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Halogen-free resin composition and coverage film used for flexible printed circuit board and prepared from same

A resin composition, a technology for printed circuit boards, applied in epoxy resin coatings, coatings, fire-retardant coatings, etc., can solve the problem that the cover film cannot meet the technical requirements, and achieve excellent peel strength, excellent toughening effect, ionic low content effect

Active Publication Date: 2018-11-23
湖北恒驰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cover film prepared by carboxyl-terminated nitrile rubber toughened modified epoxy can no longer meet the increasingly stringent technical requirements

Method used

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  • Halogen-free resin composition and coverage film used for flexible printed circuit board and prepared from same
  • Halogen-free resin composition and coverage film used for flexible printed circuit board and prepared from same
  • Halogen-free resin composition and coverage film used for flexible printed circuit board and prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 1. Halogen-free resin composition

[0037] 1. The halogen-free resin composition includes 10 parts of DOPO-type phosphorus-containing epoxy resin, 10 parts of phenol-type novolac epoxy resin, 35 parts of polyurethane and polyamide block copolymer, 10 parts of MQ resin, and 2 parts of dicyandiamide , m-phenylenediamine 3 parts, phosphorus-containing flame retardant (SPB-100) 5 parts.

[0038] 2. The amine value of the polyurethane and polyamide block copolymer is 12mgKOH / g, wherein the number average molecular weight of the polyurethane segment is 1500, and the glass transition temperature Tg is -40°C; the number average molecular weight of the polyamide segment is 3000, the glass transition temperature Tg is 10°C; polyamide segments account for 60% of the total moles of polyurethane and polyamide segments in the copolymer, and polyurethane segments account for 40% of the total moles of polyurethane and polyamide segments in the copolymer %.

[0039] 3. Dissolving, mix...

Embodiment 2

[0043] 1. Halogen-free resin composition

[0044] 1. The halogen-free resin composition includes 15 parts of DOPO-HQ type phosphorus-containing epoxy resin, 10 parts of bisphenol A novolac epoxy resin, 40 parts of polyurethane and polyamide block copolymer, 15 parts of MQ resin, 4 parts , 5 parts of 4'-diaminodiphenyl sulfone, 2 parts of diethylene triamine, 8 parts of phosphorus-containing flame retardant (OP-935).

[0045] 2. The amine value of the polyurethane and polyamide block copolymer is 15mgKOH / g, wherein the number average molecular weight of the polyurethane segment is 1800, and the glass transition temperature Tg is -35°C; the number average molecular weight of the polyamide segment is 3500, the glass transition temperature Tg is 15°C; polyamide segments account for 70% of the total moles of polyurethane and polyamide segments in the copolymer, and polyurethane segments account for 30% of the total moles of polyurethane and polyamide segments in the copolymer %. ...

Embodiment 3

[0050] 1. Halogen-free resin composition

[0051] 1. The halogen-free resin composition includes 20 parts of phosphate ester modified epoxy resin, 15 parts of o-cresol novolac epoxy resin, 45 parts of polyurethane and polyamide block copolymer, 20 parts of MQ resin, 3,3' - 10 parts of diaminodiphenyl sulfone, 15 parts of phosphorus-containing flame retardant (OP-930).

[0052] 2. The amine value of the polyurethane and polyamide block copolymer is 18mgKOH / g, wherein the number average molecular weight of the polyurethane segment is 2200, and the glass transition temperature Tg is -20°C; the number average molecular weight of the polyamide segment is 4500, the glass transition temperature Tg is 20°C; polyamide segments account for 80% of the total moles of polyurethane and polyamide segments in the copolymer, and polyurethane segments account for 20% of the total moles of polyurethane and polyamide segments in the copolymer %.

[0053] 3. Dissolving, mixing and dispersing the...

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Abstract

The invention discloses a halogen-free resin composition. The halogen-free resin composition comprises the following components in parts by weight dispersed in an organic solvent: 10 to 20 parts of phosphorus-containing epoxy resin, 10 to 15 parts of multi-functional epoxy resin, 35 to 50 parts of polyurethane and polyamide segmented copolymer, 10 to 20 parts of MQ resin, 5 to 10 parts of amine curing agent, and 5 to 15 parts of phosphorus-containing flame retardant. The invention also discloses a coverage film used for a flexible printed circuit board and prepared from same. The coverage filmhas excellent flexibility and low ion content, can avoid the branched crystal when in ion migration resistant test, has good insulation performance, and also has excellent stripping strength, heat resistance, size stability, chemical resistance, storage performance and processing performance, and the flame-retardant performance can reach grade UL94 VTM-0.

Description

technical field [0001] The invention relates to the field of polymer composite material manufacturing, in particular to a halogen-free resin composition and a cover film for flexible printed circuits prepared therefrom. Background technique [0002] The cover film for flexible printed circuits is a film-like insulating material made of polyimide film or polyester film coated with glue on one side, and is the most commonly used protective layer for flexible printed circuit boards. Similar to the solder mask of rigid printed circuit boards, but with more powerful functions, it not only acts as a solder mask, but also protects the circuit from damage in the form of dust, moisture, chemical pollution, etc., and has a certain degree of flexibility And reinforcement, reduce the influence of conductor stress during bending, and improve the flex resistance of flexible printed circuit boards. [0003] In the current industry, the most widely used cover film is polyimide film cover f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D175/08C09D163/00C09D163/04C09D183/08C09D5/18C08J7/04C08L79/08
CPCC08J7/0427C08J2379/08C08J2475/08C08L2201/02C08L2201/08C08L2201/22C08L2205/035C09D5/18C09D175/08C08L63/00C08L63/04C08L83/08
Inventor 余鹏飞
Owner 湖北恒驰电子科技有限公司
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