Method for preparing smooth dense silver-coated copper powder through chemical plating method

A technology of silver-coated copper powder and chemical plating, which is applied in liquid chemical plating, transportation and packaging, metal processing equipment, etc. , easy to mass production, small grain effect

Active Publication Date: 2019-12-10
SHANGHAI JIAO TONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Chinese patent CN110170650A discloses a method for preparing high-density and completely coated silver-coated copper powder, in which water and surfactant are dispersed into copper nano-powder suspension in the copper powder after pickling; Adding a complexing agent and a stabilizer to obtain a silver complex solution; modifying the copper nanopowder suspension and the silver complex solution to acidity; mixing the above acidic solutions to obtain a silver-coated copper nanoparticle suspension, which is , washed with water, and dried to obtain silver-coated copper nanopowder, but the particle size of the nanopowder obtained by this patent is relatively large, and the coating layer of silver powder is not smooth enough

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  • Method for preparing smooth dense silver-coated copper powder through chemical plating method

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Embodiment 1

[0034] A method for preparing smooth and dense silver-clad copper powder by electroless plating, adopts the following steps:

[0035] (1) Take 15g of copper powder with an average particle size of about 100nm, add it to 2g / L sodium hydroxide solution, remove surface organic matter, and then wash the copper powder with deionized water until neutral. Add the above-mentioned copper powder into 300 ml of deionized water, and then add 5.2 g of dispersant to the above-mentioned deionized water, and ultrasonically disperse to form a copper nano-powder suspension. The dispersant that can be selected is one or more of gum arabic, gelatin, isinglass or polypeptide, and the dispersant selected in this embodiment is gum arabic.

[0036] (2) Get 11.4g silver nitrate and join in 300ml aqueous solution, add complexing agent in above-mentioned solution, prepare silver complexing solution, the complexing agent that can select for use is thiourea, thiosemicarbazide, sodium thiosulfate, ammoniac...

Embodiment 2

[0039] A method for preparing smooth and dense silver-clad copper powder by electroless plating, adopts the following steps:

[0040] (1) Take 15g of copper powder with an average particle size of about 100nm, add it to 2g / L sodium hydroxide solution, remove surface organic matter, and then wash the copper powder with deionized water until neutral. Add the above-mentioned copper powder into 1500ml deionized water, then add 20g of polyvinyl alcohol into the above-mentioned deionized water, and ultrasonically disperse to form a copper nano powder suspension.

[0041] (2) Add 7.4g of silver nitrate to 1200ml of aqueous solution, add ammonia and EDTA to the above solution to prepare a silver complex solution, and the molar mass ratio of complexing agent to silver nitrate is 1:1.

[0042] (3) Mix the above solutions, then add 150ml of glucose solution and 300ml of nano-silver suspension in sequence, the molar ratio of reducing agent to silver complex is 1:1; the concentration of na...

Embodiment 3

[0044] A method for preparing smooth and dense silver-clad copper powder by electroless plating, adopts the following steps:

[0045] (1) Take 15g of copper powder with an average particle size of about 100nm, add it to 2g / L sodium hydroxide solution, remove surface organic matter, and then wash the copper powder with deionized water until neutral. Add the above-mentioned copper powder to 3000ml deionized water, then add 25g of polyvinyl alcohol and 10g of gelatin to the above-mentioned deionized water, and ultrasonically disperse to form a copper nano powder suspension.

[0046] (2) Add 0.3g of silver nitrate to 2000ml of aqueous solution, add sodium thiosulfate to the above solution to prepare a silver complex solution, the molar mass ratio of complexing agent to silver nitrate is 2:1.

[0047] (3) Mix the above solutions, then add 150ml ascorbic acid and formaldehyde solution and 300ml nano-silver suspension in sequence, the molar ratio of reducing agent to silver complex i...

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Abstract

The invention relates to a method for preparing smooth dense silver-coated copper powder through a chemical plating method. The preparing method comprises the following steps that deionized water anda dispersing agent are added into activated copper powder to obtain a copper nano-particle suspension liquid; a complexing agent is added into a silver nitrate water solution to prepare a silver complexing solution; and the above solutions are mixed, a reducing agent solution and a nano-silver suspension liquid are sequentially added, stirring is carried out at room temperature to obtain a silver-coated copper nanoparticle suspension liquid, and standing, washing and drying are carried out to obtain the smooth dense silver-coated copper powder. Compared with the prior art, nano-silver particles are added into a plating solution, so that the obtained silver-coated copper powder is dense in coating, smooth and non-porous in surface, excellent in conductivity and oxidation resistance, and extremely high in application value in the electronic slurry industry.

Description

technical field [0001] The invention belongs to the field of powder surface treatment, and in particular relates to a method for preparing smooth and dense silver-coated copper powder by electroless plating. Background technique [0002] Silver powder is a conductive filler widely used in the electronic paste industry, but the cost of silver powder is relatively high. Copper metal is relatively cheap, and its electrical properties are second only to silver, but because copper is not resistant to high temperature, it is easy to oxidize, thus forming an oxide film on its surface, which greatly reduces its electrical conductivity, making its application restricted. Silver-coated copper powder is to wrap a layer of silver metal on the surface of copper particles to form a core-shell structure. This can not only reduce production costs, but also has good oxidation resistance and stable electrical conductivity, and is an ideal substitute for silver powder. [0003] At present, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44B22F1/02
CPCC23C18/44C23C18/1803B22F1/17
Inventor 胡晓斌洪立芝
Owner SHANGHAI JIAO TONG UNIV
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