Preparation method and battery of n-type double-sided battery
A double-sided battery, N-type technology, applied in circuits, electrical components, photovoltaic power generation, etc., can solve the problem of restricting the overall aesthetics of N-type double-sided batteries, destroying the textured structure of N-type double-sided batteries, and low photoelectric conversion efficiency, etc. problems, achieve the effect of improving photoelectric conversion efficiency, increasing open circuit voltage and short circuit current, and small color difference
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[0029] The invention provides a preparation method of an N-type double-sided battery.
[0030] A method for preparing an N-type double-sided battery, comprising the steps of:
[0031] S1. Provide an N-type silicon wafer substrate, and carry out alkali texturing on the upper surface and the lower surface of the N-type silicon wafer substrate to form a first pyramid texture on the upper surface of the N-type silicon wafer substrate. A second pyramid texture is formed on the lower surface of the silicon wafer substrate.
[0032] Among them, the main function of alkali texturing is to improve the light trapping and light energy utilization efficiency of N-type double-sided cells. After alkali texturing, a pyramid texture is formed on the upper and lower surfaces of the N-type silicon wafer substrate, also known as Pyramidal suede structure.
[0033] Preferably, sodium hydroxide solution is used for alkali velvet making, 0.4g-0.6g velvet surface is removed from the upper and lowe...
Embodiment 1
[0094] A preparation method of N-type double-sided glass, comprising the steps of:
[0095] S1, provide 50 pieces of N-type silicon wafer substrates, carry out alkali texturing to the upper and lower surfaces of the N-type silicon wafer substrates, to form the first pyramid textured surface on the upper surface of each N-type silicon wafer substrate, A second pyramid texture is formed on the lower surface of the N-type silicon wafer substrate. Wherein, the alkali texturing process is: use a NaOH solution with a mass concentration of 3% to carry out texturing treatment on the upper and lower surfaces of the N-type silicon wafer substrate, and the texturing weight loss is 0.5g.
[0096] S2. The upper surfaces of 50 N-type silicon wafers after texturing are facing each other in pairs, and inserted into the teeth of the quartz boat, and then the quartz boat is placed in the oxidation furnace tube for wet oxygen thermal oxidation, so that the first pyramid is textured. A first sil...
Embodiment 2
[0107] The preparation process of the N-type double-sided battery of this embodiment is generally the same as that of Embodiment 1, except that:
[0108] Between steps S3 and S4, it also includes etching the edge of the N-type silicon wafer by plasma etching.
[0109] Between steps S4 and S5, the following steps are also included: using the ALD method to prepare an aluminum oxide passivation film on the boron diffusion layer, the film thickness of the aluminum oxide passivation film obtained is 8nm, and finally an N-type double-sided battery is obtained, denoted as A2.
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