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Dicing die bond film

A die-bonding film and chip-cutting technology, applied in film/sheet-like adhesives, adhesive types, adhesive additives, etc., can solve the problem of reducing cutting speed, fixation, chip adhesion on the side of semiconductor chips, cost Problems such as rising, to achieve the effect of easy pickup

Active Publication Date: 2018-12-07
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the conventional dicing method using a diamond blade, there are concerns about sticking of the die-bonding film and the dicing tape due to the influence of heat generated during dicing, adhesion of semiconductor chips due to generation of shavings, and adhesion of shavings to the side of the semiconductor chip. Therefore, it is necessary to reduce the cutting speed, which leads to an increase in cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0155] (production of cutting tape)

[0156] Add 100 parts by mass of 2-ethylhexyl acrylate (2EHA), 19 parts by mass of 2-hydroxyethyl acrylate (HEA), and benzyl peroxide 0.4 parts by mass of acrylic acid and 80 parts by mass of toluene were polymerized at 60° C. for 10 hours in a nitrogen stream, and a solution containing the acrylic polymer A was obtained.

[0157] 1.2 parts by mass of 2-methacryloyloxyethyl isocyanate (MOI) was added to the solution containing the acrylic polymer A, and an addition reaction was carried out at 50° C. for 60 hours in an air stream to obtain the acrylic polymer A. A' solution.

[0158] Then, 1.3 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Tosoh Corporation) and a photopolymerization initiator (trade name "Irgacure 184", manufactured by BASF Corporation) were added to 100 parts by mass of the acrylic polymer A'. ) 3 parts by mass to prepare adhesive composition A.

[0159] The obtained adhesive compos...

Embodiment 2

[0165] (Manufacturing of Die Bonding Film)

[0166] 100 parts by mass of acrylic resin (trade name "SG-P3", manufactured by Nagase ChemteX Corporation, glass transition temperature: 12° C.), 45 parts by mass of epoxy resin (trade name "JER1001", manufactured by Mitsubishi Chemical Corporation), 50 parts by mass of phenolic resin (trade name "MEH-7851ss", manufactured by Meiwa Chemical Industry Co., Ltd.), 200 parts by mass of spherical silica (trade name "SO-25R", manufactured by Admatechs Co., Ltd.), and a curing catalyst (trade name 1.0 parts by mass of "Curezol 2PHZ", manufactured by Shikoku Chemical Industry Co., Ltd., was added to methyl ethyl ketone and mixed to obtain an adhesive composition B having a solid content concentration of 20% by mass. Then, the die-bonding film B with a thickness of 10 μm was produced by coating on the silicone-treated surface of a PET-based separator (thickness 50 μm), and heating at 130° C. for 2 minutes to remove the solvent. In die-bondi...

Embodiment 3

[0170] (Manufacturing of Die Bonding Film)

[0171] 100 parts by mass of acrylic resin (trade name "SG-P3", manufactured by Nagase ChemteX Corporation, glass transition temperature: 12° C.), 45 parts by mass of epoxy resin (trade name "JER1001", manufactured by Mitsubishi Chemical Corporation), 50 parts by mass of phenolic resin (trade name "MEH-7851ss", manufactured by Meiwa Chemical Industry Co., Ltd.), 130 parts by mass of spherical silica (trade name "SO-25R", manufactured by Admatechs Co., Ltd.), and a curing catalyst (trade name 0.4 parts by mass of "Curezol 2PHZ", manufactured by Shikoku Chemical Industry Co., Ltd., was added to methyl ethyl ketone and mixed to obtain an adhesive composition C having a solid content concentration of 20% by mass. Then, it was applied on the silicone-treated surface of a PET-based separator (thickness 50 μm), and heated at 130° C. for 2 minutes to remove the solvent, thereby producing a die-bonding film C with a thickness of 10 μm. In di...

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PUM

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Abstract

Provided is a cutting chip bonding film in which pickup suitability and chip bonding suitability of the chip bonding film are excellent and floating between the chip bonding film and the adhesive layer is not likely to occur during and after normal temperature expansion. The cutting chip bonding film includes a cutting tape having a substrate and an adhesive layer laminated on the substrate; and achip bonding film laminated on the adhesive layer in the cutting tape, wherein the storage modulus E' of the chip bonding film measured at a frequency of 10 Hz at 25 DEG C is 3 to 5 GPa.

Description

technical field [0001] The present invention relates to dicing die-bonding films. In more detail, this invention relates to the dicing die bonding film which can be used in the manufacturing process of a semiconductor device. Background technique [0002] Conventionally, dicing tapes and dicing die-bonding films have been used in the manufacture of semiconductor devices. The dicing tape is in the form of an adhesive layer provided on the substrate, and is used for arranging semiconductor wafers on the adhesive layer, in order to avoid the The semiconductor chips are fixed by being scattered (for example, refer to Patent Document 1). [0003] Dicing Die-bonding Film The die-bonding film is releasably provided on the adhesive layer of the dicing tape. In the manufacture of a semiconductor device, a semiconductor wafer is held on a die-bonding film for dicing the die-bonding film, and the semiconductor wafer is diced to form individual semiconductor chips. Then, for example...

Claims

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Application Information

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IPC IPC(8): C09J7/25C09J133/04C09J163/00C09J161/06C09J11/04H01L21/683
CPCH01L21/6836C09J7/25C09J11/04C09J133/04C08L2205/03C09J2467/00H01L2221/68327C09J2301/122C08L63/00C08L61/06C08K7/18H01L2224/73265H01L2224/92247H01L2224/83191H01L21/67132H01L24/50
Inventor 大西谦司宍户雄一郎木村雄大福井章洋杉村敏正
Owner NITTO DENKO CORP
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