Rapid pre-treatment method for copper electroplating on aluminum substrate

A technology for electroplating copper and aluminum substrates, applied in the field of printed circuit boards, can solve the problems of poor adhesion and adhesion of coatings, poor corrosion resistance, and pollute the environment, and achieve the advantages of improving the adhesion of coatings, improving surface roughness, and simplifying the process. Effect

Inactive Publication Date: 2019-06-18
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the disadvantages and deficiencies in the prior art of cumbersome process, polluted environment, poor corrosion resistance and poor adhesion and bonding of the coating, the purpose of the present invention is to provide a fast pretreatment method for electroplating copper on the aluminum substrate of the PCB circuit board , especially for the copper plating treatment method in the hole of the aluminum substrate, this method has less corrosion damage to the surface of the aluminum substrate, and the coating is uniform and dense

Method used

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  • Rapid pre-treatment method for copper electroplating on aluminum substrate
  • Rapid pre-treatment method for copper electroplating on aluminum substrate
  • Rapid pre-treatment method for copper electroplating on aluminum substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Cut a certain area of ​​the aluminum substrate and perform copper plating on the aluminum substrate according to the following steps:

[0037] 1. Alkaline degreasing liquid components: 10g / L sodium hydroxide, 20g / L sodium carbonate, 5g / L sodium silicate, 10g / L sodium phosphate

[0038] 2. Preparation of acid etching solution: Measure 10ml of hydrochloric acid, add it to 90ml of deionized water, and stir evenly to obtain an acid etching solution.

[0039] 3. The components of the activation solution: 50mg / L palladium chloride, 1ml / L concentrated hydrochloric acid, 10mg / L ammonium chloride

[0040] 4. Components of copper plating solution: 100g / L copper sulfate, 30ml / L sulfuric acid, 10mg / L OP-10

[0041] 5. Plating:

[0042] (1) Cut a certain area of ​​the aluminum substrate and put it into an alkaline degreasing solution for alkaline degreasing for 5 minutes at a temperature of 70°C, and then fully wash it with deionized water;

[0043] (2) Put the degreased substrat...

Embodiment 2

[0049] Cut a certain area of ​​the aluminum substrate and perform copper plating on the aluminum substrate according to the following steps:

[0050] 1. Alkaline degreasing liquid components: 20g / L sodium hydroxide, 20g / L sodium carbonate, 5g / L sodium silicate, 10g / L sodium phosphate

[0051] 2. Preparation of acid etching solution: Measure 30ml of hydrochloric acid, add it to 70ml of deionized water, and stir evenly to obtain acid etching solution.

[0052] 3. The components of the activation solution: 40mg / L palladium chloride, 1ml / L concentrated hydrochloric acid, 10mg / L ammonium chloride

[0053] 4. Components of copper plating solution: 160g / L copper sulfate, 50ml / L sulfuric acid, 10mg / L polyethylene glycol

[0054] 5. Plating:

[0055] (1) Cut a certain area of ​​the aluminum substrate and put it into an alkaline degreasing solution for alkaline degreasing for 3 minutes at a temperature of 60°C, and then fully wash it with deionized water;

[0056] (2) Put the degreased...

Embodiment 3

[0062] Cut a certain area of ​​the aluminum substrate and perform copper plating on the aluminum substrate according to the following steps:

[0063] 1. Alkaline degreasing liquid components: 30g / L sodium hydroxide, 20g / L sodium carbonate, 5g / L sodium silicate, 10g / L sodium phosphate

[0064] 2. Preparation of acid etching solution: Measure 50ml of hydrochloric acid, add it into 50ml of deionized water, and stir evenly to obtain acid etching solution.

[0065] 3. The components of the activation solution: 50mg / L palladium chloride, 1ml / L concentrated hydrochloric acid, 30mg / L ammonium chloride

[0066] 4. Components of copper plating solution: 150g / L copper sulfate, 50ml / L sulfuric acid, 10mg / L polyethylene glycol

[0067] 5. Plating:

[0068] (1) Cut a certain area of ​​the aluminum substrate and put it into the alkaline degreasing solution for alkaline degreasing for 1min at a temperature of 60°C, and then fully wash it with deionized water;

[0069] (2) Put the degreased...

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Abstract

The invention belongs to the technical field of printed circuit boards and discloses a rapid pre-treatment method for copper electroplating on an aluminum substrate. The method mainly comprises the following steps of alkaline de-oiling, acid etching, activating treatment, chemical nickel plating and copper electroplating. First, alkaline de-oiling and acid etching are carried out on the aluminum substrate to remove a surface oxide film and increase roughness. By controlling palladium solution components, hydrochloric acid content and activating time, the chemical nickel plating rate is greatlyincreased, plating is rapidly started, and a nickel plating with great bonding force can be stably obtained. By controlling copper plating solution components, current density and electroplating time, a uniform and dense copper plating with great bonding force is prepared. The preparing method for the copper plating on the aluminum substrate is high in stability, zinc dipping pretreatment is notneeded, the production technology is simplified, the environment is prevented from being polluted by a plating solution, and the service life of the plating solution is prolonged. By using the method,the obtained copper plating has the characteristics of evenness, density, great bonding force and the like and is suitable for industrial large-scale stable production.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards (PCB circuit boards), and in particular relates to a rapid pretreatment method for electroplating copper on an aluminum substrate. Background technique [0002] PCB circuit board, also known as printed circuit board, is a provider of electrical connections for electronic components. Printed circuit boards have developed from single-layer to double-sided, multi-layer and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuous reduction in size, cost reduction, and performance improvement enable printed circuit boards to maintain strong vitality in the development of future electronic products. With the development of light, thin, small, high-density and multi-functional electronic products, the assembly density and integration of components on printed boards are getting higher and higher, the power consumption ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/44C23G1/22C25D3/38C23C28/02
Inventor 王斌潘湛昌邱建杭胡光辉付裕
Owner GUANGDONG UNIV OF TECH
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