Novel electronic material with high thermal stability and preparation method thereof

A technology with high thermal stability and new materials, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, epoxy resin glue, etc., can solve the problem of affecting the service life of LEDs, cracking of epoxy packaging materials, thermal stability Poor performance and other problems, to achieve the effect of improving crack resistance, reducing self-aggregation, and improving crack resistance

Active Publication Date: 2019-06-14
SUZHOU YUDESHUI ELECTRIC TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problem that traditional LED epoxy packaging materials have poor thermal stability under the conditions of high-power LED use, resulting in cracking and warping of epoxy packaging materials during use, which affects the service life of LEDs, a solution is provided. A new electronic material with high thermal stability and its preparation method

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  • Novel electronic material with high thermal stability and preparation method thereof

Examples

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example 1

[0042] A new electronic material with high thermal stability, mainly including: 65 parts of epoxy resin E-44, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of curing agent, 18 parts of additives, 24 parts by weight Parts of modified titanium dioxide, 5 parts of zinc chloride, 10 parts of epoxidized soybean oil.

[0043] A method for preparing new electronic materials with high thermal stability, the method for preparing new electronic materials with high thermal stability mainly includes the following preparation steps:

[0044] (1) Mix nano-silica and polyacrylic acid in a beaker at a mass ratio of 1:2, and add N,N-dimethylformamide, which is 300 times the mass of nano-silica, to the beaker at a temperature of 90°C , under the condition of rotating speed of 360r / min, stir and mix for 80min to obtain nano-silica mixed dispersion, mix nano-silica mixed dispersion with 4-dimethylaminopyridine at a mass ratio of 200:1, and add 4- N,N'-dicyclohexylcarbodiimid...

example 2

[0054] A new electronic material with high thermal stability, mainly including: 65 parts of epoxy resin E-51, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of curing agent, 18 parts of additives, 24 parts by weight. Parts of modified titanium dioxide, 5 parts of zinc chloride, 10 parts of epoxidized soybean oil.

[0055] A method for preparing new electronic materials with high thermal stability, the method for preparing new electronic materials with high thermal stability mainly includes the following preparation steps:

[0056] (1) Mix nano-silica and polyacrylic acid in a beaker at a mass ratio of 1:2, and add N,N-dimethylformamide, which is 300 times the mass of nano-silica, to the beaker at a temperature of 90°C , under the condition of rotating speed of 360r / min, stir and mix for 80min to obtain nano-silica mixed dispersion, mix nano-silica mixed dispersion with 4-dimethylaminopyridine at a mass ratio of 200:1, and add 4- N,N'-dicyclohexylcarbodiimi...

example 3

[0066] A new electronic material with high thermal stability, mainly including: 65 parts of epoxy resin E-44, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of tetraethylenepentamine, 18 parts of additives in parts by weight , 24 parts of modified titanium dioxide, 5 parts of zinc chloride, 10 parts of epoxidized soybean oil.

[0067] A method for preparing new electronic materials with high thermal stability, the method for preparing new electronic materials with high thermal stability mainly includes the following preparation steps:

[0068] (1) Mix nano-silica and diisocyanate at a mass ratio of 1:1, and add anhydrous acetone 30 times the mass of nano-silica and epoxy resin solution 5 times the mass of nano-silica, in a nitrogen gas atmosphere Under the conditions of temperature 150°C and rotation speed 320r / min, after stirring and reacting for 24 hours, filter and dry under the condition of temperature 80°C;

[0069] (2) Mix the substance obtained in s...

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Abstract

The invention discloses a novel electronic material with high thermal stability and a preparation method thereof and belongs to the field of high molecular materials for electronics. The preparation method comprises the following steps: Firstly, after carrying out chain expanding on nano silicon dioxide through polyacrylic acid, mixing with tetraethylenepentamine and polyethylenimine to prepare aminated nano silicon dioxide; then grafting the nano silicon dioxide with an epoxy group under the action of isocyanate; then grafting a flexible chain section containing hydroxyl on the nano silicon dioxide grafted with the epoxy group under the action of alkaline amine, so as to prepare modified nano silicon dioxide; finally, mixing epoxy resin, filler, a diluting agent, the aminated nano silicondioxide, the modified nano silicon dioxide, epoxidized soybean oil and a catalyst to prepare the novel electronic material with high thermal stability. The novel electronic material with high thermalstability, prepared by the technical scheme, can have very good utilization performance under a high-temperature condition.

Description

technical field [0001] The invention relates to the field of polymer materials for electronics, in particular to a new electronic material with high thermal stability and a preparation method thereof. Background technique [0002] LED lights are composed of five parts: light-emitting chips, wires, brackets, conductive layers, and packaging materials. The main function of the packaging materials is to protect the chip part, prevent the chip from being corroded by moisture or oxygen in the external environment, and ensure the luminous efficiency of the LED. . With the improvement of LED industry and technology, the performance requirements for LED packaging materials are becoming more and more stringent. [0003] At present, LED packaging materials mainly include resins with high transparency such as epoxy resin, silicone, and silicone-modified epoxy resin. Since different packaging materials have different prices and functions, the application occasions and output are also d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04
CPCC08K2003/0812C08K2003/168C08K2003/2241C08K2201/011C08L2201/08C08L2203/206C09J11/04C09J11/08C09J163/00C08L91/00C08K9/08C08K3/36C08K3/08C08K3/22C08K3/16
Inventor 高路生
Owner SUZHOU YUDESHUI ELECTRIC TECH CO LTD
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