Electronic-grade epoxy resin composition
A technology of epoxy resin and composition, applied in the field of electronic-grade epoxy resin composition, can solve problems such as insufficient toughness, and achieve the effects of improving crosslinking density, high heat resistance stability, and improving heat resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0023] (1) Preparation of modifier
[0024] In a 250ml four-neck flask equipped with a stirrer, a thermometer, a high-efficiency reflux condenser, and a drying tube at the top of the condenser, replace the air in the bottle with nitrogen, and add 26.2g (0.1mol) (2-hydroxy Ethyl) isocyanurate and 50ml tetrachloroethane, and be warmed up to 55 ℃, make it dissolve under stirring; Add dropwise 8.89g (0.095mol) of dimethyl chlorosilane, dropwise process control reaction temperature is not high At 70°C; after dripping, raise the temperature to 90°C, and react for 2 hours; after the HCl gas is released, add 1.2g of melamine, keep stirring for 0.5h, and detect that the pH of the solution is 5-6 as the reaction end point; evaporate the organic solvent, Recycled for use, yield 91.1%;
[0025] (2) Preparation of epoxy resin composition
[0026] Mix 100g of bisphenol A type epoxy resin (E54), 0.5g of triethylamine, 2g of phthalic anhydride, 3g of triphenyl phosphate and 20g of modifier,...
Embodiment 2
[0028] (1) Preparation of modifier
[0029] In a 250ml four-neck flask equipped with a stirrer, a thermometer, a high-efficiency reflux condenser, and a drying tube at the top of the condenser, replace the air in the bottle with nitrogen, and add 26.2g (0.1mol) (2-hydroxy Ethyl) isocyanurate and 50ml dioxane, and heated up to 60°C, and dissolved under stirring; 8.89g (0.095mol) of dimethylchlorosilane was added dropwise, and the reaction temperature was not high during the dropwise addition process. At 70°C; after dripping, raise the temperature to 85°C, and react for 2 hours; after the HCl gas is released, add 1.2g melamine, keep stirring for 0.5h, and detect that the pH of the solution is 5-6 as the reaction end point; evaporate the organic solvent, Recycled for use, yield 88.5%;
[0030] (2) Preparation of epoxy resin composition
[0031] Mix 100g of cycloaliphatic epoxy resin (TTA21), 2g of methylhexahydrophthalic anhydride, 1g of trimellitic anhydride, 2-methylimidazole...
Embodiment 3
[0033] (1) Preparation of modifier
[0034] In a 250ml four-neck flask equipped with a stirrer, a thermometer, a high-efficiency reflux condenser, and a drying tube at the top of the condenser, replace the air in the bottle with nitrogen, and add 26.2g (0.1mol) (2-hydroxy Ethyl) isocyanurate and 50ml ethylene glycol dimethyl ether, and heated up to 60 ° C, dissolved under stirring; 8.89g (0.095mol) of dimethyl chlorosilane was added dropwise, and the reaction temperature was controlled during the dropwise addition process. Not higher than 70°C; after dripping, raise the temperature to 85°C, and react for 3 hours; after the HCl gas is released, add 1.2g of melamine, keep stirring for 0.5h, and detect that the pH of the solution is 5-6 as the reaction end point; evaporate the organic Solvent, recycled for use, yield 92.5%;
[0035] (2) Preparation of epoxy resin composition
[0036] Mix 100g o-cresol formaldehyde epoxy resin, 1g ethylenediamine, 2g dicyandiamide, 5g melamine p...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More