Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polyphenyl ether modified cyanate resin copper-clad plate and preparation method thereof

A technology of cyanate resin and polyphenylene ether resin, applied in the field of polyphenylene ether modified cyanate resin copper clad laminate and its preparation, can solve the problems of product corrosion of fine wiring, generation of harmful compounds, halide dissociation, etc. , to achieve good market prospects and economic benefits, reduce production costs, and excellent impact resistance

Inactive Publication Date: 2019-05-31
ZHEJIANG COLLEGE OF ZHEJIANG UNIV OF TECHOLOGY
View PDF14 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the perspective of safety in use, the material is required to be flame retardant, and the traditional copper-clad laminate achieves flame-retardant effect by adding halides to the resin, but the copper-clad laminate may cause fire after high temperature and long-term use. The halide dissociates, and the products after dissociation have the danger of corroding fine wiring; and the waste electronic components after use will produce harmful compounds after burning, polluting the environment and endangering the human body

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyphenyl ether modified cyanate resin copper-clad plate and preparation method thereof
  • Polyphenyl ether modified cyanate resin copper-clad plate and preparation method thereof
  • Polyphenyl ether modified cyanate resin copper-clad plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A polyphenylene ether modified cyanate resin copper clad laminate and a preparation method thereof, wherein the polyphenylene ether modified cyanate resin composition comprises the following components by weight: 100 parts by weight of polyphenylene ether resin, cyanate ester 300 parts of resin, 4 parts of epoxy resin, 15 parts of polyolefin resin, 20 parts of bisphenol A, 4 parts of accelerator, 50 parts of filler, 10 parts of flame retardant, some alkali-free glass fiber cloth, solvent, silane coupling agent .

[0046] Further, the structural formula of the polyphenylene ether resin is as follows:

[0047]

[0048] In the formula, n is an integer of 1-30.

[0049] Further, the cyanate resin is a bisphenol E type cyanate, and the structural formula of the cyanate resin is as follows:

[0050]

[0051] Further, the polyolefin resin is a styrene-butadiene copolymer.

[0052] Further, the solvent includes toluene, methanol, deionized water, ethanol and dichlorome...

Embodiment 2

[0071] A polyphenylene ether modified cyanate resin copper clad laminate and a preparation method thereof, wherein the polyphenylene ether modified cyanate resin composition comprises the following components by weight: 100 parts by weight of polyphenylene ether resin, cyanate resin 400 parts, 2.5 parts of epoxy resin, 10 parts of polyolefin resin, 20 parts of bisphenol A, 4 parts of accelerator, 50 parts of filler, 12 parts of flame retardant, some alkali-free glass fiber cloth, solvent, silane coupling agent.

[0072] Further, the structural formula of the polyphenylene ether resin is as follows:

[0073]

[0074] In the formula, n is an integer of 1-30.

[0075] Further, the cyanate resin is tetramethyl bisphenol F type cyanate resin, and the structural formula of the cyanate resin is as follows respectively:

[0076]

[0077] Further, the polyolefin resin is a styrene-butadiene-divinylbenzene copolymer.

[0078] Further, the solvent includes toluene, methanol, deio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a polyphenyl ether modified cyanate resin copper-clad plate and a preparation method thereof. A polyphenyl ether modified cyanate resin composition comprises polyphenyl ether resin, cyanate resin, epoxy resin, polyolefin resin, bisphenol A, a promoting agent, filler and a flame-retardant agent. The cyanate resin is modified by the thermoplastic polyphenyl ether resin, the modified filler, the flame-retardant agent, epoxy resin and polyolefin resin are added into a cyanate resin system, and the obtained resin system is subjected to blending polymerization to form an interpenetrating network structure, so that high impact resistance of cyanate resin is achieved. The prepared copper-clad plate has advantages of great dielectric properties, high heat conductivity, highflame retardation and high mechanical strength, production cost can be reduced, a promising market prospect and high economic benefits are achieved, and environmental friendliness and safety in use are realized.

Description

technical field [0001] The invention relates to a preparation method of a copper clad laminate, in particular to a polyphenylene ether modified cyanate resin copper clad laminate and a preparation method thereof. Background technique [0002] Copper Clad Laminate (CCL for short) is abbreviated as copper clad laminate, which is impregnated with resin and dried to form a prepreg. One or several prepregs are stacked together, and one or both sides are covered with copper. Foil, a sheet-like material formed by heat pressing. CCL is the base material for processing printed circuit boards (PCB), and is one of the basic products of the electronics industry. [0003] With the rapid development of electronic technology, the information processing of mobile communications, servers, and large computers continues to develop in the direction of "high-frequency signal transmission and high-speed digitalization", prompting electronic products to become "light", "small" and "thin". , "fas...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L79/04C08L71/02C08L63/00C08L25/10C08K13/06C08K9/06C08K3/22C08K7/26C08K5/14C08K5/523C08K3/34B32B5/02B32B15/04B32B15/20B32B17/06B32B37/10B32B37/24
Inventor 赵正平杨怡纯杨晋涛钟明强陈枫
Owner ZHEJIANG COLLEGE OF ZHEJIANG UNIV OF TECHOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com