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A hydrophobic and quick-drying silicon chip carrier and its preparation method

A carrier and quick-drying technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, nanotechnology, etc., can solve the problems of reducing the surface cleanliness of silicon wafers, affecting the drying effect, increasing drying time, etc., to achieve hydrophobic effect Good, avoid the reduction of acid-base concentration, save time

Active Publication Date: 2021-07-02
BEIJING PLASTICS RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, after washing the silicon wafer with clean water, it needs to enter the drying process. If there is a lot of water or solution hanging on the wall of the silicon wafer carrier, it will affect the drying effect and increase the drying time. The third is the residue on the silicon wafer carrier. After the liquid evaporates, the residues of acid, alkali and salt pollute the silicon wafer and reduce the surface cleanliness of the silicon wafer

Method used

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  • A hydrophobic and quick-drying silicon chip carrier and its preparation method
  • A hydrophobic and quick-drying silicon chip carrier and its preparation method
  • A hydrophobic and quick-drying silicon chip carrier and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment １

[0026] 10 Kg of carbon fiber, 5 Kg of carbon black, and 0.5 Kg of graphene are added to 84.5 Kg of polyvinylidene fluoride resin, put into the hopper of a twin-screw extruder, set the heating temperature to 210 degrees, start the twin-screw extruder, and extrude The black round bars are granulated by a granulator for later use.

[0027] After the mold of the injection molding machine undergoes electric discharge treatment, the previous granulation raw materials are used to injection mold to obtain a silicon chip carrier. After testing, the contact angle of the prepared silicon chip carrier is 152°, and the rolling angle is 5.6°. Put the silicon wafer carrier into the water, and after taking it out, the water drops roll off quickly, making it difficult to attach to the silicon wafer carrier, and there is no water mark on the carrier.

[0028] Figure 1. The surface topography of the injection rod, in which the diameter of the carbon fiber is about 10 microns

Embodiment 2

[0030] 1 Kg of carbon fiber filaments, 10 Kg of carbon black, 0.5 Kg of graphene and 88.5 Kg of polyvinylidene fluoride resin, put into the twin-screw extruder, set the heating temperature to 220 degrees, start the twin-screw extruder, and extrude The black round bars are granulated by a granulator for later use. After the mold of the injection molding machine is corroded by strong acid, the previous granulation raw materials are used, the end plates at both ends of the silicon wafer carrier and the tie rods in the middle are respectively injection molded, and then integrally welded to obtain the silicon wafer carrier. After testing, the contact angle of the prepared silicon wafer carrier was 151°, and the rolling angle was 6.2°. Put the silicon chip carrier into 40% sodium hydroxide aqueous solution, after taking it out, the liquid rolls off quickly, it is difficult to attach to the silicon chip carrier, and there is no liquid residue on the carrier.

[0031] Figure 2. Topog...

Embodiment 3

[0033]30 Kg chopped carbon fiber, 1 Kg carbon black, 8 Kg graphene and 61 Kg polyvinylidene fluoride resin, add in the twin-screw extruder, set the heating temperature as 220 degrees, start the twin-screw extruder, extruded The black round bars are granulated by a granulator for later use. After the silicon chip carrier rod mold is processed by laser etching, the previous granulation raw materials are used for injection molding to obtain the silicon chip carrier rod. After testing, the contact angle of the tie rod of the prepared silicon wafer carrier was 150°, and the rolling angle was 8.1°. Put the tie bar of the silicon wafer carrier into the 30% sulfuric acid aqueous solution. After taking it out, the liquid rolls off quickly, and it is difficult to attach to the tie rod of the silicon wafer carrier. There is no liquid residue on the railing of the carrier.

[0034] Figure 3. Topography of the injected tie rod, using carbon fibers with a diameter of 5 μm.

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Abstract

The invention relates to the field of preparation technology, in particular to a silicon chip carrier capable of being quickly dried with hydrophobic surface and a preparation method thereof. The invention discloses a hydrophobic and quick-drying type silicon chip carrier and a preparation method thereof. The hydrophobic and quick-drying function is realized by manufacturing a micro-nano structure on the surface of the carrier. The manufacturing method of the micro-nano structure is as follows: Add 1 to 30 parts of carbon fiber, 1 to 10 parts of carbon black, and 0.5 to 8 parts of graphene to 97.5 parts of polyvinylidene fluoride resin. After mixing, extrude through twin-screws, granulate, and use the granules as raw materials. For injection or extrusion molding, the surface of the injection mold used is etched to form a suitable rough surface. The silicon chip carrier can be molded by one-time injection, or welded and assembled. The prepared hydrophobic silicon chip carrier can reduce the mixing of acid and alkali in cleaning, increase the effect of cleaning liquid, reduce drying time, save energy, and improve the cleanliness of the silicon chip surface.

Description

technical field [0001] The invention relates to the technical field of silicon chip carrier preparation, in particular to a silicon chip carrier with hydrophobic surface and fast drying and a preparation method thereof. Background technique [0002] Silicon wafer carrier is a container for silicon wafers to be etched and cleaned in acid and alkali cleaning solutions at a certain temperature in the production of silicon wafers. Carriers loaded with silicon wafers (hereinafter referred to as "silicon wafer carriers" according to industry practice) require long-term resistance to high temperature and acid and alkali solution corrosion, as well as strong rigidity and strength, and precise dimensions. Due to the need to withstand the corrosion of acid and alkali solutions, its material is generally polyvinylidene fluoride (PVDF), which is a tooling consumable in the production of silicon wafers and has a large market demand. Because it needs to pass through the acid-base solutio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673B82Y40/00
CPCB82Y40/00H01L21/67336
Inventor 刘哲伟朱道峰王国华陆长征张宝庆李海楠马南胡笑岩肖雪
Owner BEIJING PLASTICS RES INST
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