sPS (syndiotactic polystyrene) film for FPC (Flexible Printed Circuit) industry and preparation method thereof

A technology of adhesive film and viscose resin, which is applied in the direction of adhesives, film/sheet adhesives, polyether adhesives, etc., can solve the problems of high brittleness and limit the application field of sPS, and achieve strong polarity and good Abrasion resistance, enhanced overall performance effect

Inactive Publication Date: 2019-03-22
苏州市新广益电子股份有限公司
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The brittleness of sPS and the lack of polar groups in the molecule are fatal shortcomings when it is used alone as a material, which limits the application field of sPS.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • sPS (syndiotactic polystyrene) film for FPC (Flexible Printed Circuit) industry and preparation method thereof
  • sPS (syndiotactic polystyrene) film for FPC (Flexible Printed Circuit) industry and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The preparation of embodiment 1 sPS film

[0026] Composition of raw materials (parts by weight): 100 parts of modified syndiotactic styrene, 60 parts of phenoxy resin, 10010 parts of Degussa Dyhard, 5 parts of polyether modified polysiloxane, bis(3,5-tertiary butyl -4-hydroxyphenyl)sulfide 5 parts, decabromodiphenylethane 1-4 parts, bis-2,2,6,6-tetramethylpiperidinol sebacate 1 part and aminopropyl tris 1 part of ethoxysilane;

[0027] The preparation method of modified syndiotactic styrene is as follows:

[0028] (1) Adopt improved Hummers method to prepare graphene oxide:

[0029] Step 1. Weigh 10g of natural graphite powder, 4g of potassium persulfate, and 10g of phosphorus pentoxide, and add them into a three-necked flask filled with 24mL of sulfuric acid while stirring, and react in a constant temperature water bath at 60°C for 3h, and then Move the three-necked flask into a constant temperature water bath at 25°C to react for 5 hours, filter it with suction, w...

Embodiment 2

[0034] The preparation of embodiment 2 sPS film

[0035] Composition of raw materials (parts by weight): 120 parts of modified syndiotactic styrene, 80 parts of bisphenol epoxy resin, 10015 parts of Degussa Dyhard, 10 parts of polyether modified polysiloxane, bis(3,5-tertiary 10 parts of butyl-4-hydroxyphenyl) sulfide, 4 parts of decabromodiphenylethane, 3 parts of bis-2,2,6,6-tetramethylpiperidinol sebacate and aminopropyl tris 3 parts of ethoxysilane;

[0036] The preparation method of modified syndiotactic styrene is as follows:

[0037] (1) Graphene oxide was prepared by the improved Hummers method; 1 g of graphene oxide was dissolved in 100 mL of deionized water, 2 mL of concentrated sulfuric acid was added, and an excess of 2 mol / L aqueous solution of twelve amino acids was added dropwise under vigorous stirring at 80 ° C. After adding, keep the temperature for 3 hours, filter with suction, wash with water until neutral, and dry in vacuum at 70C to constant weight to o...

Embodiment 3

[0040] The preparation of embodiment 3 sPS film

[0041] Composition of raw materials (parts by weight): 105 parts of modified syndiotactic styrene, 65 parts of acrylate resin, 10012 parts of Degussa Dyhard, 6 parts of polyether modified polysiloxane, bis(3,5-tertiary butyl- 7 parts of 4-hydroxyphenyl)sulfide, 2 parts of decabromodiphenylethane, 2 parts of bis-2,2,6,6-tetramethylpiperidinol sebacate and aminopropyltriethoxy 1 part of silane;

[0042] The preparation method of modified syndiotactic styrene is as follows:

[0043] (1) Graphene oxide was prepared by the improved Hummers method; 1 g of graphene oxide was dissolved in 100 mL of deionized water, 2 mL of concentrated sulfuric acid was added, and an excess of 2 mol / L aqueous solution of twelve amino acids was added dropwise under vigorous stirring at 80 ° C. After adding, keep the temperature for 3 hours, filter with suction, wash with water until neutral, and dry in vacuum at 70C to constant weight to obtain sulfon...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a sPS (syndiotactic polystyrene) film and a preparation method thereof. The film is prepared from the following raw materials in parts by weight: 100 to 120 parts of modified sPS, 60 to 80 parts of adhesive resin, 10 to 15 parts of Degussa Dyhard 100, 5 to 10 parts of polyether modified polysiloxane, 5 to 10 parts of bis(3,5-tert-butyl-4-hydroxyphenyl) thioether, 1 to 4 parts of decabromodiphenyl ethane, 1 to 3 parts of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate and 1 to 3 parts of aminopropyltriethoxysilane. The modified syndiotactic polystyrene is added into the film; through the modification by oxidized graphene and aluminium oxide, the prepared modified syndiotactic polystyrene has good mechanical performance and high polarity; the conductivity and the flame-resistant performance are obviously improved; the wide application prospects are realized.

Description

technical field [0001] The invention relates to the technical field of polymer film, in particular to an sPS film. Background technique [0002] FPC is the abbreviation of Flexible Printed Circuit, also known as flexible printed circuit board. It is a printed circuit board made of flexible insulating substrate. It has many advantages that rigid printed circuit boards do not have. Its wiring density is high, Light weight, thin thickness, good bendability. The use of FPC can greatly reduce the volume of electronic products, which is in line with the development direction of electronic products to high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, smart phones, digital cameras and other fields or products. FPC also has the advantages of good heat dissipation and solderability, easy assembly and low overall cost. With the increase in sales of smart elect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09J125/06C09J171/12C09J11/08C09J11/06C09J11/04C09J7/30
CPCC08L2205/03C09J11/04C09J11/06C09J11/08C09J125/06C09J2425/00C09J7/30C08L71/12C08L83/12C08K5/03C08K5/544C08K9/06C08K3/042C08K7/00C08K13/06
Inventor 夏超华
Owner 苏州市新广益电子股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap