Method for electroplating metal on surface of insulating base material

Abstract

The invention relates to a method for electroplating metal on the surface of an insulating base material. The method comprises the following steps that the surface of the insulating base material makes contact with a water-soluble anionic compound, so that a modified surface is produced; the modified surface makes contact with an aqueous solution containing permanganate ions, so that a manganese dioxide adsorption layer is formed on the modified surface; a conducting polymer layer is formed on the surface of the manganese dioxide adsorption layer; and electroplating is carried out on the surface of the conducting polymer layer, and thus a metal layer is formed. According to the method, the anionic compound is deposited on the surface of the insulating base material so as to form a coatinglayer tightly combined with the surface of the base material, after the modification and adsorption, an even film with a certain thickness is formed on the surface, thus, under the metal electroplating liquid and electroplating condition are the same, the deep plating capacity and dispersing capacity of the electroplating liquid can be greatly improved, the obtained metal plating layer has the characteristics of being flat, even and good in backlighting effect, and the hole breakout phenomenon and the phenomenon that certain parts of the electroplating metal layer in holes are too thin are avoided.

Description

technical field

[0001] The invention relates to the technical field of surface treatment, in particular to a method for electroplating metal on the surface of an insulating substrate. Background technique

[0002] With the rapid development of the electronic information industry, the printed circuit board (Printed Circuit Board, PCB) industry, which is the carrier of electronic interconnection, is also developing rapidly. From the previous double-sided multilayer to high-density interconnect board HDI (HighDensity Interconnector), and now to the current substrate-like SLCB (Substratelike-PCB), the process requirements are getting higher and higher. In the past, formaldehyde was used as a reducing agent for the electroless copper plating of interlayer conduction in this process. Formaldehyde is a highly toxic carcinogen, which poses a great threat to the health of operators. In addition, metal ions such as copper ions, nickel ions, and palladium ions are used and discharged ...