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Preparation method of nickel aminosulfonate solution

A technology of nickel sulfamate and sulfamic acid, which is applied in the field of preparation of nickel sulfamate solution, can solve the problems of large internal stress of the coating, unqualified products, unfriendly environment, etc., and achieves small voltage fluctuations and production process flow Short, the effect of reducing production costs

Inactive Publication Date: 2020-01-24
深圳市臻鼎环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Method (3) The trace extractant remaining in the nickel sulfamate solution prepared by the extraction method is difficult to remove, and a large amount of activated carbon is required for adsorption treatment. In addition, the waste water produced by saponification is also very large, and the environment is not friendly. These three The nickel sulfamate prepared by the method has a relatively high frequency of quality accidents in the application of nickel plating on diamond cutting wires (because the organic matter exceeds the standard, the sulfate, etc. exceed the standard and cause the internal stress of the coating to be large so that the product is unqualified)

Method used

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  • Preparation method of nickel aminosulfonate solution
  • Preparation method of nickel aminosulfonate solution

Examples

Experimental program
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Embodiment 1

[0026] A preparation method of nickel sulfamic acid solution, comprising the following steps:

[0027] S1. Preparation of acidic nickel solution: prepare an acidic nickel solution containing nickel ions with a weight fraction of 8wt% in the first dosing tank;

[0028] S2. the preparation of nickel plate: then the acidic nickel solution prepared described in step S1 is dropped into the first diaphragm electrolyzer, the anode of the first diaphragm electrolyzer described is a titanium plate, and the negative electrode is a nickel plate with a thickness of 3mm. Adopt ion-exchange membrane to separate between the negative and positive electrodes of the first diaphragm electrolyzer described above, then carry out electrolytic deposition for the first time, stop electrolysis after making the thickness of the nickel plate of negative electrode increase to 20mm, then described thickness is 20mm The nickel plate is cleaned and set aside;

[0029] S3. The preparation of sulfamic acid s...

Embodiment 2

[0038] A preparation method of nickel sulfamic acid solution, comprising the following steps:

[0039] S1. Preparation of acidic nickel solution: prepare an acidic nickel solution containing nickel ions with a weight fraction of 5wt% in the first dosing tank;

[0040] S2. the preparation of nickel plate: then the acidic nickel solution prepared described in step S1 is dropped into the first diaphragm electrolyzer, the anode of the first diaphragm electrolyzer is a titanium plate, and the negative electrode is a nickel plate with a thickness of 2mm. Adopt ion-exchange membrane to separate between the positive and negative electrodes of the first diaphragm electrolyzer described above, then carry out electrolytic deposition for the first time, stop electrolysis after making the thickness of the nickel plate of negative electrode increase to 10mm, then described thickness is 10mm The nickel plate is cleaned and set aside;

[0041] S3. Preparation of sulfamic acid solution: prepa...

Embodiment 3

[0050] A kind of preparation method of nickel sulfamate solution comprises the following steps:

[0051] S1. Preparation of acidic nickel solution: prepare an acidic nickel solution containing nickel ions with a weight fraction of 3wt% in the first dosing tank;

[0052] S2. the preparation of nickel plate: then the acidic nickel solution prepared described in step S1 is dropped into the first diaphragm electrolyzer, the anode of the first diaphragm electrolyzer is a titanium plate, and the negative electrode is a nickel plate with a thickness of 2mm. The cathode and anode electrodes of the first diaphragm electrolyzer are separated by an ion exchange membrane, and then the first electrolytic deposition is carried out, so that the thickness of the nickel plate of the cathode is increased to 8mm and then the electrolysis is stopped, and then the thickness is 8mm. The nickel plate is cleaned and set aside;

[0053] S3. Preparation of sulfamic acid solution: prepare a sulfamic ac...

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Abstract

A preparation method of a nickel aminosulfonate solution is characterized in that industrial-grade nickel sulfate or nickel chloride used as a raw material undergoes an electrolytic deposition technology to prepare a high-purity electrolytic nickel plate, the high-purity nickel plate is used as an anode plate in the preparation of nickel aminosulfonate by a second diaphragm electrolysis technology, solid sulfamic acid is regularly supplemented in a cathode area in the electrolysis process to make the fluctuation amplitude of the cell voltage in the whole electrolysis process be very small andno side reactions occur, and an ionic membrane adopts an anionic heterogeneous exchange membrane to make the sulfamic acid permeate through the ionic membrane and enter the anode area, so smooth proceeding of an electrochemical reaction is carried out, the sulfate content of the nickel aminosulfonate solution obtained through electrolysis is low, no organic matters are residual, and no sodium ionsare introduced. The product prepared in the invention has a high purity, the production process is environmentally friendly, the production cost is low, and the method is a preparation method of thenickel aminosulfonate solution for electroplating the diamond deserves to be promoted.

Description

technical field [0001] The invention belongs to the field of preparation methods of nickel salts, and in particular relates to a preparation method of nickel sulfamate solution. Background technique [0002] With the formulation and implementation of the national new energy strategic plan, the development and utilization of solar energy has become more and more important. In 2017, the annual installed capacity of the global photovoltaic market is expected to exceed 100GW for the first time, with an annual growth rate of more than 25%. Among them, China ranks the market leader with an installed capacity of about 50GW, and the demand for large-area silicon wafers for photovoltaic power generation continues to increase. Due to the maturity of semiconductor manufacturing technology, the manufacturing cost of other aspects of silicon wafers continues to decline, but the cutting cost of silicon wafers for solar cells has always been high, accounting for about 30% of the total manu...

Claims

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Application Information

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IPC IPC(8): C25B1/00C25C1/08C25B9/10C25C7/04C25B9/23
CPCC25B1/00C25C1/08C25C7/04C25B9/23
Inventor 张广柱朱识芝邓景永
Owner 深圳市臻鼎环保科技有限公司
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