A porous ceramic plate as well as a preparation method and application thereof

Abstract

The invention provides a porous ceramic plate as well as a preparation method and application thereof. The preparation method comprises the following steps: (a) preparing a plurality of ceramic raw materials which respectively comprise a surface layer ceramic raw material and a bottom layer ceramic raw material, wherein the average particle size of metal oxide contained in the surface layer ceramic raw material is less than or equal to 20 microns; (b) respectively carrying out forming steps on the ceramic raw materials to respectively obtain a plurality of green bodies formed by the ceramic raw materials; (c) stacking the green bodies to form a stacked layer, wherein the stacked layer comprises a green body formed by the surface layer ceramic raw materials and a green body formed by the bottom layer ceramic raw materials; carrying out a forming step on the laminated layer to obtain a formed laminated layer; and (d) sintering the formed laminated layer to obtain the porous ceramic plate, wherein the porous ceramic plate comprises a surface ceramic layer and a bottom ceramic layer which are laminated with each other, and the average pore diameter of the surface ceramic layer is smaller than that of the bottom ceramic layer.

Description

technical field [0001] The invention relates to a porous ceramic plate, especially a porous ceramic plate applied to a vacuum chuck for fixing a wafer or a work piece or a non-contact application device, a preparation method of the porous ceramic plate and an application of the porous ceramic plate. Background technique [0002] In the field of semiconductor manufacturing, in order to keep the wafer stable during the automatic transfer process of cleaning, dicing, grinding, etc., reduce wafer damage and improve the smoothness of the production line, vacuum chucks are currently the most common way to absorb wafers. How to make the suction surface of the suction cup have high flatness and improve the yield rate of the wafer manufacturing method has become a very important issue. Regarding the preparation method of the vacuum chuck, Japanese Patent Publication No. 2779968 Invention Patent discloses a preparation method of the vacuum chuck, which first forms a green body with ce...

AI Technical Summary

Problems solved by technology

Regarding the preparation method of the vacuum chuck, Japanese Patent Publication No. 2779968 Invention Patent discloses a preparation method of the vacuum chuck, which first forms a green body with ceramic raw materials and organic binders to form a chuck body, and then grinds the chuck The surface of the main body is smoothed, and then a ceramic film without pores is formed on the surface of the chuck main body by plasma chemical vapor deposition; although this preparation method can obtain a vacuum chuck with high flatness of the adsorption surface, the preparation method The procedure is cumbersome and the production cost is high, which is not conducive to commercial application

[0003] In addition, Japanese Patent Application Laid-Open No. 2002-373873 discloses a method for preparing ceramic substrate laminates, which uses ceramic raw materials and other components to form the required shape of each ceramic substrate by mechanical processing, and then burns them separately. Ceramic substrates are made, and then these ceramic substrates are surface treated and grooved, and then these ceramic substrates are bonded with inorganic adhesives to obtain the ceramic substrate laminate; however, the preparation process of this preparation method is cumbersome , consumes energy, and can cause delamination between ceramic substrates if the adhesive fails

[0004] Furthermore, Korean Patent Publication No. 101149350 Invention Patent discloses a preparation method of porous ceramic double-layers with different pore sizes, which first mixes the ceramic raw material powder and an organic binder and then performs the compression forming step of the support layer, and then heats A support layer with a relatively coarse pore diameter is sintered; a slurry mixed with another ceramic raw material powder and an organic binder is coated on one surface of the sintered support layer, and then heated and sintered to form the slurry with a relatively large diameter. Adsorption layer with small pore size to obtain double-layer porous ceramic layers with different pore sizes; The slurry will be filled into the pores of the sintered support layer, resulting in a difference in air resistance between the adsorption layer and the support layer. Therefore, the double-layer porous ceramic layer is used in non-contact applications including air-floating platforms, air-floating slide rails, and air-floating bearings. When using a transport system, its gas resistance still cannot meet the demand

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