High thermal and electrical conductive silver colloid and preparation method thereof
A technology of conductive silver glue and high thermal conductivity, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems that limit the wide application in the field of electronic packaging, improve mechanical properties, improve electrical and thermal conductivity, and enhance electrical conductivity and the effect of thermal conductivity
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[0026] Example 1:
[0027] A kind of high thermal conductivity conductive silver glue and preparation method thereof, comprise each raw material component of following mass percentage:
[0028] Micron silver flakes 79%, nano silver wires 2%, bisphenol F-type resin 14.2%, dicyandiamide 2.3%, trimethylolethane triglycidyl ether 1%, SnBi57Ag1 1.0%, TEGO Foamex N 0.1%, TEGO410 0.1%, TEGO Dispers 755W 0.3%.
[0029] The particle size of the micron silver flakes is 5-9 microns. Described nano silver wire is obtained by the following method: 1 weight part of silver nitrate, 1 weight part of polyvinylpyrrolidone K30 and 0.014 weight part of sodium sulfide and 100 weight part of ethylene glycol are mixed and stirred evenly and then transferred to hydrothermal reaction. In the kettle, the reaction was carried out at 160 °C for 150 minutes, and then cooled to room temperature. The reaction product was first centrifuged and washed twice with acetone, then three times with deionized wat...
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[0031] Example 2:
[0032] A kind of high thermal conductivity conductive silver glue and preparation method thereof, comprise each raw material component of following mass percentage:
[0033] Micron silver flakes 74%, nano silver wires 3%, bisphenol F-type resin 16.5%, dicyandiamide 3.0%, trimethylolethane triglycidyl ether 1%, SnBi57Ag1 2.0%, TEGO Foamex N 0.1%, TEGO410 0.1%, TEGO Dispers 755W 0.3%.
[0034] The particle size of the micron silver flakes is 5-9 microns. Described nano silver wire is obtained by the following method: 1 weight part of silver nitrate, 1 weight part of polyvinylpyrrolidone K30 and 0.014 weight part of sodium sulfide and 100 weight part of ethylene glycol are mixed and stirred evenly and then transferred to hydrothermal reaction. In the kettle, the reaction was carried out at 160 °C for 150 minutes, and then cooled to room temperature. The reaction product was first centrifuged and washed twice with acetone, then three times with deionized wat...
Example Embodiment
[0036] Example 3:
[0037] A kind of high thermal conductivity conductive silver glue and preparation method thereof, comprise each raw material component of following mass percentage:
[0038] Micron silver flakes 76%, nano silver wires 3%, bisphenol F-type resin 15.5%, dicyandiamide 2.6%, trimethylolethane triglycidyl ether 1%, SnBi57Ag1 1.4%, TEGO Foamex N 0.1%, TEGO410 0.1%, TEGO Dispers 755W 0.3%.
[0039] The particle size of the micron silver flakes is 5-9 microns. Described nano silver wire is obtained by the following method: 1 weight part of silver nitrate, 1 weight part of polyvinylpyrrolidone K30 and 0.014 weight part of sodium sulfide and 100 weight part of ethylene glycol are mixed and stirred evenly and then transferred to hydrothermal reaction. In the kettle, the reaction was carried out at 160 °C for 150 minutes, and then cooled to room temperature. The reaction product was first centrifuged and washed twice with acetone, then three times with deionized wat...
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