Preparation method of liquid metal fluid with high heat transfer performance
A liquid metal, high heat transfer technology, applied in the field of thermally conductive materials, can solve the problems of large surface tension, non-increasing thermal conductivity, large amount of liquid metal, etc., to reduce contact thermal resistance, high thermal conductivity, and improve utilization. Effect
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Embodiment 1
[0032] Stock solution configuration: Dissolve 3.5g of silver nitrate in 60mL of deionized water, stir the silver solution continuously, slowly add ammonia water until a precipitate is formed, then add ammonia water until the precipitate is completely dissolved; add 2.5g of hydroxide to the above 60mL solution Sodium, the solution turns black, and ammonia water is added until the solution becomes transparent. Reducing solution configuration: Dissolve 4.5g of glucose in 100mL of deionized water, and then add 0.4g of tartaric acid to dissolve in it. After boiling for 10 minutes, cool to room temperature, and then add 10 mL of alcohol. Plating solution configuration: When in use, mix the silver solution and the reducing solution at a volume ratio of 1:1, and it will be black at this time.
[0033] Add 80g of liquid metal (such as gallium indium tin alloy) into the plating solution, and stir magnetically at 20°C for 30 minutes at a speed of 300 rpm. Finally, the liquid metal is w...
Embodiment 2
[0036] Dissolve 10g of anhydrous copper sulfate in 600mL of deionized water; then dissolve 45g of LEDTA and 15mg of potassium nickel cyanide in 400mL of deionized water, add the solution containing copper sulfate to the above 400mL solution while stirring, and then add sodium hydroxide to adjust the pH To 12, finally add 12mL of 37% formaldehyde.
[0037] Add 80g of liquid metal (such as gallium indium tin alloy) into the plating solution, and stir magnetically at 60° C. for 30 minutes at a speed of 300 rpm. Finally, the liquid metal is washed and vacuum-dried to obtain a copper-containing liquid metal fluid.
[0038] The thermal conductivity of Ga76.4InSn alloy is 25.08W / (m·K), and after electroless copper plating treatment by this method, its thermal conductivity is 30.72W / (m·K).
Embodiment 3
[0040] First perform sensitization activation: soak 80g of liquid metal (such as gallium indium tin alloy) in 0.2mol / L NiSO4 at room temperature for 10min, wash with water, and then in KBH 4 Soak in medium for 10min, then add to 0.0024mol / L PdCl activation solution for 10min activation. Then wash with deionized water until neutral.
[0041] Then carry out the plating process: plating solution composition (main salt NiSO 25g / L, reducing agent NaH 2 PO 4 30g / L, complexing agent sodium citrate: 25g / L, buffering agent sodium acetate: 10g / L). Add the liquid metal into the plating solution, and stir it magnetically at 80°C for 35 minutes at a speed of 300 rpm. Finally, the obtained liquid metal is washed and vacuum-dried to obtain a nickel-containing liquid metal fluid.
[0042] The thermal conductivity of Ga76.4InSn alloy is 25.08W / (m·K), and after electroless nickel plating treatment by this method, its thermal conductivity is 26.72W / (m·K).
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