Low-halogen underfill adhesive and preparation method and application thereof

Abstract

The invention provides a low-halogen underfill adhesive, components of the underfill adhesive comprise a silica-modified epoxy resin, or comprise a silica-modified epoxy resin and an acrylic monomer.The halogen content of the underfill adhesive is not more than 100 ppm; preferably, the halogen content of the underfill adhesive is not more than 80 ppm; more preferably, the halogen content of the underfill adhesive is not more than 40 ppm. The low-halogen underfill adhesive provided by the invention has the advantages of low viscosity, low halogen content, good mechanical property, good heat resistance, low thermal expansion coefficient, and the like; and the application prospects are wider.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a low-halogen bottom filling adhesive and its preparation method and application. Background technique [0002] Since the new century, with the continuous innovation of electronic industry technology, electronic products are developing in the direction of intelligence, miniaturization, light weight, high performance and safety. In response to this trend, many advanced electronic packaging technologies and packaging forms have emerged. Among them, flip chip (Flip-Chip) packaging technology has become the most important packaging technology in the field of high-end electronic devices and high-density packaging due to its advantages of high packaging density, short interconnection path, low inductance, good reliability and reworkability. one. Liquid epoxy underfill is the key material of flip-chip packaging technology. It fills the gap between the chip and the substrate through the princi...

AI Technical Summary

Problems solved by technology

However, most of the currently disclosed epoxy underfills usually add glycidyl ether reactive epoxy diluents in order to reduce the viscosity, but such diluents generally have a relatively high halogen content, and a small amount of addition can lead to a decrease in the halogen content. exceed the standard

Moreover, halogenated materials have major environmental hazards. On the one hand, the inherent toxicity of halogen-containing organic substances poses a threat to the environment and human health. On the other hand, these electronic components cannot be recycled and reused, and harmful substances such as Dioxins, etc., can exist in the environment for many years, and even accumulate in the body for life and cannot be discharged, which seriously threatens the health of human body, the environment and the next generation.

[0004] In addition, in order to improve the toughness of the underfill after curing, most of the tougheners added are rubber-like materials, which will not only increase the viscosity of the underfill but also reduce the glass transition temperature, which is difficult to meet the electronic industry's increasingly demanding requirements for packaging materials. high performance requirements

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