Efficient, aging-resistant, corrosion-resistant and novel heat-insulating substation housing
An anti-aging and corrosion-resistant technology, applied in the field of shirt fabrics, can solve the problems of poor heat insulation performance of box-type substations, life of box-type substations less than 30 years, poor corrosion resistance, etc., and achieve good hydrophobicity and high insulation , good corrosion resistance
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Embodiment 1
[0017] A silicone polyimide thermosetting precursor A, in parts by weight, the preparation method of which is: under the protection of nitrogen, add 13 parts of 1,4,5,8-naphthalene tetraphthalene to a reaction kettle with a mechanical stirrer Formic anhydride and 25 parts of tetrahydrofuran, add 20 parts of amino-terminated linear dimethylpolysiloxane (relative molecular weight 800) to it, first heat to 100°C for reflux reaction for 2h, then heat to 130°C for reflux reaction for 1h, to obtain the pre- After cooling the polymer solution, add 4 parts of azodicarbonamide to dissolve and mix evenly, then distill off tetrahydrofuran under reduced pressure to obtain organosilicon polyimide thermosetting precursor A.
[0018] The organosilicon polyimide thermosetting precursor A was heated at 260° C. for 5 hours to obtain the organosilicon polyimide heat insulating material a.
Embodiment 2
[0020] A kind of organosilicon polyimide thermosetting precursor B, in parts by weight, its preparation method is: under the protection of nitrogen, add 13 parts of 1,4,5,8-naphthalene tetra Formic anhydride and 15 parts of tetrahydrofuran, add 14 parts of amino-terminated linear dimethylpolysiloxane (relative molecular weight: 300), first heat to 120°C for reflux reaction for 1h, then heat to 150°C for 0.5h to obtain After cooling the prepolymer solution, add 2 parts of azodicarbonamide to dissolve and mix evenly, then distill off tetrahydrofuran under reduced pressure to obtain organosilicon polyimide thermosetting precursor B.
[0021] The organosilicon polyimide thermosetting precursor B was heated at 200° C. for 8 hours to obtain the organosilicon polyimide heat insulating material b.
Embodiment 3
[0023] A kind of organosilicon polyimide thermosetting precursor C, in parts by weight, its preparation method is: under the protection of nitrogen, add 13 parts of 1,4,5,8-naphthalene tetrachloride to the reaction kettle with mechanical stirrer Formic anhydride and 19 parts of tetrahydrofuran, add 16 parts of amino-terminated linear dimethyl polysiloxane (relative molecular weight: 400), first heat to 1120 ° C for 1.5 h, then heat to 140 ° C for 0.7 h, To obtain a prepolymer solution, after cooling, add 3.5 parts of azodicarbonamide to dissolve and mix evenly, and then distill under reduced pressure to remove tetrahydrofuran to obtain organosilicon polyimide thermosetting precursor C.
[0024] The organosilicon polyimide thermosetting precursor C was heated at 240° C. for 6 hours to obtain the organosilicon polyimide heat insulating material c.
[0025] Test the performance of the silicone polyimide heat insulation material in Examples 1-3 as shown in Table 1. From Table 1, i...
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Abstract
Description
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Application Information

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