Silicon carbide-based composite circuit board and preparation method thereof

A silicon carbide-based, composite circuit technology, applied in the field of circuit boards, can solve the problems of easy generation of holes in the green body, low pass rate, and influence on the performance of the substrate, and achieve the effects of high mechanical strength, reduced scrap rate, and not easy to delaminate and crack

Inactive Publication Date: 2019-05-31
国网河南省电力公司社旗县供电公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this invention, the green body is firstly heat-treated, and then sintered at a high temperature. Without low-temperatu

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] This embodiment provides a silicon carbide-based composite circuit board, including a silicon carbide-based composite substrate and a circuit diagram printed on the silicon carbide-based composite substrate, and the silicon carbide-based composite substrate is made of the following raw materials in parts by weight : 50 parts of silicon carbide, 20 parts of glass powder, 5 parts of filler, 3 parts of binder, 7 parts of auxiliary agent.

[0028] The filler is a mixture of nano-titanium oxide and calcium silicate, and the weight ratio of nano-titanium oxide: calcium silicate is 1:2.

[0029] The binder is made of the following parts by weight: 25 parts of phenolic resin, 12 parts of sodium silicate, 5 parts of sodium laurylalanine, 42 parts of ethanol, 6 parts of hexamethylenetetramine, Silane coupling agent KH560 2 parts.

[0030] The auxiliary agent is a mixture of tributyl phosphate, aluminum oxide and calcium lignosulfonate, and the weight ratio of tributyl phosphate:...

Embodiment 2

[0039]This embodiment provides a silicon carbide-based composite circuit board. The difference from Embodiment 1 is that in this embodiment, the silicon carbide-based composite substrate is made of the following raw materials in parts by weight: 52 parts of silicon carbide, 22 parts of glass powder 6 parts, 6 parts of filler, 4 parts of binder, 8 parts of auxiliary agent.

[0040] The filler is a mixture of nano titanium oxide and calcium silicate, and the weight ratio of nano titanium oxide to calcium silicate is 1:2.2.

[0041] The binder is made of the following parts by weight: 26 parts of phenolic resin, 14 parts of sodium silicate, 6 parts of sodium laurylalanine, 43 parts of ethanol, 7 parts of hexamethylenetetramine, Silane coupling agent KH560 3 parts.

[0042] The auxiliary agent is a mixture of tributyl phosphate, aluminum oxide and calcium lignosulfonate, and the weight ratio of tributyl phosphate: aluminum oxide: calcium lignosulfonate is 1:0.6:1.1.

Embodiment 3

[0044] This embodiment provides a silicon carbide-based composite circuit board. The difference from Embodiment 1 is that in this embodiment, the silicon carbide-based composite substrate is made of the following raw materials in parts by weight: 54 parts of silicon carbide, 24 parts of glass powder parts, 7 parts of fillers, 5 parts of binders, and 9 parts of additives.

[0045] The filler is a mixture of nano titanium oxide and calcium silicate, and the weight ratio of nano titanium oxide to calcium silicate is 1:2.4.

[0046] The binder is made of the following parts by weight: 27 parts of phenolic resin, 15 parts of sodium silicate, 6.5 parts of sodium laurylalanine, 44 parts of ethanol, 7.5 parts of hexamethylenetetramine, Silane coupling agent KH560 3.5 parts.

[0047] The auxiliary agent is a mixture of tributyl phosphate, aluminum oxide and calcium lignosulfonate, and the weight ratio of tributyl phosphate: aluminum oxide: calcium lignosulfonate is 1:0.6:1.2.

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Abstract

The invention discloses a silicon carbide-based composite circuit board and a preparation method thereof and belongs to the technical field of circuit boards. The silicon carbide-based composite circuit board comprises a silicon carbide-based composite base board and a circuit printed on the silicon carbide-based composite base board, wherein the silicon carbide-based composite circuit board is prepared from raw materials of, by weight part, 50-60 parts of silicon carbide, 20-28 parts of glass powder, 5-10 parts of filler, 3-7 parts of adhesives and 7-12 parts of additives. The silicon carbide-based composite circuit board is prepared by taking the silicon carbide and the glass powder as the main component and matching with the filler, the adhesives and the additives through ball milling,ultrasonic treatment, spray granulation and three sintering processes. Through dispersion and adhesion of the raw materials, the prepared silicon carbide-based composite base board can be low in thermal expansion coefficient, high in mechanical strength, good in stability and capable of effectively improving the qualification rate, thereby being high in promotional significance.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a silicon carbide-based composite circuit board and a preparation method thereof. Background technique [0002] Compared with traditional silicon (Si) materials, silicon carbide (SiC) is widely used in high-power switching circuits and power system applications due to its wider band gap, higher thermal conductivity and higher critical breakdown field strength. has received widespread attention. The most prominent performance advantage of SiC power devices lies in their high-voltage, high-frequency and high-temperature operating characteristics, which can effectively reduce the power loss of power electronic systems. Although the application prospect of silicon carbide-based substrates is broad, in the actual production process, there are problems such as low sintering density and low utilization rate of raw materials, which restrict the large-scale use of this kind of mat...

Claims

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Application Information

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IPC IPC(8): C04B35/565C04B41/88
Inventor 张性东石岩王伟邱国林惠东军雷震姜军张春焦玉振王丽张菲张浩
Owner 国网河南省电力公司社旗县供电公司
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