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Antistatic polyacrylate pressure-sensitive adhesive and preparation method thereof

A polyacrylate, n-butyl acrylate technology, used in adhesives, conductive adhesives, ester copolymer adhesives, etc., can solve problems such as poor compatibility and poor transparency of protective films

Active Publication Date: 2019-11-08
HUBEI INST OF AEROSPACE CHEMOTECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This ion-conductive polymer structure has poor compatibility with oily acrylate resins, and the protective film made of it has poor transparency due to the difference in crystallization temperature of the pressure-sensitive adhesive layer in a low-temperature environment.

Method used

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  • Antistatic polyacrylate pressure-sensitive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An antistatic polyacrylate pressure-sensitive adhesive, which comprises the following material components by mass percentage:

[0027] Antistatic polymer resin: 3.0%~6.0%;

[0028] Polyacrylate pressure-sensitive adhesive: 55% to 60%;

[0029] Polyisocyanate curing agent: 1.0%~3.0%;

[0030] Ethyl acetate: 30% to 40%;

[0031] The antistatic polymer resin is mainly prepared from the following components in parts by mass: 60-80 parts of polyethylene glycol monomethyl ether methacrylate, 2-5 parts of 2-ethylhexyl acrylate, n-butyl acrylate 5-10 parts, 2-5 parts of hydroxypropyl methacrylate, 4-10 parts of sodium acrylate, 0.5-5 parts of sodium silicate, 3-5 parts of benzoyl peroxide; polyacrylate pressure sensitive adhesive is mainly composed of the following The components in parts by mass are prepared: 20-40 parts of 2-ethylhexyl acrylate, 5-10 parts of n-butyl acrylate, 3-5 parts of dodecyl methacrylate, 2 parts of hydroxyethyl methacrylate ~5 parts, 1-5 parts of a...

Embodiment 2

[0033] A preparation method of antistatic polyacrylate pressure-sensitive adhesive, comprising the following steps:

[0034] 1) Preparation of antistatic polymer resin:

[0035]Using the following components as raw materials, the antistatic polymer resin was prepared by random copolymerization by free radical polymerization process: polyethylene glycol monomethyl ether methacrylate: 73 parts, acrylic acid-2-ethylhexyl ester 4 parts , 5 parts of n-butyl acrylate, 5 parts of hydroxypropyl methacrylate, 5 parts of sodium acrylate, 4 parts of sodium silicate, and 4 parts of benzoyl peroxide.

[0036] Using absolute ethanol as a solvent, the polymerization reaction temperature is controlled at 80-85 DEG C, the reaction is refluxed for 5 hours, and the ethanol is evaporated under reduced pressure after cooling to obtain an antistatic polymer resin.

[0037] 2) Preparation of polyacrylate pressure-sensitive adhesive:

[0038] Using the following components as raw materials, a polya...

Embodiment 3

[0045] A preparation method of antistatic polyacrylate pressure-sensitive adhesive, comprising the following steps:

[0046] 1) Preparation of antistatic polymer resin:

[0047] Using the following components as raw materials, the antistatic polymer resin was prepared by random copolymerization by free radical polymerization process: polyethylene glycol monomethyl ether methacrylate: 80 parts, 2-ethylhexyl acrylate 2 parts , 8 parts of n-butyl acrylate, 2 parts of hydroxypropyl methacrylate, 4 parts of sodium acrylate, 0.5 parts of sodium silicate, and 5 parts of benzoyl peroxide.

[0048] Using n-butanol as a solvent, the polymerization reaction temperature is controlled at 80-85° C., the reaction is refluxed for 5 hours, and the n-butanol is evaporated under reduced pressure after cooling to obtain an antistatic polymer resin.

[0049] 2) Preparation of polyacrylate pressure-sensitive adhesive:

[0050] Using the following components as raw materials, a polyacrylate pressu...

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Abstract

The invention relates to an antistatic polyacrylate pressure-sensitive adhesive, which is composed of the following materials by mass percentage: 3%-6% of antistatic polymer resin, 55%-60% of a polyacrylate pressure-sensitive adhesive, 1%-3% of a polyisocyanate curing agent, and 30%-40% of ethyl acetate. The antistatic polymer resin endows polyacrylate pressure-sensitive adhesive with good antistatic performance and has good compatibility with polyacrylate pressure-sensitive adhesive, the antistatic polyacrylate pressure-sensitive adhesive can be used for preparation of high transparency and long-acting antistatic protective films, and can be widely applied to the processing protection and factory delivery protection of electronic materials.

Description

technical field [0001] The present invention generally relates to a polyacrylate pressure-sensitive adhesive and a preparation method thereof, in particular to an antistatic polyacrylate pressure-sensitive adhesive and a preparation method thereof. Background technique [0002] With the rapid development of electronic technologies such as mobile phones, computers and touch displays, the integration of electronic materials is getting higher and higher, microelectronics are becoming more and more sophisticated, and the sensitivity to static electricity is increasing, such as field effect transistors, chips, large-scale Integrated circuits and touch screens are becoming more and more sensitive to the hazards caused by static electricity. These electronic materials are required to be selected in the process of processing and using the surface resistivity of 10 in a low humidity environment. 10 Ω / □ or less, and antistatic protective film with long-term antistatic effect. Therefor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J151/08C09J11/06C09J11/04C09J9/02C08F283/06C08F220/18C08F220/20C08F220/06C08F220/54C08F222/20
CPCC08F220/18C08F283/065C08L2201/04C09J9/02C09J11/04C09J11/06C09J133/24C08L51/08C08K3/34C08K5/29C08F220/20C08F220/06
Inventor 张宏元胡露龚露露刘明珠谌能办王雪琴杨柱
Owner HUBEI INST OF AEROSPACE CHEMOTECHNOLOGY