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Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board

A resin composition and resin technology, applied in printed circuit, printed circuit manufacturing, printed circuit parts, etc., can solve the problems of low thermal expansion, high flexural modulus, warpage expansion, etc., and achieve low thermal expansion, bending mode excellent effect

Active Publication Date: 2019-11-26
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, multilayer printed circuit boards have a problem of warpage expansion, so low thermal expansion and high flexural modulus are required for resin compositions used as materials for insulating layers.

Method used

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  • Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
  • Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
  • Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board

Examples

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Embodiment

[0113] Hereinafter, synthesis examples, examples, and comparative examples are shown to further illustrate the present invention, but the present invention is not limited to these.

Synthetic example 1

[0114] (Synthesis Example 1) Synthesis of cyanate ester compound

[0115] 300 g of 1-naphthol aralkyl resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) (1.28 mol in OH group conversion) and 194.6 g (1.92 mol) of triethylamine (1.5 mol relative to 1 mol of hydroxyl group) were dissolved in dichloride 1,800 g of methane was used as solution 1. To 125.9 g (2.05 mol) of cyanogen chloride (1.6 mol relative to 1 mol of hydroxyl group), 293.8 g of methylene chloride, 194.5 g (1.92 mol) of 36% hydrochloric acid (1.5 mol relative to 1 mol of hydroxyl group), and 1205.9 g of water While keeping the liquid temperature at -2 to -0.5°C under stirring, the solution 1 was added dropwise over 30 minutes. After the completion of the dropwise addition of solution 1, after stirring for 30 minutes at the same temperature, a solution prepared by dissolving 65 g (0.64 mol) of triethylamine (0.5 mol relative to 1 mol of hydroxyl group) in 65 g of dichloromethane was added dropwise over...

Embodiment 1

[0117] 50 parts by mass of SNCN obtained in Synthesis Example 1, 50 parts by mass of epoxy resin represented by general formula (1) (YSLV-80DE, manufactured by Nippon Steel & Sumikin Chemical), and fused silica (SC2050MB, manufactured by Admatechs Company Limited) ) 100 parts by mass and 0.10 parts by mass of zinc octoate (manufactured by Nippon Chemical Industry Co., Ltd.) were mixed to obtain a varnish. The varnish was diluted with methyl ethyl ketone, impregnated and coated on an E glass woven cloth with a thickness of 0.1 mm, and heated and dried at 150° C. for 5 minutes to obtain a prepreg with a resin content of 50% by mass.

[0118] The 8 sheets of the obtained prepreg were stacked, and 12μm thick electrolytic copper foil (3EC-M3-VLP, manufactured by Mitsui Metals Co., Ltd.) was placed on top and bottom at a pressure of 30kgf / cm 2 , A temperature of 220°C for 120 minutes of lamination molding to obtain a metal-clad laminate with an insulating layer thickness of 0.8 mm. Usi...

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Abstract

A resin composition which contains an epoxy resin (A) represented by general formula (1) and a cyanic acid ester compound (B).

Description

Technical field [0001] The present invention relates to a resin composition, a prepreg, a metal-clad laminate and a resin sheet using the resin composition and the prepreg, and a printed circuit board using them. Background technique [0002] In recent years, the high integration and miniaturization of semiconductors widely used in electronic equipment, communications equipment, and personal computers have been accelerating. Along with this, the characteristics required for the laminated board for a semiconductor package used in a printed circuit board have become stricter. As the required characteristics, for example, low water absorption, moisture absorption heat resistance, flame retardancy, low relative permittivity, low dielectric loss tangent, low coefficient of thermal expansion, heat resistance, chemical resistance, High plating peel strength and other characteristics. However, so far, these required characteristics may not be met. [0003] Conventionally, as resins for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/24B32B15/08C08G59/40C08G73/00C08J5/24C08K3/013C08L63/00H05K1/03
CPCB32B15/08C08G59/24C08G59/40C08G73/00C08K3/013C08L63/00H05K1/03C08G59/4014C08G59/245C08G59/226C08J5/244C08J5/249C08L79/04C08G59/4028C08L101/00H05K1/0366H05K1/0373H05K3/4652H01L21/4857H01L23/145H01L23/49822C08J2363/00
Inventor 古贺将太中住宜洋高野健太郎
Owner MITSUBISHI GAS CHEM CO INC