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Epoxy resin composition, curable composition, and semiconductor-encapsulating material

A technology of epoxy resin and composition, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc. Excellent thermal properties and high quality retention

Active Publication Date: 2018-12-21
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The epoxy resin composition described in the aforementioned Patent Document 1 has high heat resistance as evaluated at the glass transition temperature (Tg) of the cured product, but has a low mass retention rate when the cured product is exposed to a high-temperature environment for a long period of time. It cannot be said that the long-term use stability is sufficient when used as a resin material for electronic equipment, etc.

Method used

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  • Epoxy resin composition, curable composition, and semiconductor-encapsulating material
  • Epoxy resin composition, curable composition, and semiconductor-encapsulating material
  • Epoxy resin composition, curable composition, and semiconductor-encapsulating material

Examples

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Embodiment

[0081] Next, the present invention will be specifically described using Examples and Comparative Examples. Hereinafter, "parts" and "%" are based on mass unless otherwise specified. In addition, epoxy equivalent, the melt viscosity in 150 degreeC, GPC, and MS spectrum were measured on the following conditions.

[0082] ◆Determination of epoxy equivalent

[0083] Measurement was performed based on JIS K 7236.

[0084] ◆Measurement method of melt viscosity at 150℃

[0085] Based on ASTM D4287, the measurement was performed with an ICI viscometer.

[0086] ◆Determination of softening point

[0087] Measurement was performed based on JIS K7234.

[0088] ◆Measurement conditions of MS spectrum

[0089] Double focus type mass spectrometer "AX505H (FD505H)" manufactured by JEOL Ltd.

manufacture example 1

[0090] Production Example 1 Production of aralkyl-modified novolak-type resin (a-1)

[0091] 216.3 g of o-cresol and 14.5 g of 41% by mass formalin were put into a flask equipped with a thermometer, a condenser tube, a fractionation tube, a nitrogen introduction tube, and a stirrer, and 4.0 g of oxalic acid was added. The temperature was raised to 100°C, and the reaction was carried out at 100°C for 3 hours. Next, 76.7 g of 41% by mass formalin was added dropwise over 1 hour while trapping water with a fractionating tube. After completion of the dropwise addition, the temperature was raised to 150° C. over 1 hour, and the reaction was further carried out at 150° C. for 2 hours. After completion of the reaction, 600 g of methyl isobutyl ketone was further added, moved to a separating funnel, and washed with water. After washing with water until the washing water became neutral, unreacted o-cresol and methyl isobutyl ketone were distilled off from the organic layer under heati...

Embodiment 1

[0093] The manufacture of embodiment 1 epoxy resin composition (1)

[0094]Into a flask equipped with a thermometer, a dropping funnel, a condenser, and a stirrer, 148.5 g of the aralkyl-modified novolak-type resin (a-1) obtained before and 4,4'-linked 16.5 g of phenol, 463 g of epichlorohydrin, 139 g of n-butanol, and 2 g of tetraethylbenzyl ammonium chloride were dissolved. After heating up to 70° C., 220 g of a 20% aqueous sodium hydroxide solution was added dropwise over 5 hours, and stirring was continued for 0.5 hours under the same temperature conditions. Unreacted epichlorohydrin was distilled off by vacuum distillation, and 1000 g of methyl isobutyl ketone and 350 g of n-butanol were added to dissolve the product. 10 g of 10% sodium hydroxide aqueous solution was added to this solution, and it was made to react at 80 degreeC for 2 hours. After completion of the reaction, washing with 150 g of water was repeated three times, and it was confirmed that the pH of the wa...

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Abstract

Provided are: a curable composition capable of giving a cured object which has excellent heat resistance and which has a high mass retention after long-term exposure to a high-temperature environment;a semiconductor-encapsulating material; and an epoxy resin composition which is a raw material for the semiconductor-encapsulating material. The epoxy resin composition is characterized by comprisinga novolak type epoxy resin (A) and a bisphenol type epoxy resin (B), some or all of the aromatic rings constituting the novolak structure of the novolak type epoxy resin (A) having aralkyl groups. The curable composition contains the epoxy resin composition. Also provided are: a cured object obtained from the curable composition; and a printed wiring board obtained using the curable composition.The semiconductor-encapsulating material includes the epoxy resin composition.

Description

technical field [0001] The present invention relates to a curable composition capable of obtaining a cured product having excellent heat resistance and a high mass retention rate when exposed to a high-temperature environment for a long period of time, a semiconductor sealing material, and an epoxy resin composition as a raw material thereof. Background technique [0002] In addition to being used in materials such as adhesives, molding materials, and coatings, epoxy resins are also used in electrical appliances such as semiconductor sealing materials and printed circuit board insulating materials because of the excellent heat resistance and moisture resistance of the obtained cured products. widely used in electronics. [0003] Among the various applications mentioned above, in the field of semiconductor sealing materials, technical innovations such as the transfer to surface mount packages such as BGA and CSP, the response to lead-free solder, and the elimination of haloge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20H01L23/29H01L23/31H05K1/03
CPCC08G59/20H01L23/29H01L23/31H05K1/03
Inventor 高桥步佐藤泰
Owner DIC CORP
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