Photosensitive conductive paste and method for manufacturing substrate provided with conductive pattern
A conductive paste, photosensitive technology, used in the manufacture of printed circuits, conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, etc., can solve problems such as pattern short circuits, achieve good linearity, resistivity value low effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0073] Next, the photosensitive conductive paste of the present invention will be described by way of examples. The evaluation methods used in each example are as follows.
[0074]
[0075] The photosensitive conductive paste was applied on the PET film so that the film thickness after drying would be 4 μm, and dried in a drying oven at 100° C. for 5 minutes. A group of straight lines arranged in a certain line and space (hereinafter referred to as L / S), that is, a light-transmitting pattern, is used as a unit, and light having 10 types of units with different L / S values is separated. A mask was used to expose and develop the dried coating film to obtain 10 types of patterns with different L / S values. Then, the obtained 10 types of patterns were all cured in a drying oven at a temperature of 140° C. for 30 minutes to obtain 10 types of conductive patterns with different L / S values. Regarding the L / S value of each cell included in the photomask, the line width L (μm) / line...
Synthetic example 1
[0088] (Synthesis Example 1: Compound (B-1))
[0089] Copolymerization ratio (mass basis): ethyl acrylate (hereinafter referred to as EA) / 2-ethylhexyl methacrylate (hereinafter referred to as 2-EHMA) / styrene (hereinafter referred to as St) / glycidyl methacrylate (hereinafter referred to as GMA) / acrylic acid (hereinafter referred to as AA)=20 / 40 / 20 / 5 / 15.
[0090] 150 g of DMEA was thrown into the reaction container of nitrogen atmosphere, and it heated up to the temperature of 80 degreeC using an oil bath. A mixture containing 20 g of EA, 40 g of 2-EHMA, 20 g of St, 15 g of AA, 0.8 g of 2,2'-azobisisobutyronitrile, and 10 g of DMEA was added dropwise thereto over 1 hour. After the dropwise addition was completed, the polymerization reaction was further performed for 6 hours. Then, 1 g of hydroquinone monomethyl ether was added to stop the polymerization reaction. Next, a mixture containing 5 g of GMA, 1 g of triethylbenzyl ammonium chloride, and 10 g of DMEA was added dropwis...
Synthetic example 2
[0091] (Synthesis Example 2: Compound (B-2))
[0092] 164 g of carbitol acetate, 287 g of EOCN-103S (manufactured by Nippon Kayaku Co., Ltd.), 96 g of AA, 2 g of 2,6-di-tert-butyl-p-cresol, and 2 g of Triphenylphosphine was reacted at a temperature of 98° C. until the acid value of the reaction solution became 0.5 mgKOH / g or less to obtain an epoxy carboxylate compound. Next, 57 g of carbitol acetate and 137 g of tetrahydrophthalic anhydride were thrown into this reaction liquid, and it was made to react at the temperature of 95 degreeC for 4 hours, and compound (B-2) was obtained. The acid value of the obtained compound (B-2) was 97 mgKOH / g.
PUM
| Property | Measurement | Unit |
|---|---|---|
| epoxy equivalent | aaaaa | aaaaa |
| particle diameter | aaaaa | aaaaa |
| acid value | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More