A kind of dual curing reactive polyurethane hot melt adhesive and its preparation method and application

A polyurethane hot-melt adhesive, dual-curing technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of inability to meet the rapid assembly of electronic products, inability to meet use requirements, and long positioning time. , to achieve the effect of improved positioning and curing speed, fast positioning and setting time, and improved aging resistance

Active Publication Date: 2021-09-07
MIRACLL CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Reactive polyurethane hot melt adhesive, as a high-performance and environmentally friendly adhesive, has met the needs of more and more attention to the environment at home and abroad, and has developed rapidly. However, the current technical level of domestic reactive polyurethane hot melt adhesives is relatively low. The main method is moisture curing, and the melt viscosity is high, and the positioning time is long, which cannot meet the requirements of rapid assembly in the electronic product industry. The UV curing adhesive is generally acrylic adhesive, although the curing speed is fast, but the moisture Poor wetness, low degree of curing, low strength, and can not meet the requirements of bags and microelectronics industry

Method used

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  • A kind of dual curing reactive polyurethane hot melt adhesive and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Under inert gas protection, polybutylene itaconate diol (molecular weight 2300g / mol, acid value 3.4mgKOH / g) 1000g, polybutylene adipate diol (molecular weight 2000g / mol, acid value) Add 300g of 0.14mgKOH / g) into the reactor, dehydrate at 100°C and -0.09MPa for 2h, then cool down to 70°C, add 0.5g of stannous octoate, 264g of diphenylmethane diisocyanate, at a speed of 350r / min Under mechanical stirring, react at 75°C for 2.5h, then add 10g of 2-hydroxy-2-methyl-1-phenylacetone, 15g of E-44 epoxy resin, raise the temperature to 100°C, depressurize to -0.09MPa, remove Bubble treatment for 0.5h, discharging, vacuum-sealed packaging, and a dual-curing reactive polyurethane hot-melt adhesive was obtained. The melt viscosity of the prepared polyurethane hot-melt adhesive was 8000mPa·s at 100°C. Evaluate its performance, as shown in Table 1.

Embodiment 2

[0023] Under the protection of an inert gas, polyethylene glycol itaconate diol (molecular weight 2800g / mol, acid value 3.6mgKOH / g) 1200g, polytetrahydrofuran ether diol (molecular weight 1800g / mol, acid value 0.05mgKOH / g) Add 600g into the reactor, dehydrate at 105°C and -0.095MPa for 2h, then cool down to 75°C, add 1.0g of dimorpholine diethyl ether, 381g of diphenylmethane diisocyanate, and turn at 450r / min Stir mechanically, react at 80°C for 3 hours, then add 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone 15g, E-12 epoxy Resin 18g, heated up to 100°C, decompressed to -0.095MPa, defoamed for 0.7h, discharged, vacuum-sealed and packaged to obtain a dual-curing reactive polyurethane hot-melt adhesive, which was melted at 100°C The viscosity is 7100mPa·s. Evaluate its performance, as shown in Table 1.

Embodiment 3

[0025] Under inert gas protection, polybutylene itaconate diol (molecular weight 2500g / mol, acid value 3.0mgKOH / g) 1000g, polyoxypropylene glycol (molecular weight 2000g / mol, acid value 0.03mgKOH / g) Add 250g into the reactor, dehydrate at 110°C and -0.09MPa for 2.5h, then cool down to 80°C, add 0.6g of monobutyltin oxide, 195g of hexamethylene diisocyanate, and mechanically stir at a speed of 400r / min. React at 80°C for 3.5h, then add 25g of 2,4-dihydroxybenzophenone and 22g of bisphenol A epoxy resin, heat up to 105°C, depressurize to -0.098MPa, defoam for 0.5h, and discharge. Vacuum-sealed packaging is used to prepare a dual-curing reactive polyurethane hot-melt adhesive. The melt viscosity of the prepared polyurethane hot-melt adhesive is 6000mPa·s at 100°C. Evaluate its performance, as shown in Table 1.

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Abstract

The invention belongs to the field of hot-melt adhesives, and in particular relates to a dual-curing reactive polyurethane hot-melt adhesive and its preparation method and application. The polyurethane hot-melt adhesive is made of the following raw materials in parts by weight: 45-75 parts of unsaturated polyol, saturated 15-35 parts of polyol, 0.01-0.08 part of catalyst, 8-20 part of diisocyanate, 0.3-3 part of photoinitiator and 0.5-2 part of adhesion promoter; the reactive polyurethane hot melt adhesive prepared by the present invention has dual curing method, its melt viscosity, bonding strength, flexibility, water resistance, solvent resistance, aging resistance, positioning and curing speed are significantly improved compared with ordinary moisture-cured polyurethane hot melt adhesives, which can meet the needs of high-end electronic industries such as smartphones and cameras. The harsh use requirements of rapid assembly.

Description

technical field [0001] The invention belongs to the field of hot-melt adhesives, in particular to a dual-curing reactive polyurethane hot-melt adhesive and its preparation method and application. Background technique [0002] With the rapid development of science and technology, it has brought about increasingly serious environmental pollution, and it is imperative to develop low-pollution or non-pollution environmentally friendly adhesives. The development of water-based, solidified, solvent-free, and low-toxicity has become the main direction for the development of adhesives in the future. Hot-melt adhesives are used more and more because of their fast bonding, high efficiency, no pollution, and non-toxicity. However, traditional hot-melt adhesives are generally composed of thermoplastic substances, which are not heat-resistant and easily soluble in organic solvents. , and the bonding strength is not very high, so it is mainly used in products that do not require heat res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/14C09J11/06C09J11/08C08G18/42C08G18/48C08G18/73C08G18/76
Inventor 宋红玮刘德富傅恺凡高玉宝周娅
Owner MIRACLL CHEM
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