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High-compactness high-temperature porcelain phenolic resin permeable membrane suitable for RFI (Radio Frequency Interference) molding process and preparation method thereof

A technology of phenolic resin and molding process, which is applied in the field of high-density high-temperature porcelainable phenolic resin permeable membrane and its preparation, which can solve the problems of limited application, flame retardancy, high temperature resistance and poor ablation resistance, and achieve good melting performance. Permeability, high carbon residue rate, high viscosity effect

Inactive Publication Date: 2019-02-22
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor flame retardancy, high temperature resistance, and ablation resistance of epoxy resin, unsaturated polyester, vinyl ester resin, and bismaleimide, the RFI molding process is limited in advanced aerospace vehicles. Application of thermal protection components

Method used

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  • High-compactness high-temperature porcelain phenolic resin permeable membrane suitable for RFI (Radio Frequency Interference) molding process and preparation method thereof
  • High-compactness high-temperature porcelain phenolic resin permeable membrane suitable for RFI (Radio Frequency Interference) molding process and preparation method thereof
  • High-compactness high-temperature porcelain phenolic resin permeable membrane suitable for RFI (Radio Frequency Interference) molding process and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036]Components: by weight: 50 parts of B80 phenolic resin, 30 parts of solvent-free liquid phenolic resin, 10 parts of bismaleimide modified phenolic resin, 10 parts of phenproxazine resin, forming 100 parts of RTM phenolic resin system . 200 parts of magnesium aluminum spinel particles, 150 parts of forsterite particles, and 100 parts of silicon carbide whiskers.

[0037] Step 1: After each component by weight part is weighed respectively, put into the oven of 70 ℃ and heat for 30 minutes. Use a mechanical stirring device to quickly mix the heated components. After stirring for about 5 to 10 minutes, the mixture becomes a homogeneous system. The uniformly mixed material is poured into a mold whose upper and lower templates are covered with release cloth, and the mold temperature is 80°C, and the film is calendered. After the calendering is completed, the film with the release cloth up and down is taken out together. After cooling to room temperature, the release cloth ca...

Embodiment 2

[0040] Components: by weight: 50 parts of B80 phenolic resin, 30 parts of solvent-free liquid phenolic resin, 10 parts of bismaleimide modified phenolic resin, 10 parts of phenproxazine resin, forming 100 parts of RTM phenolic resin system . 150 parts of magnesium aluminum spinel particles, 120 parts of forsterite particles, and 80 parts of silicon carbide whiskers.

[0041] Step 1: same as Step 1 in Example 1;

[0042] Step 2: Take a certain amount of permeable membrane, and use a flat plate rheometer to measure the viscosity-temperature curve and viscosity-time curve of the membrane, as shown in Figure 1. Figure 1(a) is the viscosity-temperature curve of the film. It can be seen from Figure 1(a) that with the increase of temperature, the viscosity of the film first decreases and then increases, and the viscosity is the lowest at 70°C to 80°C, and the viscosity-temperature curve is U-shaped. The U-shaped viscosity-temperature curve makes the film have good film-forming pro...

Embodiment 3

[0044] Components: by weight: 50 parts of B80 phenolic resin, 30 parts of solvent-free liquid phenolic resin, 10 parts of bismaleimide modified phenolic resin, 10 parts of phenproxazine resin, forming 100 parts of RTM phenolic resin system . 200 parts of magnesium aluminum spinel particles, 120 parts of forsterite particles, and 80 parts of silicon carbide whiskers.

[0045] Step 1: same as Step 1 in Example 1;

[0046] Step 2: Lay 40 pieces of carbon fiber plain weave cloth with a size of 100×100×0.28mm in the direction of 0° / 90°, take two prepared permeable membranes, and cover the permeable membrane on one side of the carbon fiber laminated fabric, Seal it with high temperature resistant sealant and a vacuum bag with a vacuum joint, put it in an autoclave, and use the RFI process to heat cure and form. The vacuum degree in the vacuum bag is 0.1MPa, the positive pressure of the autoclave is 0.2MPa, the temperature rise rate is 2°C / min, and the positive pressure increase ra...

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Abstract

The invention discloses a high-compactness high-temperature porcelain phenolic resin permeable membrane suitable for an RFI (Radio Frequency interference) molding process and a preparation method thereof. The preparation method comprises the following steps: heating 100 parts of RTM (resin transfer molding) phenolic resin system, 150-200 parts of magnesia-alumina spinel particles, 120-150 parts offorsterite particles, 80-100 parts of silicon carbide whiskers, mixing, stirring, and then calendering to form a membrane; and taking out, and cooling to a room temperature to prepare the membrane of0.6 to 0.8 mm. When the membrane prepared by the method is at the temperature of 70 DEG C-80 DEG C, the viscosity of the membrane obviously declines, the membrane has a good melt infiltration property, and a fiber braided fabric can be infiltrated through an RFI process to prepare a composite material; when the membrane is at the temperature of 150 DEG C to 180 DEG C, the membrane is molded due to thermocuring; when the membrane is at the temperature of above 1000 DEG C, a phenolic matrix in the porcelain phenolic resin membrane is thermally cracked, and meanwhile is converted into a highly compact anti-scouring ceramic layer together with the silicon carbide whiskers and high-temperature phase-changing inorganic particles. The high-compactness high-temperature porcelain phenolic resin permeable membrane is applied to advanced spacecraft components to resist thermal environments of high heat flow and high scour.

Description

technical field [0001] The invention relates to the field of high-temperature-resistant polymer-based composite materials, in particular to a high-density high-temperature porcelainable phenolic resin permeable membrane suitable for RFI molding technology and a preparation method thereof. Background technique [0002] Resin Film Infusion (RFI) process is a resin impregnation technology that combines resin infiltration and fiber prefabrication. It has the advantages of simple operation, low fiber content, excellent performance, low cost, and is suitable for preparing large structures. advantages, etc. [0003] The RFI molding process has high requirements on the manufacturability of the resin film matrix. It requires the resin matrix to be able to form a film at room temperature, and the prepared resin film has good toughness and is not sticky to the hand; at the melting temperature, the resin can be maintained for a period of time. The low viscosity for a long time can full...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L61/14C08L61/34C08K7/10C08K3/22C08K3/34C08J5/18
CPCC08J5/18C08J2361/06C08J2461/06C08K3/22C08K3/34C08K7/10
Inventor 丁杰杨滔季亦同杨威黄志雄秦岩
Owner WUHAN UNIV OF TECH
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