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A kind of preparation method of composite material for flexible circuit board

A flexible circuit board, composite material technology, applied in circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problems of limited application, limited dielectric performance, poor thermal performance, etc., to achieve excellent dielectric performance, achieve Design and processing requirements, the effect that is conducive to processing and application

Active Publication Date: 2022-02-15
KUNSHAN BRANCH INST OF MICROELECTRONICS OF CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] To achieve the flexible requirements of substrate materials, organic materials with high elasticity need to be selected, but these materials usually have poor thermal properties and limited dielectric properties, which limit their applications.

Method used

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  • A kind of preparation method of composite material for flexible circuit board
  • A kind of preparation method of composite material for flexible circuit board
  • A kind of preparation method of composite material for flexible circuit board

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Experimental program
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preparation example Construction

[0029] The invention provides a method for preparing a composite material for a flexible circuit board, comprising:

[0030] A) Whisker Ba 2 Ti 9 o 20 Powder, silica gel and solvent are mixed and dried to obtain a mixture;

[0031] B) compressing and crushing the mixture to obtain composite particles; ball milling and drying the composite particles to obtain powder particles;

[0032] C) Pressing and sintering the powder particles to obtain a composite material for a flexible circuit board.

[0033] Whisker: refers to a fiber that is formed naturally or grown in the form of a single crystal under artificially controlled conditions (main form), its diameter is very small (micron order), and does not contain defects (grain boundaries, dislocations) that usually exist in materials , holes, etc.), its atomic arrangement is highly ordered, so its strength is close to the theoretical value of a complete crystal.

[0034] Preparation of flexible substrate materials Mix ceramic p...

Embodiment 1

[0061] Weigh TiCl4 and KOH as mineralizers, put them in a glass beaker with distilled water, adjust the concentration of Ti ion solution to 0.1-1mol / L, and stir for 30min under a magnetic stirrer, during which the pH of the solution is controlled at 12-14; Place the obtained mixed solution in an ultrasonic wave and vibrate for 1 hour to disperse the powder evenly in the solution; place the solution after ultrasonic vibrating in a 150ml high-pressure reaction kettle, the filling rate of the solution is 50-90%, and the reaction temperature is 140- 180°C, the reaction time is 4-8h; finally, the obtained mixed solution is separated in an ion separator to obtain nano-whisker Ti0 2 .

[0062] The above obtained Ti0 2 with Ba(OH) 2 Carry out hydrothermal reaction, carry out proportioning according to molar ratio Ti:Ba is 5:1, put the obtained mixed solution in the autoclave, the solution filling ratio is 80%, hydrothermal reaction temperature is 140-200 ℃, hydrothermal The reactio...

Embodiment 2～6

[0067] According to the method disclosed in Example 1, silica gel, whisker Ba 2 Ti 9 o 20 Powder, as embodiment 2~embodiment 6, such as figure 1 as shown, figure 1 is the relationship curve of the dielectric constant εr of the filled composite material with different whisker-like PTEF fillings, where 1 is the dielectric constant curve, and 2 is the resonant frequency temperature coefficient curve, from figure 1 It can be shown that with the increase of the amount of PTEF added, Ba 2 Ti 9 o 20The dielectric constant of ceramics increases continuously. With the addition of PTEF, it increases from 0 to 0.5, the εr of the composite material increases to 3.28, and the temperature coefficient of resonant frequency increases to 62ppm / ℃, indicating that compared with particles, whiskers can further improve the composite material. The dielectric properties of the material. At the same time, after PTEF is combined with the whisker material, in the two-phase system, the overlap bet...

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Abstract

The invention provides a kind of preparation method of composite material for flexible circuit board, comprising: A) whisker shape Ba 2 Ti 9 o 20 The powder, silica gel and solvent are mixed, dried to obtain the mixture; B) the mixture is pressed and crushed to obtain composite particles; the composite particles are ball-milled and dried to obtain powder particles; C) the powder is The pellets are pressed into shape and sintered to obtain a composite material for a flexible circuit board. In the present invention, the whisker-like Ba 2 Ti 9 o 20 Powder and silica gel are compounded to prepare flexible substrate materials, which combines the easy processability of polymers with the excellent dielectric and thermal properties of ceramics, and can better meet the design and processing requirements of circuit components. At the same time, the use of whiskers instead of other ceramic powders can better provide dielectric properties such as flexible substrate materials, bending strength and elastic modulus, and is more conducive to the processing and application of flexible components.

Description

technical field [0001] The invention relates to the field of material technology, in particular to a preparation method of a composite material for a flexible circuit board. Background technique [0002] Ba 2 Ti 9 o 20 It is an important ferroelectric and piezoelectric ceramic material. It is the basic raw material for the production of multilayer ceramic capacitors (MLLC) and thermistors (PTCR). It has excellent dielectric properties (εr=46, Q×f =83700GHz, τf=-56×10-6 / °C) is widely used in many fields such as mobile communication, satellite TV broadcast communication, radar, satellite positioning and navigation system with frequency in the range of 300MHz ~ 40GHz. Ba 2 Ti 9 o 20 Microwave circuit substrate material is an important product in electronic technology, mainly used in mobile phones, power amplifiers, frequency converters, various combined antennas and digital circuits. Traditionally commonly used microwave circuit substrate materials are mostly ceramic mat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B28/24H05K1/03
CPCC04B28/24H05K1/0393C04B2201/50C04B14/383
Inventor 杜勇梁晓新田卡何霜霜
Owner KUNSHAN BRANCH INST OF MICROELECTRONICS OF CHINESE ACADEMY OF SCI
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