Epoxy resin composition, curable composition, and semiconductor sealing material

A technology of epoxy resin and composition, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc. Excellent thermal properties and high quality retention
CN109071775BActive Publication Date: 2021-04-06DIC CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DIC CORP
Publication Date
2021-04-06

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Abstract

The present invention provides a curable composition capable of obtaining a cured product having excellent heat resistance and a high quality retention rate when exposed to a high-temperature environment for a long period of time, a semiconductor sealing material, and an epoxy resin composition as a raw material thereof. To provide an epoxy resin composition, a curable composition containing the same, a cured product thereof, a printed circuit board, and a semiconductor sealing material, wherein the epoxy resin composition is characterized in that it contains a novolak type epoxy resin (A) and The biphenol-type epoxy resin (B), the said novolak-type epoxy resin (A) has an aralkyl group in a part or all of the aromatic ring which comprises a novolac structure.
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Description

technical field

[0001] The present invention relates to a curable composition capable of obtaining a cured product having excellent heat resistance and a high mass retention rate when exposed to a high-temperature environment for a long period of time, a semiconductor sealing material, and an epoxy resin composition as a raw material thereof. Background technique

[0002] In addition to being used in materials such as adhesives, molding materials, and coatings, epoxy resins are also used in electrical appliances such as semiconductor sealing materials and printed circuit board insulating materials because of the excellent heat resistance and moisture resistance of the obtained cured products. widely used in electronics.

[0003] Among the various applications mentioned above, in the field of semiconductor sealing materials, technical innovations such as the transfer to surface mount packages such as BGA and CSP, the response to lead-free solder, and the elimination of haloge...

Claims

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