved; add 2.5g of hydroxide to the above 60mL solution Sodium, the solution turns black, and ammonia water is added until the solution becomes transparent. Reducing solution configuration: Dissolve 4.5g of glucose in 100mL of deionized water, and then add 0.4g of tartaric acid to dissolve in it. After boiling for 10 minutes, cool to room temperature, and then add 10 mL of alcohol. Plating solution configuration: When in use, mix the silver solution and the reducing solution at a volume ratio of 1:1, and it will be black at this time.

[0033] Add 80g of liquid metal (such as gallium indium tin alloy) into the plating solution, and stir magnetically at 20°C for 30 minutes at a speed of 300 rpm. Finally, the liquid metal is w...

Embodiment 2

[0036] Dissolve 10g of anhydrous copper sulfate in 600mL of deionized water; then dissolve 45g of LEDTA and 15mg of potassium nickel cyanide in 400mL of deionized water, add the solution containing copper sulfate to the above 400mL solution while stirring, and then add sodium hydroxide to adjust the pH To 12, finally add 12mL of 37% formaldehyde.

[0037] Add 80g of liquid metal (such as gallium indium tin alloy) into the plating solution, and stir magnetically at 60° C. for 30 minutes at a speed of 300 rpm. Finally, the liquid metal is washed and vacuum-dried to obtain a copper-containing liquid metal fluid.

[0038] The thermal conductivity of Ga76.4InSn alloy is 25.08W / (m·K), and after electroless copper plating treatment by this method, its thermal conductivity is 30.72W / (m·K).

Embodiment 3

[0040] First perform sensitization activation: soak 80g of liquid metal (such as gallium indium tin alloy) in 0.2mol / L NiSO4 at room temperature for 10min, wash with water, and then in KBH 4 Soak in medium for 10min, then add to 0.0024mol / L PdCl activation solution for 10min activation. Then wash with deionized water until neutral.

[0041] Then carry out the plating process: plating solution composition (main salt NiSO 25g / L, reducing agent NaH 2 PO 4 30g / L, complexing agent sodium citrate: 25g / L, buffering agent sodium acetate: 10g / L). Add the liquid metal into the plating solution, and stir it magnetically at 80°C for 35 minutes at a speed of 300 rpm. Finally, the obtained liquid metal is washed and vacuum-dried to obtain a nickel-containing liquid metal fluid.

[0042] The thermal conductivity of Ga76.4InSn alloy is 25.08W / (m·K), and after electroless nickel plating treatment by this method, its thermal conductivity is 26.72W / (m·K).

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Abstract

The invention provides a preparation method of liquid metal fluid with high heat transfer performance. The preparation method comprises the following steps: 1) preparing a stock solution containing metal ions and a corresponding reduction solution, and mixing to prepare an electroless plating solution during use; 2) adding liquid metals into the electroless plating solution, and stirring to enablemetal particles to enter the liquid metals, thereby obtaining the liquid metal containing the metal particles. According to the method provided by the invention, the problems that the liquid metal has extremely high surface tension and metal element particles are difficultly mixed into the liquid metal are solved; since the prepared liquid metal fluid contains particles of different particle sizes, the fluid can be uniformly dispersed inside the liquid metals and has an extremely high heat conductivity coefficient. The fluid can serve as a thermal interface material to reduce thermal contactresistance and can also replace fluid during fluid heat dissipation.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a method for preparing a heat-conducting material based on liquid metal. Background technique [0002] As a new type of material, liquid metal is widely used in computer chip cooling, nuclear reactor cooling and large laser cooling due to its good thermal conductivity. However, because there are not many types of low-melting liquid metals to choose from, and they are rare metals, the price is relatively high. At the same time, these devices generate a lot of heat, and relatively speaking, the amount of liquid metal required is relatively large. Add particles with high thermal conductivity to the metal to increase the thermal conductivity of liquid metal, thereby reducing the amount of liquid metal. [0003] At present, the commonly used method is mechanical stirring plus ultrasonic dispersion to add particles, but this method has many limitations. First, liq...

Claims

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Application Information

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IPC IPC(8): C09K5/08C23C18/44C23C18/40C23C18/36
CPCC09K5/08C23C18/1669C23C18/36C23C18/405C23C18/44
Inventor 雷雄俊郑立聪徐艳琼盛磊刘静
Owner YUNAN JINGCHUANG LIQUID METAL THERMAL CONTROL TECH RES & DEV CO LTD