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Calixarene solution for printed circuit board and preparation method thereof

A technology for printed circuit boards and calixarene, which is applied in the field of calixarene solution and its preparation, can solve the problems that calixarene is insoluble in small molecular organic solvents, poor processing fluidity of calixarene, and affects processing fluidity, etc., and achieves excellent phase Capacitance, improvement of processing fluidity, effect of improving processing fluidity

Pending Publication Date: 2019-03-01
GUANGDONG CHENGDE ELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, calixarenes have a calixarene molecular chain structure connected by benzene rings and methylene spacers, so their molecular chains have good regularity, resulting in extremely poor fluidity of calixarene itself, and calixarene is extremely difficult to Soluble in small molecule organic solvents, so calixarene itself has the defect of extremely poor processing fluidity
In fact, the fluidity of calixarene directly affects the processing fluidity of silver particles after complexation and formation of silver paste, thereby greatly reducing the fluidity of silver paste during circuit board printing, and it is very easy for silver particles to appear due to their own weight. phenomenon of subsidence

Method used

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Examples

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Effect test

preparation example Construction

[0032]The preparation method of the calixarene solution that the present invention is used for printed circuit board comprises the following steps:

[0033] 1. Preparation of calixarene polymer

[0034] a: At normal temperature and pressure, add calixarene and acidic catalyst to a flask equipped with a stirrer and a heater, and maintain the pH value in the flask at 6-6.5;

[0035] b: Heat the flask while stirring to keep the temperature in the flask at 130-180°C, then slowly add terephthalaldehyde dropwise into the flask at a rate of 2-5% of the total weight per minute, keep stirring after the dropwise addition, and react Naturally cool to room temperature after 10-30 minutes and drain the water in the flask;

[0036] 2. Plasticization, coupling and adding solvent

[0037] c: Heat the flask while stirring and keep the temperature inside the flask at 100-150°C, then add plasticizer to the mixture obtained in step b, and keep stirring for 5-20 minutes;

[0038] d: Continue to...

Embodiment 1

[0043] The calixarene solution used for printed circuit boards in the present invention includes calix[4]arene, terephthalaldehyde, dioctyl phthalate, organic chromium complexes, and benzene, and the contents of the above components are calculated in parts by mass. It is: 100 parts of calix[4]arene, 50 parts of terephthalaldehyde, 10 parts of dioctyl phthalate, 5 parts of organic chromium complex, and 200 parts of benzene.

[0044] The preparation method of the calixarene solution that the present invention is used for printed circuit board comprises the following steps:

[0045] 1. Preparation of calixarene polymer

[0046] a: At normal temperature and pressure, add calixarene and acidic catalyst to a flask with a stirrer and a heater, and maintain the pH value in the flask at 6.5;

[0047] b: Heat the flask while stirring to keep the temperature inside the flask at 130°C, then slowly add terephthalaldehyde dropwise into the flask at a rate of 2% / min of the total weight, con...

Embodiment 2

[0054] The calixarene solution used for printed circuit boards in the present invention includes calix [4] arene, calix [6] arene, calix [8] arene, terephthalaldehyde, dioctyl phthalate, dibutyl phthalate Esters, organic chromium complexes, methyl silicone oil, silane, chelated titanate, benzene, toluene, xylene, the contents of the above components are calculated in parts by mass: 40 parts of calix[4]arene, 40 parts of calix[4]arene, [6] 40 parts of aromatic hydrocarbons, 30 parts of calix [8] aromatic hydrocarbons, 70 parts of terephthalaldehyde, 10 parts of dioctyl phthalate, 10 parts of dibutyl phthalate, 3 parts of organic chromium complexes, 2 parts of methyl silicone oil, 2 parts of monosilane, 3 parts of chelated titanate, 200 parts of benzene, 100 parts of toluene, and 100 parts of xylene.

[0055] The preparation method of the calixarene solution that the present invention is used for printed circuit board comprises the following steps:

[0056] 1. Preparation of ca...

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PUM

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Abstract

The invention discloses a calixarene solution for a printed circuit board. The calixarene solution for the printed circuit board is characterized by comprising calixarene, terephthalaldehyde, plasticizer, coupling reagent and aromatic solvent. The components in parts by weight are as follows: 100 parts of calixarene, 50-70 parts of terephthalaldehyde, 10-20 parts of plasticizer, 5-10 parts of coupling reagent and 200-400 parts of aromatic solvent. The calixarene solution for the printed circuit board disclosed by the invention has high liquidity and is practically suitable for printing production of circuit board.

Description

technical field [0001] The invention relates to a calixarene solution and a preparation method thereof, in particular to a calixarene solution applied to circuit board printing and a preparation method thereof. Background technique [0002] With the continuous development of the economy, printed circuit boards are increasingly widely used in household appliances, industrial electronics and other industries. Because the printed circuit board has the advantages of greatly reducing the processing cost of electronic products, strong industrial reproducibility, high degree of automation and high production efficiency, it is favored by the majority of electrical and electronic industry manufacturers. However, there are two major technical deficiencies in the existing printed circuit board production process. First, traditional printed circuit boards are usually processed by a reduction method, which is mainly composed of cleaning, lamination, development, etching, and film remova...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/18C08L83/04C08L91/00C08K5/12C08K5/10C08K5/1515C08G10/02
CPCC08G10/02C08L61/18C08K2201/014C08L2205/03C08L2203/20C08L83/04C08K5/12C08L91/00C08K5/10C08K5/1515
Inventor 刘镇权吴子坚陈世荣程静
Owner GUANGDONG CHENGDE ELECTRONICS TECH CO LTD
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