Stress-regulated ultraviolet multi-wavelength MSM photoelectric detector and preparation method thereof
A photodetector and stress control technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of increasing device volume and increasing difficulty in precise splicing of sub-modules, achieving small device size, high integration, and The effect of simplifying the material structure
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Embodiment 1
[0060] The preparation method of the stress-regulated ultraviolet multi-wavelength MSM photodetector of the overall planar MSM metal interdigitated electrode 5, the steps are as follows:
[0061] 1) Growth buffer layer 3. Ultrashort period superlattice strained layer, specifically:
[0062] 1.1) Using metal-organic vapor phase epitaxy technology, at a high temperature of 1100°C and a reaction chamber pressure of 100Torr, use H 2 Purge the sapphire substrate 4 to remove surface contamination; pre-pass TMA to form an Al-rich surface; then cool down to 570°C and use high-purity H 2 As carrier gas, NH 3 Pass into the reaction chamber to carry out substrate 4 nitriding;
[0063] 1.2) Raise the temperature to 800°C and feed TMA and NH 3 grow an AlN low-temperature buffer layer 3 with a thickness of about 20 nm, and then increase the temperature to 1090° C., and grow an AlN buffer layer 3 with a thickness of about 1 μm on the surface of the sapphire substrate 4 at a low pressure o...
Embodiment 2
[0072] The preparation method of the stress-regulated ultraviolet multi-wavelength MSM photodetector of two sets of independent planar MSM metal interdigitated electrodes 5 is as follows:
[0073] Step 1) The material structure is basically the same as that of Example 1, the main difference is that when the metal interdigitated electrodes 5 are independently arranged on the first ultrashort period superlattice strained layer 1 and the second ultrashort period superlattice strained layer 2 For the upper surface, in step 1.3), the growth period of the second ultrashort period superlattice strained layer 2 is 20 to 200;
[0074] 2) Prepare two sets of independent planar MSM metal interdigitated electrodes 5, specifically:
[0075] 2.1) Use the same chemical cleaning steps as in Example 1 to completely remove the contamination and oxide layer on the surface of the epitaxial material;
[0076] 2.2) Use inductively coupled plasma (ICP) technology to etch the mesa, cover part of the...
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