Preparation method of non-interface thermoplastic thermosetting polyimide composite film

A technology of polyimide and composite film, which is applied in the direction of coating, etc., and can solve the problems of low dimensional stability of the thermoplastic layer when heated, delamination and blistering, etc.

Inactive Publication Date: 2019-06-11
NINGBO EXCITON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermoplastic thermosetting polyimide composite film prepared by the invention has no interface delamination between the thermoplastic film layer and the thermosetting film layer, and has good compound processability with copper foil, which solves the problem of existing thermoplastic thermosetting polyimide composite film. Solve the problem of delamination and foaming when the amine composite film and copper foil are thermally laminated, and improve the problem of low dimensional stability of the thermoplastic layer when heated

Method used

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  • Preparation method of non-interface thermoplastic thermosetting polyimide composite film
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  • Preparation method of non-interface thermoplastic thermosetting polyimide composite film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] The preparation method of thermoplastic thermosetting polyimide composite film comprises the following steps:

[0076] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic dianhydride, 3,3', 4,4'-biphenyl dianhydride for polymerization reaction, reaction time 4 hours, 3,3', 4,4'-biphenyl dianhydride: pyromellitic dianhydride: 4 , The molar ratio of 4'-diaminodiphenyl ether:p-phenylenediamine is 0.15:0.85:0.50:0.502, and the polyamic acid glue A with a solid content of 19.3wt% is obtained;

[0077] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 45°C, first dissolve 3,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add 3,3',4,4 '-Diphenyl ether dianhydride is polymerized, the reaction time is 5.5 hours, the molar ratio of 3,3',4,4'-diphenyl ethe...

Embodiment 2

[0082] The preparation method of thermoplastic thermosetting polyimide composite film comprises the following steps:

[0083] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic dianhydride, 3,3', 4,4'-biphenyl dianhydride for polymerization reaction, reaction time 4 hours, 3,3', 4,4'-biphenyl dianhydride: pyromellitic dianhydride: 4 , The molar ratio of 4'-diaminodiphenyl ether:p-phenylenediamine is 0.15:0.85:0.52:0.483, and the polyamic acid glue A with a solid content of 19.3wt% is obtained;

[0084] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 45°C, first dissolve 4,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add 3,3',4,4 '-Diphenyl ether dianhydride is polymerized, the reaction time is 4.5 hours, the molar ratio of 3,3',4,4'-diphenyl ethe...

Embodiment 3

[0089] The preparation method of thermoplastic thermosetting polyimide composite film comprises the following steps:

[0090] (1) Under the condition of normal pressure filled with nitrogen in the stirred tank at 35°C, first dissolve 4,4'-diaminodiphenyl ether and p-phenylenediamine in dimethylacetamide solvent, and then add pyromellitic tetra Formic dianhydride, 3,3', 4,4'-biphenyl dianhydride for polymerization reaction, reaction time 4 hours, 3,3', 4,4'-biphenyl dianhydride: pyromellitic dianhydride: 4 , The molar ratio of 4'-diaminodiphenyl ether:p-phenylenediamine is 0.15:0.85:0.55:0.453, and the polyamic acid glue A with a solid content of 19.3wt% is obtained;

[0091] (2) Under the condition of normal pressure filled with nitrogen in the stirred tank at 45°C, first dissolve 4,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add 2,2'-phenylene sulfide -4,4',5,5'-biphenyl dianhydride for polymerization reaction, reaction time 4 hours, 2,2'-phenylene sulfid...

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Abstract

The invention relates to a preparation method of a thermoplastic thermosetting polyimide composite film, and belongs to the technical field of special engineering plastic films. The invention aims toprovide a preparation method of a thermoplastic thermosetting polyimide composite film. The preparation method comprises the following steps: (1) preparing thermosetting polyamide acid glue A; (2) preparing thermoplastic polyamide acid glue B; (3) performing casting film formation on the polyamide acid glue A on the surface of a mirror annular stainless steel strip through a precision die head, performing initial baking so as to obtain a glue film A, and performing corona or plasma treatment on the surface of the glue film A; (4) coating the polyamide acid glue B to both sides of the glue filmA, and performing initial baking; (5) performing synchronous or stepwise two-way stretching, performing chemical or thermal imidization, and performing coiling so as to obtain the polyimide compositefilm. The preparation method can be industrialized, the prepared polyimide composite film has the performance advantages of no interface delamination, high peeling stability, high dimensional stability and the like.

Description

technical field [0001] The invention relates to a non-interface thermoplastic thermosetting polyimide composite film and a production method thereof, which belong to the technical field of special engineering plastic films and can meet the needs of light and thin flexible electronic printed circuit boards. Background technique [0002] Polyimide refers to a class of polymers containing imide rings (-CO-NH-CO-) in the main chain. It has excellent mechanical, dielectric, radiation resistance, and corrosion resistance at high temperatures. It is a One of the materials with the best comprehensive properties among organic polymer materials, [0003] Known as the "Pearl in the Crown" of high-tech materials and the "expert" in solving microelectronics technologies such as VLSI in the 21st century, it has broad application space in aerospace, electronic information, and automobile industries. With the development of electronic products in the direction of multi-function and miniatu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C08J7/12C08G73/10C08L79/08
Inventor 张彦唐海江吴小杰
Owner NINGBO EXCITON TECH
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