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Method for electroplating metal on surface of insulating base material

A technology of insulating substrates and electroplating metals, which is applied in the fields of printed circuits, electrical components, and printed circuit manufacturing, and can solve problems such as poor response, weak conductivity of organic conductive polymers, and affecting the conductivity and stability of circuit boards.

Active Publication Date: 2018-12-11
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this process also has an Achilles' heel. Due to the charge characteristics of the treated substrate surface (such as the hole wall), if the substrate is directly treated with a permanganate-containing solution, the secondary particles deposited on the substrate surface, especially the hole wall surface The amount of manganese oxide will be very small, so that the organic conductive film formed on the surface of the substrate will be relatively thin, and the conductivity of the organic conductive polymer is weak, especially in the glass fiber site in the hole of the circuit board. The generation of voids, commonly known as "broken copper", will appear light transmission and voids in the backlight test
In addition, even if no light transmission and voids are produced in the backlight test, if the copper thickness in a certain position in the hole is extremely thin, it will still affect the conductivity and stability of the circuit board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Substrate surface modification: Take two plastic substrates with a thickness of 1.6mm, and use laser to produce through holes with a diameter of 0.2mm and blind holes with a dielectric thickness of 75μm and a diameter of 100μm, and perform the same treatment as follows: first wash with water, and then At 50°C, immerse in 1g / L sodium allyl sulfonate aqueous solution for 4.5 minutes, after washing with water, at 80°C, immerse in 60g / L, pH=6 (adjust with 10g / L boric acid) permanganate Treat in potassium aqueous solution for about 1.5 minutes, wash with water after processing, and set aside.

[0036] Manganese dioxide adsorption test: get one of the processed substrates, use a sufficient amount of 3% (volume fraction) sulfuric acid and 3% (volume fraction) hydrogen peroxide mixed solution to elute the manganese dioxide on the substrate, calculate The adsorption amount (density) of manganese dioxide on the substrate is 38.18μg / cm 2 .

[0037]Copper plating: Immerse another...

Embodiment 2

[0039] Substrate surface modification: take two pieces of glass fiber cloth with a thickness of 1.6mm, and use a laser to produce through holes with a diameter of 0.2mm and blind holes with a dielectric thickness of 75 μm and a diameter of 100 μm on them, and perform the same treatment as follows: first wash with water, then At 30°C, immerse in 5g / L sodium dodecylbenzenesulfonate aqueous solution for about 2 minutes, after washing with water, immerse in 60g / L at 80°C, pH = 6 (adjust with 10g / L boric acid ) in an aqueous solution of potassium permanganate for about 1.5 minutes, washed with water after the treatment, and set aside.

[0040] Manganese dioxide adsorption test: take one of the treated glass fiber cloths, use a sufficient amount of mixed solution containing 3% (volume fraction) sulfuric acid and 3% (volume fraction) hydrogen peroxide to elute the manganese dioxide on the substrate, Calculate the adsorption amount (density) of manganese dioxide on the glass fiber clo...

Embodiment 3

[0043] Substrate surface modification: Take two epoxy resin substrates with a thickness of 1.6mm, and use a laser to produce through holes with a diameter of 0.2mm and blind holes with a dielectric thickness of 75 μm and a diameter of 100 μm on them, and perform the same treatment as follows: first wash with water, Then at 35°C, immerse in 10g / L sodium oleate aqueous solution for about 1.5 minutes, after washing with water, at 80°C, immerse in 60g / L, pH=6 (adjust with 10g / L boric acid) permanganate Treat in potassium aqueous solution for about 1.5 minutes, wash with water after processing, and set aside.

[0044] Manganese dioxide adsorption test: use the same method as in Example 1 to process one of the above-mentioned epoxy resin substrates, and calculate the adsorption amount of manganese dioxide on the substrate to be 64.47 μg / cm 2 .

[0045] Copper electroplating: use the same copper electroplating solution in Example 1 to electroplate copper on another modified substrat...

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Abstract

The invention relates to a method for electroplating metal on the surface of an insulating base material. The method comprises the following steps that the surface of the insulating base material makes contact with a water-soluble anionic compound, so that a modified surface is produced; the modified surface makes contact with an aqueous solution containing permanganate ions, so that a manganese dioxide adsorption layer is formed on the modified surface; a conducting polymer layer is formed on the surface of the manganese dioxide adsorption layer; and electroplating is carried out on the surface of the conducting polymer layer, and thus a metal layer is formed. According to the method, the anionic compound is deposited on the surface of the insulating base material so as to form a coatinglayer tightly combined with the surface of the base material, after the modification and adsorption, an even film with a certain thickness is formed on the surface, thus, under the metal electroplating liquid and electroplating condition are the same, the deep plating capacity and dispersing capacity of the electroplating liquid can be greatly improved, the obtained metal plating layer has the characteristics of being flat, even and good in backlighting effect, and the hole breakout phenomenon and the phenomenon that certain parts of the electroplating metal layer in holes are too thin are avoided.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a method for electroplating metal on the surface of an insulating substrate. Background technique [0002] With the rapid development of the electronic information industry, the printed circuit board (Printed Circuit Board, PCB) industry, which is the carrier of electronic interconnection, is also developing rapidly. From the previous double-sided multilayer to high-density interconnect board HDI (HighDensity Interconnector), and now to the current substrate-like SLCB (Substratelike-PCB), the process requirements are getting higher and higher. In the past, formaldehyde was used as a reducing agent for the electroless copper plating of interlayer conduction in this process. Formaldehyde is a highly toxic carcinogen, which poses a great threat to the health of operators. In addition, metal ions such as copper ions, nickel ions, and palladium ions are used and discharged ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/54C25D5/56H05K3/00
CPCH05K3/0094C25D5/54C25D5/56
Inventor 刘彬云肖亮何雄斌宋兴文
Owner GUANGDONG TONESET SCI & TECH
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