3D printing method of integrated encapsulating luminous device

Abstract

The invention discloses a 3D printing method of an integrated encapsulating luminous device. The method includes the steps of designing a model, converting the model into an identifiable file format,printing a ceramic substrate with a heat dissipation passage on a copper base, printing grooves and circuit slots, printing electronic components in the grooves, printing graphene circuits in the circuit slots, printing a thin ceramic layer to cover the electronic components and the graphene circuits, and repeating the steps above according to hierarchical slicing information until printing of theheat dissipation passage, electronic components and circuits is completed; printing a wafer welding disc, an external power source connection welding disc and related surface layer circuits; printinga bowl cup, coating the inner wall of the bowl cup with a reflected layer material, printing a layer of welding material at the positions where wafers are about to be welded, and fixing the wafers through heating; printing bonding wires and fluorescent powder again and installing lenses later to complete encapsulating. The method not only greatly simplifies a traditional process, shortens the production cycle and lowers the manufacturing cost but also provides more selections for microminiaturization and complication of product size.

Description

technical field [0001] The invention belongs to the field of ceramic substrate production and LED packaging technology, and specifically relates to a 3D printing method for integrated packaging of light-emitting devices. Background technique [0002] The advent of ceramic substrate products has opened the development of the heat dissipation application industry. Due to the heat dissipation characteristics of ceramic substrates, and the advantages of high heat dissipation, low thermal resistance, long life, and withstand voltage, ceramic substrates are widely used in various fields such as LED packaging, power electronic devices, and multi-chip modules. [0003] Metallization of ceramics is to firmly adhere a layer of metal film on the surface of ceramics to realize the welding between ceramics and metals. The existing molybdenum-manganese method, gold plating method, copper plating method, tin plating method, nickel plating method, LAP method (Laser metal plating) and other...

AI Technical Summary

Problems solved by technology

However, the current ceramic metallization process can only be limited to making circuits on the front and back surfaces of ceramics (the two layers of circuits are connected by laser drilling, connected by electroplating, chemical plating, etc.), that is, only two layers can be made at most. circuit

If a multi-layer circuit is to be realized, it can only be achieved by bonding a metallized ceramic substrate. The thermal conductivity of the adhesive is much lower than that of the ceramic itself, which hinders the transfer of heat, accelerates the aging of LED light, and reduces the use life

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