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High thermal and electrical conductive silver colloid and preparation method thereof

A technology of conductive silver glue and high thermal conductivity, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems that limit the wide application in the field of electronic packaging, improve mechanical properties, improve electrical and thermal conductivity, and enhance electrical conductivity and the effect of thermal conductivity

Inactive Publication Date: 2019-03-01
UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, although some achievements have been made in the research and industrialization of conductive adhesives, there are certain defects in comprehensive properties such as good thermal conductivity, mechanical properties, storage, etc., which limit its application in the field of electronic packaging to a certain extent. widely used

Method used

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  • High thermal and electrical conductive silver colloid and preparation method thereof
  • High thermal and electrical conductive silver colloid and preparation method thereof
  • High thermal and electrical conductive silver colloid and preparation method thereof

Examples

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Effect test

Embodiment 1

[0027] A high thermal conductivity and conductive silver glue and a preparation method thereof, comprising the following raw material components in the following mass percentages:

[0028] Micron silver flake 79%, nano silver wire 2%, bisphenol F resin 14.2%, dicyandiamide 2.3%, trimethylolethane triglycidyl ether 1%, SnBi57Ag1 1.0%, TEGO Foamex N 0.1%, TEGO410 0.1%, TEGO Dispers 755W0.3%.

[0029] The particle size of the micron silver flakes is 5-9 microns. Described nano-silver wire is obtained by the following method: the silver nitrate of 1 weight part, the polyvinylpyrrolidone K30 of 1 weight part and the sodium sulfide of 0.014 weight part and the ethylene glycol of 100 weight parts are mixed and stirred and transferred to hydrothermal reaction In the kettle, react at 160°C for 150 minutes, and then cool to room temperature. The reaction product was washed twice with acetone, then three times with deionized water, and finally once with absolute ethanol to obtain silve...

Embodiment 2

[0032] A high thermal conductivity and conductive silver glue and a preparation method thereof, comprising the following raw material components in the following mass percentages:

[0033] Micron silver flake 74%, nano silver wire 3%, bisphenol F resin 16.5%, dicyandiamide 3.0%, trimethylolethane triglycidyl ether 1%, SnBi57Ag1 2.0%, TEGO Foamex N 0.1%, TEGO410 0.1%, TEGO Dispers 755W0.3%.

[0034] The particle size of the micron silver flakes is 5-9 microns. Described nano-silver wire is obtained by the following method: the silver nitrate of 1 weight part, the polyvinylpyrrolidone K30 of 1 weight part and the sodium sulfide of 0.014 weight part and the ethylene glycol of 100 weight parts are mixed and stirred and transferred to hydrothermal reaction In the kettle, react at 160°C for 150 minutes, and then cool to room temperature. The reaction product was washed twice with acetone, then three times with deionized water, and finally once with absolute ethanol to obtain silve...

Embodiment 3

[0037] A high thermal conductivity and conductive silver glue and a preparation method thereof, comprising the following raw material components in the following mass percentages:

[0038] Micron silver flake 76%, nano silver wire 3%, bisphenol F resin 15.5%, dicyandiamide 2.6%, trimethylolethane triglycidyl ether 1%, SnBi57Ag1 1.4%, TEGO Foamex N 0.1%, TEGO410 0.1%, TEGO Dispers 755W0.3%.

[0039] The particle size of the micron silver flakes is 5-9 microns. Described nano-silver wire is obtained by the following method: the silver nitrate of 1 weight part, the polyvinylpyrrolidone K30 of 1 weight part and the sodium sulfide of 0.014 weight part and the ethylene glycol of 100 weight parts are mixed and stirred and transferred to hydrothermal reaction In the kettle, react at 160°C for 150 minutes, and then cool to room temperature. The reaction product was washed twice with acetone, then three times with deionized water, and finally once with absolute ethanol to obtain silve...

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Abstract

The invention discloses a high thermal and electrical conductive silver colloid and a preparation method thereof. The conductive silver colloid comprises the following raw material components in percentage by mass: 68-80% of micron silver sheets, 2-5% of nano silver wires, 14-18% of epoxy resin, 2.0-7.0% of a curing agent, 1-6% of a diluent, 1-4% of functional aids, 0.1-0.6% of a defoaming agent,0.1-0.3% of a leveling agent, and 0.3-1% of a dispersant. The content sum of the components is 100%. The preparation process comprises the steps of stirring the epoxy resin and the diluent uniformly according to the ratio, then adding the curing agent, the defoaming agent, the leveling agent and the dispersant, and stirring to form a uniform resin matrix; adding the micron silver sheets and the nano silver wires in batches, and stirring for 10 to 20 minutes; and finally, adding the functional aids in one time, continuing to stir for 60 minutes, and grinding to the appropriate fineness and viscosity. The conductive silver colloid can be hermetically stored for 3 months at room temperature and 12 months at zero temperature, and can be used in the electronic packaging fields of bonding of high-power LED chips and need of high thermal and electrical conductivity and bonding strength.

Description

technical field [0001] The invention belongs to the technical field of microelectronic packaging, and in particular relates to a high-thermal-conductivity and electrically-conductive silver glue and a preparation method thereof. Background technique [0002] Conductive adhesive is a key material for electronic component packaging, electrodes and interconnection, and is mainly used in various fields of the electronic industry such as surface packaging technology and sensitive components. However, compared with traditional welding materials, conductive adhesives still have disadvantages such as low thermal conductivity, high volume resistivity, unstable contact resistance, poor impact strength, and poor storage and transportation performance. Therefore, improving the thermal conductivity, bonding strength, and storage and transportation performance of conductive adhesives has become a hot research topic. With the continuous development of electronic components in the directio...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J9/00C09J163/00C09J11/04C09J11/06
CPCC08K7/00C08K7/06C08K9/02C08K9/08C08K13/06C08K2003/0806C08K2003/0837C08K2201/001C08K2201/003C08K2201/004C08K2201/011C09J9/00C09J9/02C09J11/04C09J11/06C09J163/00
Inventor 王悦辉谢辉
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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