A preparation method of fluorinated conductive particles/PVDF-based composite dielectric film
A composite dielectric film and conductive particle technology, which is applied in the field of preparation of polymer-based composite dielectric films, can solve the problems of high dielectric constant, high breakdown strength, low dielectric loss, and weak interaction, etc., and achieve Improve interfacial compatibility, increase dielectric constant, and uniform electric field distribution
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0019] (1) Dissolve 2.0 g of PVDF and 0.002 g of fluorinated graphite in N, N-dimethylformamide (DMF), stir magnetically at 35 °C for 20 min, and ultrasonically disperse for 10 min to form a uniform and stable solution A and B;
[0020] (2) Mix the solutions A and B obtained in step (1), stir magnetically at 35°C for 20 minutes, and disperse ultrasonically for 10 minutes to obtain a uniform and stable solution C;
[0021] (3) Pour solution C onto an ultra-flat petri dish to prepare a composite dielectric film, dry the composite film at 80°C for 3 h, and evaporate the organic solvent to obtain a composite film D;
[0022] (4) In order to obtain a high-quality composite film, the defects in the composite film D (such as pores, surface smoothness and impurities, etc.) must be further removed. The composite film D was vacuum-dried at 120 °C for 12 h, and then annealed to room temperature. Relevant data can be obtained through testing, such as Figure 1-4 It can be seen that the ...
Embodiment 2
[0024] (1) Dissolve 2.0g of PVDF and 0.01g of fluorinated carbon black in N,N-dimethylformamide (DMF), stir magnetically at 40°C for 30 minutes, and ultrasonically disperse for 15 minutes respectively to form a uniform and stable solution A and B;
[0025] (2) Mix the solutions A and B obtained in step (1), stir magnetically at 40°C for 30 minutes, and disperse ultrasonically for 15 minutes to obtain a uniform and stable solution C;
[0026] (3) Pouring solution C onto an ultra-flat petri dish to prepare a composite dielectric film, drying the composite film at 85°C for 3.5 h, evaporating the organic solvent, and obtaining composite film D;
[0027] (4) In order to obtain a high-quality composite film, the defects in the composite film D (such as pores, surface smoothness and impurities, etc.) must be further removed. The composite film D was vacuum-dried at 130 °C for 9 h, and then annealed to room temperature. Relevant data can be obtained through testing, such as Figure ...
Embodiment 3
[0029] (1) Dissolve 2.0g of PVDF and 0.02g of fluorinated carbon nanotubes in N,N-dimethylformamide (DMF), stir magnetically at 45°C for 40 minutes, and ultrasonically disperse for 20 minutes respectively to form a uniform and stable Solutions A and B;
[0030] (2) Mix the solutions A and B obtained in step (1), stir magnetically at 45°C for 40 minutes, and disperse ultrasonically for 20 minutes to obtain a uniform and stable solution C;
[0031] (3) Pouring solution C onto an ultra-flat petri dish to prepare a composite dielectric film, drying the composite film at 90°C for 4 h, evaporating the organic solvent, and obtaining a composite film D;
[0032] (4) In order to obtain a high-quality composite film, the defects in the composite film D (such as pores, surface smoothness and impurities, etc.) must be further removed. The composite film D was vacuum-dried at 140 °C for 10 h, and then annealed to room temperature. Relevant data can be obtained through testing, such as F...
PUM
| Property | Measurement | Unit |
|---|---|---|
| melt flow index | aaaaa | aaaaa |
| breakdown field strength | aaaaa | aaaaa |
| energy density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


