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Polyimide coating with functional material and method of preparing functional polyimide material by coating

A technology of polyimide and functional materials, applied in the direction of coating, etc., can solve the problems of weak bonding strength and high temperature resistance, and achieve the effect of good bonding strength, good bonding strength, and good bonding strength

Active Publication Date: 2019-09-13
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, electromagnetic shielding materials are usually metal alloy powders, ferromagnetic materials, conductive polymers, and carbon materials. When the above electromagnetic shielding materials are applied as coatings on polyimide films, it is usually necessary to combine different adhesives on the required materials. Coating and curing, when the adhesive is applied on the polyimide film, the bonding strength is often weak and not resistant to high temperature, which affects its application

Method used

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  • Polyimide coating with functional material and method of preparing functional polyimide material by coating
  • Polyimide coating with functional material and method of preparing functional polyimide material by coating
  • Polyimide coating with functional material and method of preparing functional polyimide material by coating

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Effect test

Embodiment 1

[0035] The preparation method of the polyimide coating with functional material of the present invention specifically comprises the steps: take 4.00g of 4,4-diaminodiphenyl ether (ODA) in a three-necked flask, add 80mLN, N -Dimethylacetamide (DMAC), stirred under nitrogen protection and ice-water bath until completely dissolved, added 8.88g of hexafluorodianhydride (6FDA) to the reaction system at one time, and continued to react for 12h under ice-water bath. After the reaction was completed, A slightly yellow viscous polyamic acid solution (PAA1) was obtained; 10.00 g of the polyamic acid solution (PAA1) was mixed with 2.40 g of titanium dioxide powder with a particle diameter of 60 nm to obtain a polyimide coating 1.

[0036] In the process of mixing and stirring, take an appropriate amount of polyimide coating 1 and evenly coat it on the polyimide film and ceramic sheet, and then put it in an oven for curing. The curing program is: 80°C×5h, 120°C× 1h, 160°C×1h, 200°C×1h, 24...

Embodiment 2

[0039] The preparation method of the polyimide coating with functional material of the present invention specifically comprises the steps: take 8.00g of 4,4'-diaminodiphenyl ether (ODA) in a three-necked flask, add 120mLN in the there-necked flask, N-dimethylformamide (DMF), stirred under nitrogen protection and ice-water bath until completely dissolved, added 11.76g of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) to the reaction In the system, the reaction was continued for 8 hours under an ice-water bath. After the reaction was completed, an egg-white viscous polyamic acid solution (PAA2) was obtained; 12.00g of the polyamic acid solution (PAA2) was mixed with 3.00g of silicon dioxide with a particle size of 16nm , to obtain polyimide coating 2.

[0040] In the process of mixing and stirring, take an appropriate amount of polyimide coating 2 and evenly coat it on the polyimide film and the ceramic sheet, and then put it in an oven for curing. The curing program is: 8...

Embodiment 3

[0043] The preparation method of the polyimide coating with functional materials of the present invention specifically includes the following steps: Weigh 4.97g of 4,4'-diaminodiphenyl sulfone in a three-necked flask, and add 60mL of N,N-dimethyl Acetamide (DMAC), stirred under nitrogen protection and ice-water bath until completely dissolved, added 5.88g 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) to the reaction system at one time, and iced The reaction was continued for 10 hours in a water bath, and after the reaction was completed, a slightly yellow and viscous polyamic acid solution (PAA3) was obtained; 11.00 g of the polyamic acid solution (PAA3) was mixed with 3.00 g of calcium oxide with a particle size of 160 nm to obtain a polyamic acid solution (PAA3). Amine paint3.

[0044] In the process of mixing and stirring, take an appropriate amount of polyimide coating 3 and evenly coat it on the polyimide film and the ceramic sheet, and then put it in an oven for c...

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Abstract

The invention discloses a polyimide coating with a functional material. The polyimide coating is prepared by mixing a polyamide acid solution and a functional inorganic filler, wherein the polyamide acid solution is formed by carrying out reaction polymerization on dianhydride and diamine in an organic solvent. The invention also discloses a method for preparing the functional polyimide material by coating a polyimide film with the polyimide coating which is provided with the functional material. Compared with a conventional adhesive, the polyimide coating disclosed by the invention has the advantages that when a coating or a bonding functional material is prepared on the surface of polyimide, the coating and the polyimide film have better adhesion strength, and meanwhile, the coating canbear a higher temperature reaching 400 DEG C or above. When adhesive force of the coating is tested by using a 3M600 adhesive tape, the falling area of the does not exceed 10%; and after the coating is subjected to a bending test, obvious wrinkles and cracks do not occur in most areas.

Description

technical field [0001] The invention relates to a polyimide coating with functional materials, and also relates to a method for preparing a functional polyimide material by using the polyimide coating, which belongs to the technical field of polymer membranes. Background technique [0002] Polyimide (PI) is an organic polymer material with excellent heat resistance, mechanical properties, low temperature resistance, dielectric properties, and radiation resistance. It is widely used in aviation, aerospace, micro Electronics, nanometer, liquid crystal, separation membrane, laser and other fields. The main application forms of polyimide are as follows: 1. Film; 2. Coating; 3. Advanced composite materials; 4. Engineering plastics; 5. Foam plastics; 6. Adhesives; . Photoresist; 9. Application in microelectronic devices. [0003] Thin film products are one of the earliest products of polyimide application. In addition to meeting the basic physical requirements of various product...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D179/08C09D7/61C08J7/04C08L79/08
CPCC09D179/08C09D7/61C08K2003/2241C08K2003/2206C08K2003/385C08K2003/085C08K2003/2272C08J2379/08C08J2479/08C08J7/0427C08K3/22C08K3/36C08K3/38C08K3/08C08K3/04
Inventor 王志飞贺祖茂赵红白林
Owner SOUTHEAST UNIV