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Preparation method of microencapsulated fast curing agent for epoxy resin

An epoxy resin, rapid curing technology, applied in the direction of microcapsule preparation, microsphere preparation, etc., can solve the problems of complex preparation process, the wall material of the microcapsule curing agent is easy to rupture in advance, etc., achieves simple operation, solves rapid curing, The effect of increased shelf life at room temperature

Inactive Publication Date: 2020-02-14
肇庆市海特复合材料技术研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that the microcapsule type curing agent prepared by the existing method has a complicated preparation process and the wall material of the microcapsule curing agent is easy to break in advance, and to provide a microcapsule type fast curing agent for epoxy resin Preparation

Method used

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Examples

Experimental program
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Effect test

specific Embodiment approach 1

[0020] Specific embodiment one: present embodiment is a kind of preparation method for the microcapsule type fast curing agent of epoxy resin, and it realizes according to the following steps:

[0021] 1. Ultrasonic disperse active curing agent, PS (thermoplastic high polymer polystyrene) and methylene chloride until an oil phase solution is formed;

[0022] 2. Dissolve the hydrophilic dispersant in water to make an aqueous solution;

[0023] 3. Stir the oil phase solution obtained in step 1 and the aqueous phase solution obtained in step 2 in a high-speed homogenizer to form an oil-in-water emulsion;

[0024] 4. Add the above oil-in-water emulsion to 1wt% SDS (sodium dodecyl sulfate) aqueous solution, stir and heat up to 40°C to form microcapsule precipitation, then perform suction filtration, and place the precipitate after suction filtration for vacuum drying After drying, the microcapsule type fast curing agent for epoxy resin can be obtained;

[0025] Wherein the active...

specific Embodiment approach 2

[0030] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the mass volume ratio of active curing agent, PS (thermoplastic high polymer polystyrene) and dichloromethane described in step one is (0.5~5) :1:(0.038~0.189). Others are the same as in the first embodiment.

specific Embodiment approach 3

[0031] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the rotational speed of the ultrasonic dispersion in Step 1 is 10000-15000 r / min. Others are the same as in the first or second embodiment.

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Abstract

The invention discloses a preparation method of a microencapsulated fast curing agent for epoxy resin, and belongs to the field of curing agent preparation. According to the preparation method, the problems that a microencapsulated curing agent prepared by an existing method is complex in preparation process, and the wall material of the microencapsulated curing agent is prone to cracking in advance are solved. The preparation method comprises the steps that an active curing agent, PS and dichloromethane are prepared into an oil phase solution; a water phase solution is prepared; an oil-in-water emulsion is prepared; and a microcapsule precipitate is prepared, and the microencapsulated fast curing agent is obtained after filtering and drying. According to the preparation method, the evaporation of a microencapsulated solvent is achieved through a physical method, and operation is simple; the PS with good affinity with the epoxy resin is used for preparing a microcapsule, the decomposition or volatilization of the active curing agent in advance in the storage process of the epoxy resin can be effectively avoided, thus the room temperature storage period of an epoxy resin-typed pregreg is greatly prolonged, fast curing is achieved, the mechanical properties of epoxy resin products cannot be reduced, the vitrification transformation temperature of the PS is 100 DEG C, and the storage property of the microcapsule is good at room temperature. The preparation method is suitable for the fast curing agent of the epoxy resin.

Description

technical field [0001] The invention belongs to the field of curing agent preparation, and in particular relates to a preparation method of a microcapsule type fast curing agent for epoxy resin. Background technique [0002] Epoxy resin is a typical thermosetting resin. It contains more than two epoxy groups in its molecular chain. It is in a viscous liquid state at room temperature. When it interacts with a curing agent, it will solidify and cross-link into a three-dimensional network-like macromolecular structure. Epoxy resin has excellent mechanical, physical properties, good chemical stability, low molding shrinkage, and good dimensional stability, so it has been widely used in electronic packaging, construction and aerospace, automotive and other fields. In industrial production, epoxy resin needs to be stored separately from the curing agent, and then reconstituted when used, stirred evenly and then cured, which greatly reduces the efficiency of producing epoxy resin p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50B01J13/02
CPCC08G59/188C08G59/5073C08G59/5006B01J13/02
Inventor 徐忠海赫晓东蔡朝灿白玉娇王荣国刘文博董旭伦
Owner 肇庆市海特复合材料技术研究院
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